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Market Research Report

Taiwanese Semiconductor Manufacturing Industry, 4Q 2019

Published by MIC - Market Intelligence & Consulting Institute Product code 286405
Published Content info 23 Pages
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Taiwanese Semiconductor Manufacturing Industry, 4Q 2019
Published: January 17, 2020 Content info: 23 Pages
Description

Abstract

The report finds that shipment value of the Taiwanese semiconductor manufacturing industry - comprising mainly of foundry, DRAM, flash memory, and IDM sectors - reached US$ 11.5 billion, growing 17.6% sequentially in the third quarter of 2019. The decline in the frist half of 2019 was mainly attributed to relatively high inventory levels. As the inventory levels have reached the optimal level and TSMC’s advanced processes have entered mass production, the industry’s shipment performance in the second half of 2019 is expected to witness year-on-year growth. The market demand is anticipated to regain momentum in the second half of 2020 thanks to the surging demand for 5G applications and 8K TVs.

Table of Contents
Product Code: SCSTL20011702

Table of Contents

  • The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectorTaiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry 8"-equiv. Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2017 - 1Q 2020
  • Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Vendor's Business Type, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2017 - 3Q 2019
  • Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume by Business Type, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry’s Shipment Value Ranking, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2017 - 3Q 2019
  • Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's 8"-equiv. Wafwer Shipment Volume by Process, 1Q 2017 - 3Q 2019
  • Taiwanese DRAM Industry's 8"-equiv. Wafer Shipment Volume Share by Process, 1Q 2017 - 3Q 2019
  • Exchange Rate, 1Q 2017 - 3Q 2019
  • Research Scope & Definitions

List of Topics

This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry.

Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including foundries, DRAM (Dynamic Random Access Memory) makers, flash memory makers, and IDMs (Integrated Device Manufacturers).

The content of this report is based on primary data obtained from interviews and publicly available information.

Companies covered

Inotera

Nanya

Powerchip

TSMC

UMC

Winbon

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