Market Research Report
Photonic Integrated Circuit (PIC)
|Photonic Integrated Circuit (PIC)|
Published: February 1, 2022
Global Industry Analysts, Inc.
Content info: 463 Pages
Delivery time: 1-2 business days
What`s New for 2022?
» Global competitiveness and key competitor percentage market shares
» Market presence across multiple geographies - Strong/Active/Niche/Trivial
» Online interactive peer-to-peer collaborative bespoke updates
» Access to our digital archives and MarketGlass Research Platform
» Complimentary updates for one year
Global Photonic Integrated Circuit (PIC) Market to Reach US$2.9 Billion by the Year 2026
Photonic Integrated Circuit (PIC), also referred to as integrated optical circuit or simply optical chip, is a semiconductor device that is designed to combine or integrate multiple optical elements on one single chip. The market is projected to register significant growth driven by the growing interest in the ability to exploit the properties of light to transmit information at speeds millions of times faster than either copper or laser, especially against the backdrop of the insatiable need for bandwidth and communication speeds. The growing opportunity in optical communications and improving investments post COVID-19, bodes well for the growth of PICs. While sustained high growth in the deployment and expansion of communication networks with fiber optic infrastructure is building strong momentum for PICs, increased use of fiber optics in signal transmission, sensing, and biophotonics is creating a highly conducive environment for growth and proliferation of PICs, on a wider scale. The dramatic growth in telecom and datacom verticals over the past 5-6 years driven by steep increase in the number of Internet users and ownership rates of IP-enabled devices, and subsequently growing investments on roll out of advanced communication networks such as 100G, 200G and 400G networks is infusing robust growth opportunities for PICs.
Amid the COVID-19 crisis, the global market for Photonic Integrated Circuit (PIC) estimated at US$870.2 Million in the year 2020, is projected to reach a revised size of US$2.9 Billion by 2026, growing at a CAGR of 21.7% over the analysis period. Hybrid Integration, one of the segments analyzed in the report, is projected to grow at a 20.2% CAGR to reach US$1.7 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Monolithic Integration segment is readjusted to a revised 25.5% CAGR for the next 7-year period. This segment currently accounts for a 29.7% share of the global Photonic Integrated Circuit (PIC) market. Monolithic integration is steadily gathering steam as a major integration model for PIC assembly. Hybrid integration represents the most widely used integration model for PICs. The hybrid integration of PIC facilitates assembly of multiple mono-function optical devices into one common package. Monolithic integration typically allows consolidation of multiple devices as well as functions into one common Photonic material in a more convenient manner than packaging or hybrid integration.
The U.S. Market is Estimated at $386.7 Million in 2021, While China is Forecast to Reach $385.3 Million by 2026
The Photonic Integrated Circuit (PIC) market in the U.S. is estimated at US$386.7 Million in the year 2021. The country currently accounts for a 38% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$385.3 Million in the year 2026 trailing a CAGR of 34.5% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 16.2% and 18.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 18.4% CAGR while Rest of European market (as defined in the study) will reach US$522.7 Million by the end of the analysis period. Increased demand for integration in smart gadgets and favorable regulatory environment for expansion of medium and small size companies is expected to encourage growth in both Asia-Pacific and the US.
Module Integration Segment to Reach $415.7 Million by 2026
Module integration refers to integration of discrete devices and package into one common module. Module integration for PIC allows integration of different optical functions and materials, and also combining the PIC and electronic IC functions in a seamless manner. In the global Module Integration segment, USA, Canada, Japan, China and Europe will drive the 18.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$128.2 Million in the year 2020 will reach a projected size of US$397.4 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$33.7 Million by the year 2026, while Latin America will expand at a 21.7% CAGR through the analysis period.
Select Competitors (Total 98 Featured) -