Market Research Report
Global Flip Chip Packages Market 2018-2022
|Published by||TechNavio (Infiniti Research Ltd.)||Product code||694222|
|Published||Content info||123 Pages
Delivery time: 1-2 business days
|Global Flip Chip Packages Market 2018-2022|
|Published: September 4, 2018||Content info: 123 Pages||
Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The use of the technology in semiconductor chip packaging ensures a direct electrical connection of face-down electronic dies with organic or ceramic circuit boards using conductive bumps on the chip bond pads.
Technavio's analysts forecast the global flip chip packages market to grow at a CAGR of 6.35% during the period 2018-2022.
The report covers the present scenario and the growth prospects of the global flip chip packages market for 2018-2022. To calculate the market size, the report considers the sales of semiconductor devices based on flip chip packaging technology to end-user sectors including communication, computing and networking, industrial, and automotive.
The market is divided into the following segments based on geography:
Technavio's report, Global Flip Chip Packages Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
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