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Market Research Report

Metrology, Inspection, and Process Control in VLSI Manufacturing

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Metrology, Inspection, and Process Control in VLSI Manufacturing
Published: September 1, 2018 Content info:
Description

The increase in complexity of semiconductors and the resulting increase in the complexity and cost of the semiconductor manufacturing process has been a driver of demand for metrology and inspection systems.

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.

Table of Contents

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Metrology/Inspection Technologies

  • 3.1 Introduction
  • 3.2 Imaging Techniques
    • 3.2.1 Scanning Electron Microscope (SEM)
    • 3.2.2 Transmission Electron Microscope (TEM)
  • 3.3 Scanning Probe Microscopes
    • 3.3.1 Atomic Force Microscopy (AFM)
    • 3.3.2 Scanning Tunneling Microscopy (STM)
    • 3.3.3 Scanning Probe Microscopy (SPM)
    • 3.3.4 AFM Types
      • 3.3.4.1 Contact AFM
      • 3.3.4.2 Dynamic Force Mode AFM Techniques
    • 3.3.5 Scanning Surface Potential Microscopy (SSPM)
  • 3.4 Optical Techniques
    • 3.4.1 Scatterometry
      • 3.4.1.1 Ellipsometry
      • 3.4.1.2 Reflectometry
      • 3.4.1.3 Scatterometry Developments
    • 3.4.2 Total Reflection X-Ray Fluorescence (TXRF)
    • 3.4.3 Energy Dispersive X-Ray Analysis (EDX)
    • 3.4.4 Secondary Ion Mass Spectrometry (SIMS)
      • 3.4.4.1 Surface Imaging Using SIMS
      • 3.4.4.2 SIMS Depth Profiling
    • 3.4.5 Auger Electron Spectroscopy
    • 3.4.6 Focused Ion Beam (FIB)
    • 3.4.7 X-Ray Reflectometry (XRR)
    • 3.4.8 X-Ray Photoelectron Spectroscopy (XPS)
    • 3.4.9 Rutherford Backscattering (RBS)
    • 3.4.10 Optical Acoustics Metrology
    • 3.4.11 Fourier Transform Infrared Spectroscopy (FTIR)
    • 3.4.12 Thermally-Induced Voltage Alteration (TIVA)
  • 3.5 Film Thickness And Roughness
    • 3.5.1 Surface Inspection Technology
    • 3.5.2 Dimensional Technology
    • 3.5.3 Stylus Profilometer

Chapter 4 Defect Review/Wafer Inspection

  • 4.1 Introduction
  • 4.2 Defect Review
    • 4.2.1 SEM Defect Review
    • 4.2.2 Optical Defect Review
    • 4.2.3 Other Defect Review
  • 4.3 Patterned Wafer Inspection
    • 4.3.1 E-Beam Patterned Wafer Inspection
    • 4.3.2 Optical Patterned Wafer Inspection
  • 4.4 Unpatterned Wafer Inspection
  • 4.5 Macro-Defect Inspection

Chapter 5 Thin Film Metrology

  • 5.1 Introduction
    • 5.1.1 Front End Applications
    • 5.1.2 Back End Applications
  • 5.2 Metal Thin-Film Metrology
  • 5.3 Non-Metal Thin-Film Metrology
  • 5.4 Substrate/Other Thin Film Metrology

Chapter 6 Lithography Metrology

  • 6.1 Overlay
  • 6.2 CD
  • 6.3 Mask (Reticle) Metrology/Inspection

Chapter 7 Market Forecast

  • 7.1 Introduction
  • 7.2 Market Forecast Assumptions
  • 7.3 Market Forecast
    • 7.3.1 Total Process Control Market Forecast
    • 7.3.2 Lithography Metrology Market Forecast
      • 7.3.2.1 Overlay Market Forecast
      • 7.3.2.2 CD Measurement Market Forecast
      • 7.3.2.3 Mask Inspection Market Forecast
      • 7.3.2.4 Mask Metrology Market Forecast
    • 7.3.3 Wafer Inspection / Defect Review Market
      • 7.3.3.1 Patterned Wafer Inspection Market Forecast
        • E-Beam Patterned Wafer Inspection Market Forecast
        • Optical Patterned Wafer Inspection Market Forecast
      • 7.3.3.2 Defect Review Market Forecast
        • SEM Defect Review Market Forecast
        • Optical Defect Review Market Forecast
        • Other Defect Review Market Forecast
      • 7.3.3.3 Unpatterned Wafer Inspection Market Forecast
      • 7.3.3.4 Macro Defect Detection Market Forecast
    • 7.3.4 Thin Film Metrology Market Forecast
      • 7.3.4.1 Non-Metal Thin Film Metrology Market Forecast
        • Non-Metal Standalone Thin Film Metrology Market Forecast
        • Non-Metal Integrated Thin Film Metrology Market Forecast
      • 7.3.4.2 Substrate / Other Thin Film Metrology Market Forecast
    • 7.3.5 Other Process Control Systems Market Forecast
    • 7.3.6 Back-End Metrology/Inspection Market Forecast

Chapter 8 Integrated/In-Situ Metrology/Inspection Trends

  • 8.1 Introduction
  • 8.2 In-Situ Metrology
  • 8.3 Integrated Metrology
    • 8.3.1 Benefits
    • 8.3.2 Limitations

