Market Research Report
Global Fan-in Wafer Level Packaging Market 2016-2020
|Published by||TechNavio (Infiniti Research Ltd.)||Product code||382927|
|Published||Content info||62 Pages
|Global Fan-in Wafer Level Packaging Market 2016-2020|
|Published: October 25, 2016||Content info: 62 Pages||
Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.
Technavio's analysts forecast the global fan-in WLP market to grow at a CAGR of 9.63% during the period 2016-2020.
The report covers the present scenario and the growth prospects of the global fan-in WLP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensor
The market is divided into the following segments based on geography:
Technavio's report, Global Fan-in WLP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
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