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Market Research Report

Global Flip Chip Packages Market 2018-2022

Published by TechNavio (Infiniti Research Ltd.) Product code 694222
Published Content info 123 Pages
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Global Flip Chip Packages Market 2018-2022
Published: September 4, 2018 Content info: 123 Pages
Description

About Flip Chip Packaging

Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The use of the technology in semiconductor chip packaging ensures a direct electrical connection of face-down electronic dies with organic or ceramic circuit boards using conductive bumps on the chip bond pads.

Technavio's analysts forecast the global flip chip packages market to grow at a CAGR of 6.35% during the period 2018-2022.

Covered in this report

The report covers the present scenario and the growth prospects of the global flip chip packages market for 2018-2022. To calculate the market size, the report considers the sales of semiconductor devices based on flip chip packaging technology to end-user sectors including communication, computing and networking, industrial, and automotive.

The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA

Technavio's report, Global Flip Chip Packages Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors

  • Advanced Semiconductor Engineering
  • Chipbond Technology
  • Intel
  • Siliconware Precision Industries
  • Taiwan Semiconductor Manufacturing Company

Market driver

  • Rise in use of 3D chip packaging
  • For a full, detailed list, view our report

Market challenge

  • Need for high initial capital investments
  • For a full, detailed list, view our report

Market trend

  • Growing number of OSAT companies in APAC
  • For a full, detailed list, view our report

Key questions answered in this report

  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?

You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.

Table of Contents
Product Code: IRTNTR22970

Table of Contents

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: MARKET SEGMENTATION BY BUMPING TECHNOLOGY

  • Overview
  • Copper pillar bumping
  • Solder bumping
  • Gold bumping

PART 08: CUSTOMER LANDSCAPE

PART 09: MARKET SEGMENTATION BY END-USER

  • Overview
  • Comparison by end-user
  • Communication sector - Market size and forecast 2017-2022
  • Computing and networking sector - Market size and forecast 2017-2022
  • Industrial sector- Market size and forecast 2017-2022
  • Automotive sector - Market size and forecast 2017-2022
  • Others - Market size and forecast 2017-2022
  • Market opportunity by end-user

PART 10: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • APAC - Market size and forecast 2017-2022
  • Americas - Market size and forecast 2017-2022
  • EMEA - Market size and forecast 2017-2022
  • Key leading countries
  • Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

  • Market drivers
  • Market challenges

PART 13: MARKET TRENDS

  • Integration of semiconductor components in automobiles
  • Short lifecycle of mobile devices
  • Growing number of OSAT companies in APAC
  • M&A in semiconductor packaging industry

PART 14: VENDOR LANDSCAPE

  • Overview
  • Landscape disruption
  • Competitive scenario

PART 15: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Advanced Semiconductor Engineering
  • Chipbond Technology
  • Intel
  • Siliconware Precision Industries
  • Taiwan Semiconductor Manufacturing Company

PART 16: APPENDIX

  • List of abbreviations

List of Exhibits

  • Exhibit 01: Parent market
  • Exhibit 02: Global semiconductor advanced packaging market: Segments
  • Exhibit 03: Market characteristics
  • Exhibit 04: Global flip chip packages market: Segments
  • Exhibit 05: Market definition: Inclusions and exclusions checklist
  • Exhibit 06: Market size 2017
  • Exhibit 07: Validation techniques employed for market sizing 2017
  • Exhibit 08: Global flip chip packages market: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 09: Global flip chip packages market: Year-over-year growth 2018-2022 (%)
  • Exhibit 10: Five forces analysis 2017
  • Exhibit 11: Five forces analysis 2022
  • Exhibit 12: Bargaining power of buyers
  • Exhibit 13: Bargaining power of suppliers
  • Exhibit 14: Threat of new entrants
  • Exhibit 15: Threat of substitutes
  • Exhibit 16: Threat of rivalry
  • Exhibit 17: Market condition: Five forces 2017
  • Exhibit 18: Segmentation by bumping technology: Market share 2017-2022 (%)
  • Exhibit 19: Customer landscape
  • Exhibit 20: Segmentation by end-user: Market share 2017-2022 (%)
  • Exhibit 21: Comparison by end-user
  • Exhibit 22: Communication sector: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 23: Communication sector: Year-over-year growth 2018-2022 (%)
  • Exhibit 24: Computing and networking sector: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 25: Computing and networking sector: Year-over-year growth 2018-2022 (%)
  • Exhibit 26: Industrial sector: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 27: Industrial sector: Year-over-year growth 2018-2022 (%)
  • Exhibit 28: Automotive sector: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 29: Automotive sector: Year-over-year growth 2018-2022 (%)
  • Exhibit 30: Others: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 31: Others: Year-over-year growth 2018-2022 (%)
  • Exhibit 32: Market opportunity by end-user
  • Exhibit 33: Segmentation by geography: Market share 2017-2022 (%)
  • Exhibit 34: Regional comparison
  • Exhibit 35: APAC: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 36: APAC: Year-over-year growth 2018-2022 (%)
  • Exhibit 37: Americas: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 38: Americas: Year-over-year growth 2018-2022 (%)
  • Exhibit 39: EMEA: Market size and forecast 2017-2022 ($ bn)
  • Exhibit 40: EMEA: Year-over-year growth 2018-2022 (%)
  • Exhibit 41: Key leading countries
  • Exhibit 42: Market opportunity
  • Exhibit 43: Timeline for semiconductor wafer size advances
  • Exhibit 44: Global semiconductor market trend 1992-2017 ($ billions)
  • Exhibit 45: Forecasted car shipments 2017-2022 (million units)
  • Exhibit 46: Vendor landscape
  • Exhibit 47: Landscape disruption
  • Exhibit 48: Vendors covered
  • Exhibit 49: Vendor classification
  • Exhibit 50: Market positioning of vendors
  • Exhibit 51: Advanced Semiconductor Engineering: Overview
  • Exhibit 52: Advanced Semiconductor Engineering: Business segments
  • Exhibit 53: Advanced Semiconductor Engineering: Organizational developments
  • Exhibit 54: Advanced Semiconductor Engineering: Geographic focus
  • Exhibit 55: Advanced Semiconductor Engineering: Segment focus
  • Exhibit 56: Advanced Semiconductor Engineering: Key offerings
  • Exhibit 57: Chipbond Technology: Overview
  • Exhibit 58: Chipbond Technology: Business segments
  • Exhibit 59: Chipbond Technology: Geographic focus
  • Exhibit 60: Chipbond Technology: Key offerings
  • Exhibit 61: Intel: Overview
  • Exhibit 62: Intel: Business segments
  • Exhibit 63: Intel: Organizational developments
  • Exhibit 64: Intel: Geographic focus
  • Exhibit 65: Intel: Segment focus
  • Exhibit 66: Intel: Key offerings
  • Exhibit 67: Siliconware Precision Industries: Overview
  • Exhibit 68: Siliconware Precision Industries: Business segments
  • Exhibit 69: Siliconware Precision Industries: Organizational developments
  • Exhibit 70: Siliconware Precision Industries: Geographic focus
  • Exhibit 71: Siliconware Precision Industries: Key offerings
  • Exhibit 72: Taiwan Semiconductor Manufacturing Company: Overview
  • Exhibit 73: Taiwan Semiconductor Manufacturing Company: Business segments
  • Exhibit 74: Taiwan Semiconductor Manufacturing Company: Organizational developments
  • Exhibit 75: Taiwan Semiconductor Manufacturing Company: Geographic focus
  • Exhibit 76: Taiwan Semiconductor Manufacturing Company: Key offerings
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