Market Research Report
Global Wafer-level Packaging Equipment Market 2015-2019
|Published by||TechNavio (Infiniti Research Ltd.)||Product code||294963|
|Published||Content info||85 Pages
|Global Wafer-level Packaging Equipment Market 2015-2019|
|Published: January 21, 2015||Content info: 85 Pages||
ICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process.
TechNavio's analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of 0.1 percent over the period 2014-2019.
This report covers the present scenario and the growth prospects of the Global Wafer-level Packaging Equipment market for the period 2015-2019. This report considers 2014 as the base year and provides data for the trailing 12 months. To calculate the market size, the report considers revenue generated from the sales of wafer-level packaging equipment worldwide. However, the report does not take into consideration the following while calculating the market size: