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Market Research Report

Nokia GSM/UMTS/LTE Flexi MultiRadio 10 Baseband Capacity Expansion Unit

Published by EJL Wireless Research Product code 514589
Published Content info 36 Pages, 9 Tables, 26 Exhibits
Delivery time: 1-2 business days
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Nokia GSM/UMTS/LTE Flexi MultiRadio 10 Baseband Capacity Expansion Unit
Published: June 8, 2017 Content info: 36 Pages, 9 Tables, 26 Exhibits
Description

This report covers the design analysis of a Nokia FBBC GSM/UMTS/FDD LTE Flexi Multiradio 10 Base Station Capacity Expansion Unit. This unit is part of the Flexi Multiradio 10 FSMF base station system. The unit was manufactured in Q3 of 2014.

Key Findings:

  • New Flexi Signal Processing Architecture
  • New Advanced Switching Architecture
  • Advanced 2nd Generation Nokia ASIC for OBSAI/CPRI Fronthaul Link
  • Advanced power management for ASIC, DSPs, Network Processor and FPGAs

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Cavium, Fairchild Semiconductor, Integrated Device Technology, Kemet, NXP Semiconductors, Panasonic, Pulse Electronics, SK hynix, STMicroelectronics, Tatien, TDK-Epcos, Texas Instruments, Vishay Semiconductors, and Xilinx.

Features

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
Table of Contents
Product Code: DNA-I- 2017-002

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: NOKIA FLEXI MULTIRADIO 10 SYSTEM

  • Overview of Flexi Multiradio 10

CHAPTER 2: FBBC MECHANICAL ANALYSIS

  • Mechanical Analysis
  • FBBC Core Lid
  • FBBC Core Chassis

CHAPTER 3: FBBC PCB

  • Area A Analysis
  • Area B Analysis
  • Area C Analysis
  • Area D Analysis

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: FBBC PCB Top Area A Bill of Materials
  • Table 2: FBBC PCB Top Area B Bill of Materials
  • Table 3: FBBC PCB Top Area B Passives Bill of Materials
  • Table 4: FBBC PCB Bottom Area C Bill of Materials
  • Table 5: FBBC PCB Bottom Area D Bill of Materials
  • Table 6: Passive Component Case Size Distribution by System Subsection
  • Table 7: Identified Passive Component Supplier Distribution by System Subsection
  • Table 8: Active/Passive Component Distribution by System Subsection
  • Table 9: Active Semiconductor/Component Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: Flexi Multiradio 10 FSMF Site Solution Example
  • Exhibit 2: Nokia FSMF with FBBx, FTIF, FPFD Modules
  • Exhibit 3: Nokia FBBC System Block Diagram
  • Exhibit 4: FBBC Core Unit, Top View
  • Exhibit 5: FBBC Core Unit, Bottom View
  • Exhibit 6: FBBC Core Unit, Right Side View
  • Exhibit 7: FBBC Core Unit, Left Side View.
  • Exhibit 8: FBBC Core Lid, Internal View
  • Exhibit 9: FBBC Core Chassis with Lid Removed
  • Exhibit 10: FBBC Core Chassis with PCB Removed
  • Exhibit 11: FBBC Core Chassis with EMI Shielding Plate Removed
  • Exhibit 12: FBBC PCB Top View
  • Exhibit 13: FBBC PCB Bottom View
  • Exhibit 14: FBBC PCB Top Area A Component Diagram
  • Exhibit 15: FBBC PCB Top Area B Component Diagram
  • Exhibit 16: FBBC PCB Top Area B Component Passives Diagram
  • Exhibit 17: FBBC PCB Top Area B test Header Component Diagram
  • Exhibit 18: FBBC PCB Bottom Area C Component Diagram
  • Exhibit 19: FBBC PCB Bottom Area D Component Diagram
  • Exhibit 20: FBBC PCB Bottom Area D Test Header Component Diagram
  • Exhibit 21: Passive Component Case Size Distribution
  • Exhibit 22: Identified Passive Component Market Share by Vendor
  • Exhibit 23: Active Semiconductor Component Share
  • Exhibit 24: High Pin Count IC vs. Discretes
  • Exhibit 25: Active Semiconductor Market Share by Vendor
  • Exhibit 26: High Pin Count (64+) Active Semiconductor Market Share by Vendor
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