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Market Research Report

Taiwanese IC Packaging & Testing Industry, 4Q 2019

Published by MIC - Market Intelligence & Consulting Institute Product code 291079
Published Content info 18 Pages
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Taiwanese IC Packaging & Testing Industry, 4Q 2019
Published: January 17, 2020 Content info: 18 Pages
Description

Abstract

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. The industry is expected to have continued growth momentum in the fourth quarter, reaching US$4.2 billion.

Table of Contents
Product Code: SCSTL20011701

Table of Contents

  • Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2017 - 1Q 2020
  • Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2017 - 1Q 2020
  • Taiwanese IC Packaging Industry Shipment Value , 1Q 2017 - 1Q 2020
  • Taiwanese IC Testing Industry Shipment Value, 1Q 2017 - 1Q 2020
  • Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2017 - 3Q 2019
  • Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2017 - 3Q 2019
  • Taiwanese IC Testing Industry’s Shipment Value Rankings, 1Q 2017 - 3Q 2019
  • Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2017 - 3Q 2019
  • Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2017 - 3Q 2019
  • Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 3Q 2019
  • Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2017 - 3Q 2019
  • Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 3Q 2019
  • Exchange Rate, 2Q 2017 - 3Q 2019
  • Research Scope & Definitions

List of Topics

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.

Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.

The content of this report is based on primary data obtained from interviews, and publicly available information.

Companies covered

Ardentec

ASE

Chipbond

ChipMOS

FATC

KYEC

OSE

PTI

Sigurd

SPIL

Walto

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