Market Research Report
Asia Pacific 5G Chipset Market Forecast 2019-2027
|Published by||Inkwood Research||Product code||819209|
|Published||Content info||120 Pages
Delivery time: 2-3 business days
|Asia Pacific 5G Chipset Market Forecast 2019-2027|
|Published: April 8, 2019||Content info: 120 Pages||
The comprehensive 5G modem-to-antenna solution is designed to enable device makers to quickly and cost-effectively develop 5G smartphones for virtually any 5G network or region in the world.
The global 5G chipset market by the Asia Pacific is anticipated to grow with a CAGR of about 40.41% during the forecast period 2019-2027. The market had been valued at $XX million in the year 2018 and is depicted to generate a revenue of about $XX million by 2027.
The major countries considered for the market analysis are China, India, Japan, South Korea, Australia and the remaining countries collectively forming the Rest of APAC regional segment. The Asian governments will be incorporating the IoT in their long-term development projects. For, instance, the central government in China has selected several cities to pilot the smart city projects, where the 5G wireless network plays the role of a backbone to the smart cities. Hence, it is expected to provide lucrative opportunities for the manufacturers of the 5G chipset.
Huge capital investments are necessary for the widespread deployment of low- power base stations (small cells). Therefore, these infrastructure costs in the implementation of 5G network restricts the production of 5G chipsets to some extent.
The major companies of the market that have been exhaustively profiled in the report are Broadcom, Ericsson, ZTE Corporation, Qorvo, Xilinx Inc., Intel Corporation, Huawei Technologies Co., Ltd., Hewlett Packard Enterprise, Nokia Corporation, Infineon Technologies AG, MediaTek Inc., Qualcomm Technologies, Inc., Fujitsu, IBM, and Samsung Electronics Co. Ltd.