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Market Research Report
Product code 
1033646

Ericsson, 5G NR Digital BBU, Model ERS Baseband 6648, KDU 137 0015/11

Published: | EJL Wireless Research | 64 Pages, 61 Exhibits, 13 Tables | Delivery time: 1-2 business days

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Ericsson, 5G NR Digital BBU, Model ERS Baseband 6648, KDU 137 0015/11
Published: October 25, 2021
EJL Wireless Research
Content info: 64 Pages, 61 Exhibits, 13 Tables
Delivery time: 1-2 business days
  • Description
  • Table of Contents
  • List of Tables

This report provides a comprehensive analysis for the Ericsson Baseband 6648 system. This product is a 5G NR digital baseband unit and supports single mode LTE, single mode 5G NR, and mixed mode LTE+5G NR.

Features:

  • System Functional Description
  • System Level Block Diagrams
  • High Level Mechanical Analysis
    • Heat Sink
    • Heat Fins
  • High Level PCB Analysis
  • Component Diagrams
    • Semiconductor/component locations on PCB
  • High Level Bill of Materials
    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
    • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
    • Complete Part Number/Marking
    • Component Manufacturer Identification
    • Function Component Description
    • Package Type
  • Excludes analysis of passive chip resistors, capacitors, and inductors
  • Total Pages: 64
  • Total Exhibits: 61
  • Total Tables: 13
Product Code: DNA-I-2021-005/DNA-I-2021-005E

TABLE OF CONTENTS

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: ERICSSON 5G BBU

  • Overview of Baseband Unit

CHAPTER 2: MECHANICAL ANALYSIS

  • Chassis-Top Cover
  • Chassis/ Heat Sink
  • Plastic Bottom Cover

CHAPTER 3: FAN TRAY UNIT

  • Fan Unit

CHAPTER 4: BASEBAND 6648 PCB

  • Main PCB
  • Main PCB Top Active Component Analysis
  • Main PCB Top Passive Component Analysis
  • Main PCB Bottom Active Component Analysis
  • Main PCB Bottom Passive Component Analysis
  • Auxiliary PCB

CHAPTER 5: SOC HEAT SINKS

  • L1 Modem/Fronthaul Heat Sink
  • L2/L2 Processor Heat Sink

APPENDIX A: COMPONENT ANALYSIS

APPENDIX B: COMPONENTS BY SYSTEM AREA

APPENDIX C: ACTIVE COMPONENTS BY SUPPLIER

APPENDIX D: PASSIVE COMPONENTS BY SUPPLIER

List of Tables

  • Table 1: Environmental Data
  • Table 2: DC Power Supply Requirements
  • Table 3: Power Consumption
  • Table 4: Main PCB Top Active Bill of Materials
  • Table 5: Main PCB Top Active Bill of Materials (con't)
  • Table 6: Main PCB Top Passive Only Bill of Materials
  • Table 7: Main PCB Bottom Active Bill of Materials
  • Table 8: Main PCB Bottom Passive Only Bill of Materials
  • Table 9: Auxiliary PCB Top Component Bill of Materials
  • Table 10: Auxiliary PCB Bottom Component Bill of Materials
  • Table 11: Baseband 6648 System Unit PCB by Component Type
  • Table 12: Baseband 6648 System Unit PCBs by Active Component Vendor
  • Table 13: Baseband 6648 System Unit PCBs by Passive/Connector/Other Component Vendor

List of Exhibits:

  • Exhibit 1: Simplified Block Diagram of Baseband System
  • Exhibit 2: Ericsson 5G NR BBU Solution Example
  • Exhibit 3: Baseband 6648 Hardware Architecture Block Diagram
  • Exhibit 4: Baseband 6648, Front View
  • Exhibit 5: Baseband 6648, Rear View with Fan Tray
  • Exhibit 6: Baseband 6648, Rear View without Fan Tray
  • Exhibit 7: Baseband 6648, Top View
  • Exhibit 8: Baseband 6648, Bottom View
  • Exhibit 9: Baseband 6648, Left Side View
  • Exhibit 10: Baseband 6648, Right Side View
  • Exhibit 11: Chassis Top Cover, Front Panel
  • Exhibit 12: Chassis Top Cover, External View
  • Exhibit 13: Chassis Top Cover, Internal View
  • Exhibit 14: Chassis/Heat Sink, External View
  • Exhibit 15: Chassis/Heat Sink, Internal View, Mechanical
  • Exhibit 16: Chassis/Heat Sink, Internal View, Thermal
  • Exhibit 17: Chassis/Heat Sink, External View, Front
  • Exhibit 18: Chassis/Heat Sink, External View, Rear
  • Exhibit 19: Chassis/Heat Sink, Right Side View
  • Exhibit 20: Chassis/Heat Sink, Left Side View
  • Exhibit 21: Chassis/Heat Sink, Heat Transfer Fin Dimensions
  • Exhibit 22: Chassis/Heat Sink, Heat Transfer Fin Types
  • Exhibit 23: Chassis/Heat Sink, Heat Transfer Fin Type Details
  • Exhibit 24: Chassis/Heat Sink, Fan Tray Locking Clips
  • Exhibit 25: Plastic Bottom Cover, Front View
  • Exhibit 26: Plastic Bottom Cover, External View
  • Exhibit 27: Plastic Bottom Cover, Internal View
  • Exhibit 28: Fan Tray Supplier Product Label
  • Exhibit 29: Fan Tray External View
  • Exhibit 30: Fan Tray Internal View
  • Exhibit 31: Fan Tray Top View
  • Exhibit 32: Fan Tray Bottom View
  • Exhibit 33: Fan Tray Side View
  • Exhibit 34: Fan Tray, Major Components
  • Exhibit 35: PCB Top View
  • Exhibit 36: PCB Bottom View
  • Exhibit 37: Fan Unit Marking
  • Exhibit 38: Fan Unit Wiring Harness
  • Exhibit 39: Fan Unit Material Type
  • Exhibit 40: Fan Unit Foam Spacer
  • Exhibit 41: Fan Unit Mounting Location
  • Exhibit 42: Fan Tray DC Power Connector
  • Exhibit 43: DC Power Connector Supplier Part Number
  • Exhibit 44: Baseband 6648 PCB, Top (Left) and Bottom (Right) Views
  • Exhibit 45: Main PCB Top Active Component Diagram
  • Exhibit 46: Main PCB Top Passive Only Component Diagram
  • Exhibit 47: Main PCB Bottom Active Component Diagram
  • Exhibit 48: Main PCB Bottom Passive Only Component Diagram
  • Exhibit 49: Baseband LED Status Indicator Lights
  • Exhibit 50: Auxiliary PCB, Top Component Diagram
  • Exhibit 51: Auxiliary PCB, Bottom Component Diagram
  • Exhibit 52: Main PCB-Auxiliary PCB Connector
  • Exhibit 53: L1 Modem/Fronthaul Heat Sink, External View
  • Exhibit 54: L1 Modem/Fronthaul Heat Sink, Internal View
  • Exhibit 55: L2/L2 Processor Heat Sink, External View
  • Exhibit 56: L2/L2 Processor Heat Sink, Internal View
  • Exhibit 57: Component Market Share by Type
  • Exhibit 58: Active Semiconductor Market Share by Vendor
  • Exhibit 59: Active Semiconductor Market Share by Vendor, 64+ Pin
  • Exhibit 60: Passive/Connector/Other Component Market Share by Vendor
  • Exhibit 61: Passive/Connector/Other Component Market Share by Country of Origin