Chapter 9 Key Drivers

  • 9.1 3D
  • 9.2 Back End Metrology Inspection
  • 9.3 300mm/450mm Wafers
  • 9.4 Copper Metrology
  • 9.5 Low-K Dielectrics
  • 9.6 Chemical Mechanical Planarization (CMP)
  • 9.7 Ion Implant

List of Tables

  • 3.1 Comparison Of Derivative AFM Techniques
  • 5.1 Comparison Of White-Light With Multiple-Angle Laser Ellipsometry
  • 7.1 Total Process Control Market Forecast
  • 7.2 Lithography Metrology Market Forecast
  • 7.3 Overlay Market Forecast
  • 7.4 CD Measurement Market Forecast
  • 7.5 Mask Inspection Market Forecast
  • 7.6 Mask Metrology Market Forecast
  • 7.7 Wafer Inspection / Defect Review Market Forecast
  • 7.8 Patterned Wafer Inspection Market Forecast
  • 7.9 E-Beam Patterned Wafer Inspection Market Forecast
  • 7.10 Optical Patterned Wafer Inspection Market Forecast
  • 7.11 Defect Review Market Forecast
  • 7.12 SEM Defect Review Market Forecast
  • 7.13 Optical Defect Review Market Forecast
  • 7.14 Other Defect Review Market Forecast
  • 7.15 Unpatterned Wafer Inspection Market Forecast
  • 7.16 Macro Defect Detection Market Forecast
  • 7.17 Thin Film Metrology Market Forecast
  • 7.18 Non-Metal Thin Film Metrology Market Forecast
  • 7.19 Non-Metal Standalone Thin Film Metrology Market Forecast
  • 7.20 Non-Metal Integrated Thin Film Metrology Market Forecast
  • 7.21 Substrate / Other Thin Film Metrology Market Forecast
  • 7.22 Other Process Control Systems Market Forecast
  • 9.1 Dielectric Film Challenges

List of Figures

  • 3.1 Schematic Of Scanning Electron Microscope
  • 3.2 Schematic Of Transmission Electron Microscope
  • 3.3 Schematic Of Atomic Force Microscopy
  • 3.4 Schematic Of Scanning Tunneling Microscopy
  • 3.5 Interaction Between Two Atoms In AFM
  • 3.6 Schematic Of Lateral Force Microscopy
  • 3.7 Schematic Of Dynamic Force Mode AFM
  • 3.8 Schematic Of Scanning Surface Potential Microscopy
  • 3.9 Principle Of Scatterometry
  • 3.10 Schematic Of Ellipsometer
  • 3.11 Principles Of CD Scatterometry
  • 3.12 Conventional TXRF Analysis Geometry
  • 3.13 Schematic Of Secondary Ion Mass Spectrometry
  • 3.14 Principle Of Auger Electron Emission
  • 3.15 Schematic Of Auger Electron Spectroscopy
  • 3.16 Schematic Of Focused Ion Beam Technology
  • 3.17 Schematic Of X-Ray Reflectometry
  • 3.18 Schematic Of X-Ray Photoelectron Spectroscopy
  • 3.19 Schematic Of Rutherford Backscattering
  • 3.20 Schematic Of Optical Acoustics Metrology
  • 3.21 Spatial Wavelength Of Nanotopography
  • 3.22 Schematic Of Non-Contact Capacitive Gauging
  • 3.23 Schematic Of Stylus Profilometer
  • 5.1 Spectroscopic Ellipsometry Diagram
  • 6.1 ITRS Overlay Technology Roadmap
  • 6.2 Illustration Of 3D Structure
  • 6.3 ITRS Metrology Roadmap
  • 6.4 Schematic Of OCD Optics
  • 7.1 Total Process Control Market Forecast
  • 7.2 Total Process Control Market By Geographic Region
  • 7.3 Total Process Control Market Vs. Overall Equipment Market
  • 7.4 Lithography Metrology Market Shares
  • 7.5 Overlay Market Shares
  • 7.6 CD Measurement Market Shares
  • 7.7 Mask Inspection Market Shares
  • 7.8 Mask Metrology Market Shares
  • 7.9 Wafer Inspection / Defect Review Market Shares
  • 7.10 Patterned Wafer Inspection Market Shares
  • 7.11 E-Beam Patterned Wafer Inspection Market Shares
  • 7.12 Optical Patterned Wafer Inspection Market Shares
  • 7.13 Defect Review Market Shares
  • 7.14 SEM Defect Review Market Shares
  • 7.15 Optical Defect Review Market Shares
  • 7.16 Other Defect Review Market Shares
  • 7.17 Unpatterned Wafer Inspection Market Shares
  • 7.18 Macro Defect Detection Market Shares
  • 7.19 Thin Film Metrology Market Shares
  • 7.20 Non-Metal Thin Film Metrology Market Shares
  • 7.21 Non-Metal Standalone Thin Film Metrology Market Shares
  • 7.22 Non-Metal Integrated Thin Film Metrology Market Shares
  • 7.23 Substrate / Other Thin Film Metrology Market Shares
  • 7.24 Other Process Control Systems Market Shares
  • 7.25 Other Process Software Market Shares
  • 8.1 Integrated Control In A Fab
  • 9.1 Polish Endpoint Control
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