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PUBLISHER: EJL Wireless Research | PRODUCT CODE: 1101098

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PUBLISHER: EJL Wireless Research | PRODUCT CODE: 1101098

Samsung Electronics Co., Ltd. 5G NR Digital BBU CDU50

PUBLISHED:
PAGES: 135 Pages, 138 Exhibits, 22 Tables
DELIVERY TIME: 1-2 business days
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This report provides a comprehensive analysis for the Samsung Electronics CDU50 system. This product is a 5G NR digital baseband unit and supports the distributed unit (DU) and centralized unit (CU) functions of a 5G NR gNodeB.

Features

  • System Functional Description
  • System Level Block Diagrams
  • High Level Mechanical Analysis
    • Heat Sink
    • Heat Fins
  • High Level PCB Analysis
  • Component Diagrams
    • Semiconductor/component locations on PCB
  • High Level Bill of Materials
    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
    • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
    • Complete Part Number/Marking
    • Component Manufacturer Identification
    • Function Component Description
    • Package Type
  • Excludes analysis of passive chip resistors, capacitors, and inductors
  • Total Pages: 135
  • Total Exhibits: 138
  • Total Tables: 22
Product Code: DNA-I-2022-001/ DNA-I-2022-001E

TABLE OF CONTENTS

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: SAMSUNG 5G CDU

  • Overview of Baseband Unit

CHAPTER 2: MECHANICAL ANALYSIS

  • Chassis Frame (SHELF)
  • Chassis Frame Back Cover
  • Air Filter Unit
  • DC Power Busbar Unit

CHAPTER 3: FAN UNIT

  • Individual Fan Unit

CHAPTER 4: POWER/SIGNAL BACKPLANE DISTRIBUTION PCB (UCDB)

CHAPTER 5: GMA1-A1A MANAGEMENT CARD

  • Plastic Shield
  • Front Panel
  • GMA1-A1A PCB
  • GMA1-A1A PCB Top Active Component Analysis
  • GMA1-A1A PCB Top Passive Component Analysis
  • GMA1-A1A PCB Bottom Active Component Analysis
  • GMA1-A1A PCB Bottom Passive Component Analysis

CHAPTER 6: GCB1-C1A CHANNEL MODEM PCB

  • GCB1-C1A Plastic Shield
  • Front Panel
  • GCB1-C1A PCB
  • GCB1-C1A PCB Top Active Component Analysis
  • GCB1-C1A PCB Top Passive Component Analysis
  • GCB1-C1A PCB Bottom Active Component Analysis
  • GCB1-C1A PCB Bottom Passive Component Analysis

CHAPTER 7: GMA1-A1A IC HEAT SINKS

CHAPTER 8: GCB1-C1A IC HEAT SINKS

  • APPENDIX A: COMPONENT ANALYSIS
  • APPENDIX B: COMPONENTS BY SYSTEM AREA
  • APPENDIX C: ACTIVE COMPONENTS BY SUPPLIER
  • APPENDIX D: PASSIVE COMPONENTS BY SUPPLIER

TABLES

  • Table 1: Environmental Data
  • Table 2: DC Power Supply Requirements
  • Table 3: Power Consumption
  • Table 4: FANM-C4N Bill of Materials
  • Table 5: Fan Unit Controller PCB Top, Bill of Materials
  • Table 6: Fan Unit Controller PCB Bottom, Bill of Materials
  • Table 7: Fan Unit DC Connector Pinout
  • Table 8: UCDB PCB, Top Bill of Materials
  • Table 9: UCDB PCB, Bottom Bill of Materials
  • Table 10: GMA1-A1A Interface Port Functions
  • Table 11: GMA1-A1A PCB Top Active Bill of Materials
  • Table 12: GMA1-A1A PCB Top Active Bill of Materials (cont.)
  • Table 13: GMA1-A1A PCB Top Passive Only Bill of Materials
  • Table 14: GMA1-A1A PCB Bottom Passive Only Bill of Materials
  • Table 15: GCB1-C1A Interface Port Functions
  • Table 16: GCB1-C1A PCB Top Active Bill of Materials
  • Table 17: GCB1-C1A PCB Top Active Bill of Materials (cont.)
  • Table 18: GCB1-C1A PCB Top Passive Only Bill of Materials
  • Table 19: GCB1-C1A PCB Bottom Passive Only Bill of Materials
  • Table 20: CDU50 System Unit PCBs by Component Type
  • Table 21: CDU50 System Unit PCBs by Active Component Vendor
  • Table 22: CDU50 System Unit PCBs by Passive/Connector/Other Component Vendor
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