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Market Research Report

Semiconductor & IC Packaging Materials

Published by Global Industry Analysts, Inc. Product code 908966
Published Content info 187 Pages
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Semiconductor & IC Packaging Materials
Published: September 1, 2020 Content info: 187 Pages
Description

Global Semiconductor and IC Packaging Materials Market to Reach $35.7 Billion by 2027

Amid the COVID-19 crisis, the global market for Semiconductor and IC Packaging Materials estimated at US$26.5 Billion in the year 2020, is projected to reach a revised size of US$35.7 Billion by 2027, growing at a CAGR of 4.3% over the analysis period 2020-2027. Organic Substrates, one of the segments analyzed in the report, is projected to record a 5.2% CAGR and reach US$11.3 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Bonding Wires segment is readjusted to a revised 4.7% CAGR for the next 7-year period.

The U.S. Market is Estimated at $7.8 Billion, While China is Forecast to Grow at 4% CAGR

The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$7.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$6.3 Billion by the year 2027 trailing a CAGR of 4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.1% and 3.5% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4% CAGR.

Lead frames Segment to Record 4.4% CAGR

In the global Lead frames segment, USA, Canada, Japan, China and Europe will drive the 4.6% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$2.8 Billion in the year 2020 will reach a projected size of US$3.9 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4 Billion by the year 2027.We bring years of research experience to this 5th edition of our report. The 187-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others,

  • BASF SE
  • Henkel AG & Co. KGaA
  • Hitachi Chemical Co., Ltd.
  • LG Chem Ltd.
  • Mitsui High-Tec Inc.
  • Sumitomo Chemical Co., Ltd.
  • Tanaka Holdings Co., Ltd.
  • Toray Industries, Inc.
Table of Contents
Product Code: MCP14657

TABLE OF CONTENTS

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Global Competitor Market Shares
    • Semiconductor & IC Packaging Materials Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
    • Impact of Covid-19 and a Looming Global Recession
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Current & Future Analysis for Semiconductor & IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 2: World Historic Review for Semiconductor & IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 3: World 15-Year Perspective for Semiconductor & IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2020 & 2027
    • TABLE 4: World Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 5: World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 6: World 15-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 7: World Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 8: World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 9: World 15-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 10: World Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 11: World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 12: World 15-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 13: World Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 14: World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 15: World 15-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 16: World Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 17: World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 18: World 15-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 19: World Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 20: World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 21: World 15-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 22: World Current & Future Analysis for SOP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 23: World Historic Review for SOP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 24: World 15-Year Perspective for SOP by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 25: World Current & Future Analysis for GA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 26: World Historic Review for GA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 27: World 15-Year Perspective for GA by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 28: World Current & Future Analysis for QFN by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 29: World Historic Review for QFN by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 30: World 15-Year Perspective for QFN by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 31: World Current & Future Analysis for DFN by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 32: World Historic Review for DFN by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 33: World 15-Year Perspective for DFN by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027
    • TABLE 34: World Current & Future Analysis for Other Packaging Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 35: World Historic Review for Other Packaging Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 36: World 15-Year Perspective for Other Packaging Technologies by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2020 & 2027

III. MARKET ANALYSIS

  • GEOGRAPHIC MARKET ANALYSIS
  • UNITED STATES
    • Market Facts & Figures
    • US Semiconductor & IC Packaging Materials Market Share (in %) by Company: 2019 & 2025
    • Market Analytics
    • TABLE 37: USA Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 38: USA Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 39: USA 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 40: USA Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 41: USA Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 42: USA 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • CANADA
    • TABLE 43: Canada Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 44: Canada Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 45: Canada 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 46: Canada Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 47: Canada Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 48: Canada 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • JAPAN
    • TABLE 49: Japan Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 50: Japan Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 51: Japan 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 52: Japan Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 53: Japan Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 54: Japan 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • CHINA
    • TABLE 55: China Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 56: China Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 57: China 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 58: China Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 59: China Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 60: China 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • EUROPE
    • Market Facts & Figures
    • European Semiconductor & IC Packaging Materials Market: Competitor Market Share Scenario (in %) for 2019 & 2025
    • Market Analytics
    • TABLE 61: Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027
    • TABLE 62: Europe Historic Review for Semiconductor & IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 63: Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2020 & 2027
    • TABLE 64: Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 65: Europe Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 66: Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 67: Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 68: Europe Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 69: Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • FRANCE
    • TABLE 70: France Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 71: France Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 72: France 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 73: France Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 74: France Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 75: France 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • GERMANY
    • TABLE 76: Germany Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 77: Germany Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 78: Germany 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 79: Germany Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 80: Germany Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 81: Germany 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • ITALY
    • TABLE 82: Italy Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 83: Italy Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 84: Italy 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 85: Italy Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 86: Italy Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 87: Italy 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • UNITED KINGDOM
    • TABLE 88: UK Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 89: UK Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 90: UK 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 91: UK Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 92: UK Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 93: UK 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • REST OF EUROPE
    • TABLE 94: Rest of Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 95: Rest of Europe Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 96: Rest of Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 97: Rest of Europe Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 98: Rest of Europe Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 99: Rest of Europe 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • ASIA-PACIFIC
    • TABLE 100: Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 101: Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 102: Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 103: Asia-Pacific Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 104: Asia-Pacific Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 105: Asia-Pacific 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027
  • REST OF WORLD
    • TABLE 106: Rest of World Current & Future Analysis for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 107: Rest of World Historic Review for Semiconductor & IC Packaging Materials by Types - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 108: Rest of World 15-Year Perspective for Semiconductor & IC Packaging Materials by Types - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2012, 2020 & 2027
    • TABLE 109: Rest of World Current & Future Analysis for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027
    • TABLE 110: Rest of World Historic Review for Semiconductor & IC Packaging Materials by Packaging Technologies - SOP, GA, QFN, DFN and Other Packaging Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2019
    • TABLE 111: Rest of World 15-Year Perspective for Semiconductor & IC Packaging Materials by Packaging Technologies - Percentage Breakdown of Value Sales for SOP, GA, QFN, DFN and Other Packaging Technologies for the Years 2012, 2020 & 2027

IV. COMPETITION

  • Total Companies Profiled: 37
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