Market Research Report
Global Flip Chip Market 2018-2022
|Published by||TechNavio (Infiniti Research Ltd.)||Product code||642816|
|Published||Content info||114 Pages
|Global Flip Chip Market 2018-2022|
|Published: May 11, 2018||Content info: 114 Pages||
Flip chip is a type of packaging type, which interconnects chip and package carriers or substrates using a conductive bump. Conductive bumps are placed on the die surface, which is flipped to connect the substrate directly.
Technavio's analysts forecast the Global Flip Chip Market Market to grow at a CAGR of 6.22% during the period 2018-2022.
The report covers the present scenario and the growth prospects of the flip chip market. To calculate the market size, the report considers the revenue generated from the sales of flip chip.
The market is divided into the following segments based on geography:
Technavio's report, Global Flip Chip Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
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