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Market Research Report

Global Back End of the Line Semiconductor Equipment Market 2016-2020

Published by TechNavio (Infiniti Research Ltd.) Product code 368245
Published Content info 61 Pages
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Global Back End of the Line Semiconductor Equipment Market 2016-2020
Published: August 26, 2016 Content info: 61 Pages
Description

About Semiconductor Equipment Industry

The semiconductor equipment industry is an important part of the overall semiconductor market, with semiconductor chip makers investing 20% of their sales toward obtaining manufacturing equipment. The equipment manufacturing companies are leading the development of most core process technologies in the semiconductor market. The semiconductor production equipment industry is divided into front-end and back-end process equipment.

Technavio's analysts forecast the global back end of the line semiconductor equipment market to grow at a CAGR of 1.41% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global back end of the line semiconductor equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of BEOL semiconductor equipment.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Back End of the Line Semiconductor Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Applied Materials
  • ASML
  • KLA-Tencor
  • Lam Research
  • TEL

Other Prominent Vendors

  • Dainippon Screen Manufacturing
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • Nikon

Market driver

  • Rising demand for flip chip and advanced packaging technologies
  • For a full, detailed list, view our report

Market challenge

  • Dependency on few key suppliers
  • For a full, detailed list, view our report

Market trend

  • Increased need for semiconductor memory devices
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents
Product Code: IRTNTR10233

Table of Contents

PART 01: Executive summary

  • Highlights

PART 02: Scope of the report

  • Market overview
  • Definition
  • Base year
  • Product segmentation
  • End-user segmentation
  • Geographical segmentation
  • Vendor selection
  • Common currency conversion rates
  • Top-vendor offerings

PART 03: Market research methodology

  • Research methodology
  • Economic indicators

PART 04: Introduction

  • Key market highlights

PART 05: Market landscape

  • Technology landscape of wafer fab equipment
  • Wafer-level manufacturing equipment categories
  • Key customers
  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by product

  • Market overview
  • Market size and forecast
  • Stepper
  • CVD equipment
  • Coater developer
  • Wet station
  • PVD equipment
  • CMP equipment
  • Metal etching equipment

PART 07: Market segmentation by end user

  • Market overview
  • Market size and forecast
  • Foundry
  • Memory
  • IDM

PART 08: Geographical segmentation

  • Market size and forecast
  • APAC
  • Americas
  • EMEA

PART 09: Key leading countries

PART 10: Market drivers

  • Increase in number of fabs
  • Miniaturization of electronic devices
  • Proliferation of advanced consumer electronic products
  • Rising demand for flip chip and advanced packaging technologies
  • High requirement of SoC technology

PART 11: Impact of drivers

PART 12: Market challenges

  • Dependency on few key suppliers
  • High investment market
  • Fluctuations in the semiconductor industry

PART 13: Impact of drivers and challenges

PART 14: Market trends

  • Increase in the number of fabless semiconductor companies
  • Increased need for semiconductor memory devices
  • Growing application of IoT
  • Vehicle automation

PART 15: Vendor landscape

  • Competitive landscape
  • Other prominent vendors

PART 16: Explore Technavio

List of Exhibits

  • Exhibit 01: List of major countries considered
  • Exhibit 02: Common currency conversion rates
  • Exhibit 03: Product offerings
  • Exhibit 04: Semiconductor production equipment
  • Exhibit 05: Semiconductor IC manufacturing process
  • Exhibit 06: Front-end chip formation steps
  • Exhibit 07: Back-end chip formation steps
  • Exhibit 08: Wafer-level manufacturing equipment categories
  • Exhibit 09: Requirements of a manufacturing equipment
  • Exhibit 10: Global BEOL semiconductor equipment market ($ billions)
  • Exhibit 11: Five forces analysis
  • Exhibit 12: Global BEOL semiconductor equipment market by product 2015-2020 (% share)
  • Exhibit 13: Global BEOL semiconductor equipment market by product 2015-2020 ($ billions)
  • Exhibit 14: Global BEOL semiconductor equipment market by stepper segment 2015-2020 ($ billions)
  • Exhibit 15: Global BEOL semiconductor equipment market by CVD equipment segment 2015-2020 ($ billions)
  • Exhibit 16: Global BEOL semiconductor equipment market by coater developer segment 2015-2020 ($ billions)
  • Exhibit 17: Global BEOL semiconductor equipment market by wet station segment 2015-2020 ($ billions)
  • Exhibit 18: Global BEOL semiconductor equipment market by PVD equipment segment 2015-2020 ($ billions)
  • Exhibit 19: Global BEOL semiconductor equipment market by CMP equipment segment 2015-2020 ($ billions)
  • Exhibit 20: Global BEOL semiconductor equipment market by metal etching equipment segment 2015-2020 ($ billions)
  • Exhibit 21: Global BEOL semiconductor equipment market by end-user 2015-2020 (% share)
  • Exhibit 22: Global BEOL semiconductor equipment market by end-user 2015-2020 ($ billions)
  • Exhibit 23: Global BEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions)
  • Exhibit 24: Global BEOL semiconductor equipment market by memory segment 2015-2020 ($ billions)
  • Exhibit 25: Global BEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions)
  • Exhibit 26: Segmentation of global BEOL semiconductor equipment market by geography 2015-2020 (% share)
  • Exhibit 27: Segmentation of global BEOL semiconductor equipment market by geography 2015-2020 ($ millions)
  • Exhibit 28: BEOL semiconductor equipment market in APAC ($ billions)
  • Exhibit 29: BEOL semiconductor equipment market in Americas ($ billions)
  • Exhibit 30: BEOL semiconductor equipment market in EMEA ($ billions)
  • Exhibit 31: Global NAND flash market 2015-2020 (% share)
  • Exhibit 32: Impact of drivers
  • Exhibit 33: Impact of drivers and challenges
  • Exhibit 34: CAGR of 3D NAND and DRAM 2015-2020
  • Exhibit 35: Cars shipment growth forecast 2015-2020 (% growth)
  • Exhibit 36: Key vendors
  • Exhibit 37: ASML customers by end-user segment
  • Exhibit 38: Other prominent vendors
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