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352656

Photonic Integrated Circuit (PIC)

Published: | Global Industry Analysts, Inc. | 423 Pages | Delivery time: 1-2 business days

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Photonic Integrated Circuit (PIC)
Published: May 1, 2021
Global Industry Analysts, Inc.
Content info: 423 Pages
Delivery time: 1-2 business days
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  • Table of Contents
Description

Abstract:

Global Photonic Integrated Circuit (PIC) Market to Reach $3.1 Billion by 2026

Photonic Integrated Circuit (PIC), also referred to as integrated optical circuit or simply optical chip, is a semiconductor device that is designed to combine or integrate multiple optical elements on one single chip. A standard PIC can integrate multiple passive functions such as optical-optical; multiple active functions such as electrical-optical; and combinations of active and passive functions into a single package. For carrying the information in a communication network, PIC is reliant on photons, which are known to exhibit data transfer rates equivalent to speed of light, thus enabling much faster communication speeds than with conventional electronic ICs. PIC typically carries data signals imposed on optical wavelengths in the range between 850 nm and 1650 nm, in the visible spectrum or near infrared (IR). Amid the COVID-19 crisis, the global market for Photonic Integrated Circuit (PIC) estimated at US$889 Million in the year 2020, is projected to reach a revised size of US$3.1 Billion by 2026, growing at a CAGR of 22.7% over the analysis period. Hybrid Integration, one of the segments analyzed in the report, is projected to record a 22.1% CAGR and reach US$1.8 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Monolithic Integration segment is readjusted to a revised 24.8% CAGR for the next 7-year period.

The U.S. Market is Estimated at $425.1 Million in 2021, While China is Forecast to Reach $317.6 Million by 2026

The Photonic Integrated Circuit (PIC) market in the U.S. is estimated at US$425.1 Million in the year 2021. China, the world`s second largest economy, is forecast to reach a projected market size of US$317.6 Million by the year 2026 trailing a CAGR of 28.4% over the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 19.3% and 20.4% respectively over the analysis period.

The market is projected to register significant growth driven by the growing interest in the ability to exploit the properties of light to transmit information at speeds millions of times faster than either copper or laser, especially against the backdrop of the insatiable need for bandwidth and communication speeds. The growing opportunity in optical communications and improving investments post COVID-19, bodes well for the growth of PICs. While sustained high growth in the deployment and expansion of communication networks with fiber optic infrastructure is building strong momentum for PICs, increased use of fiber optics in signal transmission, sensing, and biophotonics is creating a highly conducive environment for growth and proliferation of PICs, on a wider scale. The dramatic growth in telecom and datacom verticals over the past 5-6 years driven by steep increase in the number of Internet users and ownership rates of IP-enabled devices, and subsequently growing investments on roll out of advanced communication networks such as 100G, 200G and 400G networks is infusing robust growth opportunities for PICs.

Module Integration Segment to Reach $554.2 Million by 2026

Global market for Module Integration (Technique) segment is estimated at US$172.8 Million in 2020, and is projected to reach US$554.2 Million by 2026 reflecting a compounded annual growth rate of 20.6% over the analysis period. The United States constitutes the largest regional market for Module Integration segment, accounting for 42.9% of the global sales in 2020. China is poised to register the fastest compounded annual growth rate of 26.3% over the analysis period, to reach US$54.4 Million by the close of the analysis period.

Select Competitors (Total 61 Featured) -

  • Broadcom Inc.
  • Ciena Corporation
  • Enablence Technologies, Inc.
  • Infinera Corporation
  • Intel Corporation
  • Lumentum Operations LLC
  • NeoPhotonics Corporation
  • Nokia Networks
Table of Contents
Product Code: MCP-7068

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Impact of Covid-19 and a Looming Global Recession
    • Biosensors Built around Photonic Integrated Circuits Present New Realms for Point-Of-Care Diagnostics
    • Developments to Promote Integrated Photonics
    • The Age of Optical Communication & Networking Throws the Focus on High Speed Photons as Data Carriers
    • EXHIBIT 1: Global Optical Communication & Networking Equipment Market (In US$ Billion)
    • An Introduction to Photonic Integrated Circuit (PIC)
    • Materials Used in Making PIC
    • Integration Models for PIC
    • Applications
    • Photonic Integrated Circuit (PIC): Current Market Scenario and Outlook
    • Indium Phosphide: Largest & Fastest Growing Material Type
    • Silicon Substrates Remain in Contention
    • Hybrid Integration: The Widely Used PIC Fabrication Method
    • Monolithic Integration Emerges as Fastest Growing Fabrication Approach
  • COMPETITIVE LANDSCAPE
    • Photonic Integrated Circuit (PIC): Fragmented Marketplace
    • EXHIBIT 2: Photonic Integrated Circuit (PIC) Competitor Market Share Scenario Worldwide (in %): 2020
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Expanding Role of DCI in Data Centers Creates Potential Market Opportunities
    • Major Data Center Trends Influencing DCI Implementations
    • Rapid Growth in Data Center Traffic
    • Big Data and Cloud Computing Proliferate Demand for Hyperscale Data Centers
    • EXHIBIT 3: Number of Hyperscale Data Centers Worldwide (in Units) for the Period 2015-2021
    • EXHIBIT 4: Global Data Center Traffic Scenario (2018, 2020 & 2022): Percentage Breakdown of Data Center Traffic by Equipment Type
    • EXHIBIT 5: Global Cloud Data Center Market (2018 & 2022): Percentage Breakdown of Data Center Traffic by Cloud Type
    • PIC to Gain From Introduction of 5G
    • EXHIBIT 6: Breakdown of Network Latency (in Milliseconds) by Network Type
    • Programmable PICs Exude Tremendous Potential to Transform Photonics
    • Optical Communications: Largest Application Market for PIC
    • Key Trends Influencing the Uptake of PICs in Optical Communication Space
    • Soaring Deployments of 100G & Ultra-100G OTNs
    • Growing Uptake of FTTx Networks
    • Growing Bandwidth Needs Bring Fiber Optic Networks to the Fore, Steering PIC Demand
    • EXHIBIT 7: Global IP Traffic Volume in Exabytes for the Years 2019 and 2022
    • EXHIBIT 8: Global IP Traffic Scenario (2019): Percentage Breakdown of Data Usage by Consumer Segment
    • Optical Signal Processing Emerges as Fastest Growing Application Segment
    • Biophotonics: A Niche Market Segment for PIC
    • EXHIBIT 9: Global Biophotonics Market (2019): Percentage Breakdown of Revenues by Geographic Region
    • Expanding Application Base for Biophotonics Generates Parallel Opportunities for PIC
    • Increased Focus on Optical In-Vitro Diagnostics Augurs Well
    • Biosensors Build on SiN Photonic Integrated Circuits
    • Northbound Trajectory in Fiber Optic Sensors Vertical Gives Impetus to Market Expansion
    • EXHIBIT 10: Global Fiber Optic Sensors Market (2019 & 2024): Breakdown of Sales in US$ Million by Geographic Region
    • Smart Cities Concept to Underpin Sales Growth in the Coming Years
    • EXHIBIT 11: World Smart City Investments (in US$ Billion) for the Years 2018 through 2025
    • EXHIBIT 12: Breakdown of World Smart City Investments (in %) by Country/Region for the Year 2019
    • Smart Homes to Drive Demand for PICs
    • EXHIBIT 13: Global Smart Homes Market (In US$ Billion) for the Years 2019, 2021, 2023 & 2025
    • Upcoming Quantum Computing Model to Infuse New Growth Opportunities
    • EXHIBIT 14: World Quantum Computing Market by End-Use (2021 & 2027)
    • Economic Unviability of Electronic IC in OEO Conversion Puts Focus on Photonic IC
    • Photonic IC vs. Electronic IC: A Brief Comparative Analysis
    • Reduced Number of Optical Packages & Decreased Need for Fiber Coupling Enhance the Image of PIC
    • Technology Innovations: Key to High Growth and Consistent Demand
    • Next Generation Silicon Photonics & Polymer Based Photonic ICs Enhance Speed, Bandwidth and Scalability
    • Collaborative Initiatives Foster Development of Innovative Products
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 2: World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets for Years 2020 & 2027
    • TABLE 3: World Current & Future Analysis for Hybrid Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 4: World 7-Year Perspective for Hybrid Integration by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 5: World Current & Future Analysis for Monolithic Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 6: World 7-Year Perspective for Monolithic Integration by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 7: World Current & Future Analysis for Module Integration by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 8: World 7-Year Perspective for Module Integration by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 9: World Current & Future Analysis for Indium Phosphide (InP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 10: World 7-Year Perspective for Indium Phosphide (InP) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 11: World Current & Future Analysis for Silicon-on-Insulator (SOI) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 12: World 7-Year Perspective for Silicon-on-Insulator (SOI) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 13: World Current & Future Analysis for Gallium Arsenide (GaAs) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 14: World 7-Year Perspective for Gallium Arsenide (GaAs) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 15: World Current & Future Analysis for Silicon (Si) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 16: World 7-Year Perspective for Silicon (Si) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 17: World Current & Future Analysis for Other Raw Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 18: World 7-Year Perspective for Other Raw Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 19: World Current & Future Analysis for Optical Communications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 20: World 7-Year Perspective for Optical Communications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 21: World Current & Future Analysis for Optical Signal Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 22: World 7-Year Perspective for Optical Signal Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027
    • TABLE 23: World Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 24: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America and Rest of World for Years 2020 & 2027

