The Global MEMs Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries

Table of Contents

Chapter 1: The MEMS Market Infrastructure

Chapter 2: Forecast Of The Key Applications And Markets

• 2.1. MEMS Device Market Forecast
  • 2.1.1. Ink Jet Head
  • 2.1.2. Pressure Sensor
  • 2.1.3. Silicon Microphone
  • 2.1.4. Accelerometer
  • 2.1.5. Gyroscope
  • 2.1.6. Micro Display
  • 2.1.7. Other MOEMS
  • 2.1.8. Microfluidics
  • 2.1.9. RF MEMS
  • 2.1.10. Digital Compass
  • 2.1.11. Inertial Sensor
  • 2.1.12. Emerging Applications
• 2.2. MEMS System Market Forecast
  • 2.2.1. Automotive Systems
  • 2.2.2. Aeronautics Systems
  • 2.2.3. Consumer Systems
  • 2.2.4. Defense Systems
  • 2.2.5. Industrial Systems
  • 2.2.6. Medical/Life Sciences Systems
  • 2.2.7. Telecom Systems

Chapter 3: Markets for Equipment and Materials Suppliers

• 3.1. Introduction
• 3.2. MEMS Equipment Markets
  • 3.2.1. Assembly
  • 3.2.2. Bonding
  • 3.2.3. Cleaning
  • 3.2.4. Deposition
  • 3.2.5. Dicing
  • 3.2.6. Etching
  • 3.2.7. Laser Micromachining
  • 3.2.8. Lithography
  • 3.2.9. Metrology/Inspection
  • 3.2.10. Testing
  • 3.2.11. Thermal Treatment
  • 3.2.12. Wafer Thinning
• 3.3. MEMS Material Markets
  • 3.3.1. Chemicals
  • 3.3.2. Photomasks
  • 3.3.3. Substrates

Chapter 4: MEMS Foundries

• 4.1. Foundry Profiles and Strategies
  • 4.1.1. Advanced Microsensors
  • 4.1.2. Agiltron
  • 4.1.3. Asia Pacific Microsystems
  • 4.1.4. Beijing First MEMS
  • 4.1.5. Bosch
  • 4.1.6. China Resources Semiconductor
  • 4.1.7. Colibrys
  • 4.1.8. C2V
  • 4.1.9. Dai-Nippon Printing
  • 4.1.10. Dalso
  • 4.1.11. Freescale
  • 4.1.12. GLOBALFOUNDRIES
  • 4.1.13. Honeywell MEMSplus
  • 4.1.14. Infineon Technologies SensoNor As
  • 4.1.15. Institute of Microelectronics
  • 4.1.16. Innovative Micro Tech
  • 4.1.17. Integrated Sensing Systems Inc. (ISSYS)
  • 4.1.18. LioniX
  • 4.1.19. MEMS Engineering and Material
  • 4.1.20. MEMSCAP
  • 4.1.21. Micralayne
  • 4.1.22. Micrel
  • 4.1.23. Midwest MicroDevices, LLC
  • 4.1.24. Nanostructures Inc
  • 4.1.25. Norcada Inc.
  • 4.1.26. Olympus
  • 4.1.27. Omron
  • 4.1.28. Proton Mikrotechnik
  • 4.1.29. Semiconductor Manufacturing International Corporation
  • 4.1.30. SEMEFAB
  • 4.1.31. Silex Microsystems
  • 4.1.32. Sony
  • 4.1.33. ST Microelectronics
  • 4.1.34. Taiwan Semiconductor Manufacturing Co Ltd (TSMC)
  • 4.1.35. Texas Instruments
  • 4.1.36. Touch Microsystems
  • 4.1.37. Tronics Microsystems
  • 4.1.38. X-Fab
• 4.2. Small-Mid-Sized Companies

Chapter 5: Factors for Foundry Success

• 5.1.1. Achieving Economies Of Scale
• 5.1.2. Competitive Advantages
• 5.1.3. Core Strengths
• 5.1.4. Employee Commitment
• 5.1.5. Expansion Plans
• 5.1.6. Financial Objectives:
• 5.1.7. Groundbreaking MEMS Solutions
• 5.1.8. In- House Expertise in MEMS Testing And Reliability
• 5.1.9. Leadership in Technology
• 5.1.10. Manufacturing Excellence
• 5.1.11. Manufacturing Process
• 5.1.12. Mastering Process and Production Technology
• 5.1.13. Patent Protection
• 5.1.14. Partnerships
• 5.1.15. Products
• 5.1.16. Proprietary Development Processes
• 5.1.17. Sales Organization
• 5.1.18. Sales Process and Customer Base
• 5.1.19. Strong Customer Relations
• 5.1.20. Vision and Goal

Chapter 6: Critical MEMS Issues

• 6.1. 3-D Interconnects and Packaging
• 6.2. Wafer Size
• 6.3. MEMS Testing
• 6.4. Opportunities For Fabless MEMS Companies

List Of Tables

• 4.1. Top MEMS Foundries by Revenues

List of Figures

• 2.1. MEMS Markets
• 2.2. Ink Jet Head Sales Forecast
• 2.3. Pressure Sensor Sales Forecast
• 2.4. Silicon Microphone Sales Forecast
• 2.5. Accelerometer Sales Forecast
• 2.6. Gyroscope Sales Forecast
• 2.7. Micro Display Sales Forecast
• 2.8. Other MOEMS Sales Forecast
• 2.9. Microfluidics Sales Forecast
• 2.10. RF MEMS Sales Forecast
• 2.11. Digital Compass Sales Forecast
• 2.12. Inertial Sensor Sales Forecast
• 2.131. Emerging Applications Sales Forecast
• 2.12. Automotive System Sales Forecast
• 2.15. Aeronautics System Sales Forecast
• 2.16. Consumer System Sales Forecast
• 2.17. Defense System Sales Forecast
• 2.18. Industrial System Sales Forecast
• 2.19. Medical System Sales Forecast
• 2.20. Telecom System Sales Forecast
• 3.1. Discrete Assembly of MEMS
• 3.2. Assembly Equipment Sales Forecast
• 3.3. Bonding Equipment Sales Forecast
• 3.4. Cleaning Equipment Sales Forecast
• 3.5. Deposition Equipment Sales Forecast
• 3.6. Dicing Equipment Sales Forecast
• 3.7. Schematic Of DRIE
• 3.8. Etching Equipment Sales Forecast
• 3.9. Laser Micromachining Equipment Sales Forecast
• 3.10. Driving Principle Of The MOR (a) Parallel State (B) Tilted State
• 3.11. Lithography Equipment Sales Forecast
• 3.12. Metrology/Inspection Equipment Sales Forecast
• 3.13. Testing Equipment Sales Forecast
• 3.14. Thermal Treatment Equipment Sales Forecast
• 3.15. Wafer Thinning Equipment Sales Forecast
• 3.16. Chemicals Sales Forecast
• 3.17. Photomasks Sales Forecast
• 3.18. Substrates Sales Forecast
• 3.19. Wafer Starts By Substrate Size
• 6-1. Process For Capping MEMS
• 6-2. Examples Of Thermoplastic Cavity Packages
• 6.3. Fluidic Packaging System
• 6.4. Forecast of Wafer Size
• 6-5. Fluidic Packaging System