Asia-pacific Automotive Semiconductor Market Forecast 2022-2030

The Asia-Pacific automotive semiconductor market is estimated to project a CAGR of 9.40% during the forecast period, 2022-2030. According to industry sources, the region is the largest market for semiconductors worldwide. Also, major countries like Japan, Singapore, and India, are transitioning their road and telecom infrastructure for the automotive, which is set to increase the demand for automotive semiconductors.

MARKET INSIGHTS

Thailand, India, Japan, South Korea, China, and Rest of Asia-Pacific are evaluated for the Asia-Pacific automotive semiconductor market growth analysis. Japan leads in terms of raw materials, small active-passive components, and equipment regarding semiconductors in the region. Also, the country has a significant advantage in upstream semiconductor materials along the semiconductor value chain. In addition, the country is capable of meeting the high standards of purity required for semiconductor materials. Further, Japan signed a US$338 million semiconductor research project with the eminent Taiwan Semiconductor Manufacturing Company (TSMC) in June 2021 to develop cutting-edge chip technology. This is set to boost the country's competitiveness.

The large semiconductor industry of South Korea entails several enterprises. In addition, the country has more than 2000 semiconductor-related companies as per industry sources. Also, the country, with its huge semiconductor industry, has surpassed Taiwan and Japan to become the second-largest semiconductor country globally, after the United States. Furthermore, it is expected to be one of the lucrative markets for connected cars due to high growth in the automotive market and increased connectivity infrastructures across the region.

COMPETITIVE INSIGHTS

NXP Semiconductors NV, STMicroelectronics NV, Samsung Electronics Co Ltd, Toshiba Corporation, Qualcomm Technologies Inc, etc., are among the major firms in the market.

Our report offerings include:

Explore key findings of the overall market
Strategic breakdown of market dynamics (Drivers, Restraints, Opportunities, Challenges)
Market forecasts for a minimum of 9 years, along with 3 years of historical data for all segments, sub-segments, and regions
Market Segmentation cater to a thorough assessment of key segments with their market estimations
Geographical Analysis: Assessments of the mentioned regions and country-level segments with their market share
Key analytics: Porter's Five Forces Analysis, Vendor Landscape, Opportunity Matrix, Key Buying Criteria, etc.
Competitive landscape is the theoretical explanation of the key companies based on factors, market share, etc.
Company profiling: A detailed company overview, product/services offered, SCOT analysis, and recent strategic developments

Product Code: 7423

1. RESEARCH SCOPE & METHODOLOGY

1.1. STUDY OBJECTIVES
1.2. SCOPE OF STUDY
1.3. METHODOLOGY
1.4. ASSUMPTIONS & LIMITATIONS

2. EXECUTIVE SUMMARY

2.1. MARKET SIZE & ESTIMATES
2.2. MARKET OVERVIEW

3. MARKET DYNAMICS

3.1. KEY DRIVERS
- 3.1.1. EMERGENCE OF ELECTRIC VEHICLES
- 3.1.2. GROWING FOCUS ON CONNECTED CARS
- 3.1.3. INCREASING AUTONOMOUS FEATURES IN CARS
- 3.1.4. DEMAND FOR MORE FUNCTIONS IN ELECTRONIC CONTROL UNIT (ECU)
3.2. KEY RESTRAINTS
- 3.2.1. RISING AUTOMOTIVE COSTS
- 3.2.2. STRINGENT REGULATIONS
- 3.2.3. SHORTAGE OF SEMICONDUCTOR CHIPS

4. KEY ANALYTICS

4.1. IMPACT OF COVID-19 ON THE AUTOMOTIVE SEMICONDUCTOR MARKET
4.2. KEY MARKET TRENDS
4.3. PORTER'S FIVE FORCES ANALYSIS
- 4.3.1. BUYERS POWER
- 4.3.2. SUPPLIERS POWER
- 4.3.3. SUBSTITUTION
- 4.3.4. NEW ENTRANTS
- 4.3.5. INDUSTRY RIVALRY
4.4. OPPORTUNITY MATRIX
4.5. VENDOR LANDSCAPE
4.6. KEY BUYING CRITERIA
- 4.6.1. VALUE TO CUSTOMER
- 4.6.2. TIME-TO-MARKET
- 4.6.3. REPUTATION OF THE SELLER/MANUFACTURERS

5. MARKET BY VEHICLE TYPE

5.1. PASSENGER CARS
5.2. LIGHT COMMERCIAL VEHICLES (LCVS)
5.3. HEAVY COMMERCIAL VEHICLES (HCVS)

6. MARKET BY FUEL TYPE

6.1. GASOLINE
6.2. DIESEL
6.3. ELECTRIC/HYBRID

7. MARKET BY APPLICATION

7.1. ADVANCED DRIVER ASSISTANCE SYSTEMS
7.2. BODY ELECTRONICS
7.3. INFOTAINMENT
7.4. POWERTRAIN
7.5. SAFETY SYSTEMS

8. MARKET BY COMPONENT

8.1. PROCESSORS
8.2. ANALOG ICS
8.3. DISCRETE POWER DEVICES
8.4. SENSORS
- 8.4.1. LED
- 8.4.2. IMAGE SENSOR
- 8.4.3. POSITION SENSOR
- 8.4.4. TEMPERATURE SENSOR
- 8.4.5. PRESSURE SENSOR
- 8.4.6. OTHER SENSOR TYPES
8.5. MEMORY TYPE
- 8.5.1. DRAM
- 8.5.2. FLASH
8.6. LIGHTING DEVICES

9. GEOGRAPHICAL ANALYSIS

9.1. ASIA-PACIFIC
- 9.1.1. KEY GROWTH ENABLERS
- 9.1.2. KEY CHALLENGES
- 9.1.3. KEY PLAYERS
- 9.1.4. COUNTRY ANALYSIS
  - 9.1.4.1. CHINA
  - 9.1.4.2. JAPAN
  - 9.1.4.3. INDIA
  - 9.1.4.4. SOUTH KOREA
  - 9.1.4.5. THAILAND
  - 9.1.4.6. REST OF ASIA-PACIFIC

10. COMPETITIVE LANDSCAPE

10.1. KEY STRATEGIC DEVELOPMENTS
- 10.1.1. MERGERS & ACQUISITIONS
- 10.1.2. PRODUCT LAUNCHES & DEVELOPMENTS
- 10.1.3. PARTNERSHIPS & AGREEMENTS
- 10.1.4. BUSINESS EXPANSIONS & DIVESTITURES
10.2. COMPANY PROFILES
- 10.2.1. ANALOG DEVICES INC
- 10.2.2. INFINEON TECHNOLOGIES AG
- 10.2.3. INTEL CORPORATION
- 10.2.4. MICROCHIP TECHNOLOGY INCORPORATED
- 10.2.5. MICRON TECHNOLOGY INC
- 10.2.6. NXP SEMICONDUCTORS NV
- 10.2.7. ON SEMICONDUCTOR CORPORATION
- 10.2.8. QUALCOMM TECHNOLOGIES INC
- 10.2.9. RENESAS ELECTRONICS CORPORATION
- 10.2.10. ROBERT BOSCH GMBH
- 10.2.11. ROHM CO LTD
- 10.2.12. SAMSUNG ELECTRONICS CO LTD
- 10.2.13. STMICROELECTRONICS NV
- 10.2.14. TEXAS INSTRUMENTS INCORPORATED
- 10.2.15. TOSHIBA CORPORATION