III. MARKET ANALYSIS

  • UNITED STATES
    • The United States: Largest Market for PIC Solutions
    • Telecom Industry's Focus on High-Speed Fiber Networks Builds Momentum
    • Fiber Optic Deployments Register Steady Growth
    • EXHIBIT 15: Percentage (%) of Population Covered by Fiber Networks in Select States
    • Novel Use Case of Biophotonics in Medical Devices Augurs Well
    • Mainstream Image of Fiber Optic Sensors to Underpin Market Expansion
    • Market Analytics
    • TABLE 25: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 26: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 27: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 28: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 29: USA Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 30: USA 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • CANADA
    • Market Overview
    • Growing Use of Fiber Optic Sensors Revs Up PIC Demand
    • TABLE 31: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 32: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 33: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 34: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 35: Canada Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 36: Canada 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • JAPAN
    • Market Overview
    • TABLE 37: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 38: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 39: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 40: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 41: Japan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 42: Japan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • CHINA
    • Market Overview
    • Increased Adoption of Fiber Optic Sensors Infuses Market Momentum
    • Sensors Manufacturing Scenario in China
    • TABLE 43: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 44: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 45: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 46: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 47: China Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 48: China 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • EUROPE
    • Market Overview
    • Healthy Home Entertainment Sector Spurs Demand for Fiber Optic Networks
    • EXHIBIT 16: Household Penetration of FTTH & FTTB (in %) in Select European Countries: 2019
    • TABLE 49: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 50: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2020 & 2027
    • TABLE 51: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 52: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 53: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 54: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 55: Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 56: Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • FRANCE
    • TABLE 57: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 58: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 59: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 60: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 61: France Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 62: France 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • GERMANY
    • TABLE 63: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 64: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 65: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 66: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 67: Germany Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 68: Germany 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • ITALY
    • TABLE 69: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 70: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 71: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 72: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 73: Italy Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 74: Italy 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • UNITED KINGDOM
    • TABLE 75: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 76: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 77: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 78: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 79: UK Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 80: UK 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • SPAIN
    • TABLE 81: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 82: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 83: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 84: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 85: Spain Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 86: Spain 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • RUSSIA
    • TABLE 87: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 88: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 89: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 90: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 91: Russia Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 92: Russia 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • REST OF EUROPE
    • TABLE 93: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 94: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 95: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 96: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 97: Rest of Europe Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 98: Rest of Europe 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • ASIA-PACIFIC
    • TABLE 99: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - India, South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 100: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for India, South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2020 & 2027
    • TABLE 101: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 102: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 103: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 104: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 105: Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 106: Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • INDIA
    • TABLE 107: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 108: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 109: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 110: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 111: India Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 112: India 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • SOUTH KOREA
    • TABLE 113: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 114: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 115: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 116: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 117: South Korea Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 118: South Korea 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • TAIWAN
    • TABLE 119: Taiwan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 120: Taiwan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 121: Taiwan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 122: Taiwan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 123: Taiwan Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 124: Taiwan 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • REST OF ASIA-PACIFIC
    • TABLE 125: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 126: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 127: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 128: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 129: Rest of Asia-Pacific Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 130: Rest of Asia-Pacific 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • LATIN AMERICA
    • TABLE 131: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Geographic Region - Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2020 through 2027 and % CAGR
    • TABLE 132: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Geographic Region - Percentage Breakdown of Value Sales for Brazil, Mexico and Rest of Latin America Markets for Years 2020 & 2027
    • TABLE 133: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 134: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 135: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 136: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 137: Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 138: Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • BRAZIL
    • Market Overview
    • TABLE 139: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 140: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 141: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 142: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 143: Brazil Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 144: Brazil 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • MEXICO
    • Market Overview
    • TABLE 145: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 146: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 147: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 148: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 149: Mexico Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 150: Mexico 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • REST OF LATIN AMERICA
    • TABLE 151: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 152: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 153: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 154: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 155: Rest of Latin America Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 156: Rest of Latin America 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027
  • REST OF WORLD
    • TABLE 157: Rest of World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Technique - Hybrid Integration, Monolithic Integration and Module Integration - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 158: Rest of World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Technique - Percentage Breakdown of Value Sales for Hybrid Integration, Monolithic Integration and Module Integration for the Years 2020 & 2027
    • TABLE 159: Rest of World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Raw Material - Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 160: Rest of World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Raw Material - Percentage Breakdown of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the Years 2020 & 2027
    • TABLE 161: Rest of World Current & Future Analysis for Photonic Integrated Circuit (PIC) by Application - Optical Communications, Optical Signal Processing and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2020 through 2027 and % CAGR
    • TABLE 162: Rest of World 7-Year Perspective for Photonic Integrated Circuit (PIC) by Application - Percentage Breakdown of Value Sales for Optical Communications, Optical Signal Processing and Other Applications for the Years 2020 & 2027

IV. COMPETITION

  • Total Companies Profiled: 61