Market Research Report
Thermal Interface Materials 2020-2030: Forecasts, Technologies, Opportunities
|Published by||IDTechEx Ltd.||Product code||917175|
|Published||Content info||300 Slides
Delivery time: 1-2 business days
|Thermal Interface Materials 2020-2030: Forecasts, Technologies, Opportunities|
|Published: November 25, 2019||Content info: 300 Slides||
hermal Interface Materials 2020-2030: Forecasts, Technologies, Opportunities
Market trends and drivers for key industries; technology trends and emerging material opportunities..
Thermal management is one of the key requirements across all electronic devices, power modules, telecommunications, energy storage, and more. It is well known that the improvements in power and reduction in size results in significantly more heat that must be dissipated. It is reported that over half of electronic failure occurrences are due to thermal issues.
Thermal Interface Materials (TIM) connect a heat generating device to a heat sink or equivalent cooling mechanism. An ideal TIM will have a good contact with the heat generating device and effective through-plane conductivity; other properties are also significant depending on the application such as viscosity, adhesiveness, compressibility, lifetime, and dielectric breakdown. There are also commercial considerations for both cost and ease or rate of manufacturing.
TIM can take numerous forms, including being introduced as either a liquid or solid product. The materials choices can vary from conventionally used ceramic filler polymer resins through to liquid metals, phase change materials, and more advanced materials.
This report provides the most comprehensive view of this often, wrongly, overlooked industry. The report will look in detail at key markets including: LEDs for displays, general lighting, and automotive, consumer electronics, data centres, power electronic modules, telecommunications, and lithium-ion batteries.
Each market has very different requirements in properties and commercial restrictions. IDTechEx provide extensive details of the use cases in these markets and outlooks of material demands.
Two of the most notable trends in this industry are the rise of electric vehicles and the role of 5G in telecommunications. Lithium-ion battery packs are increasing in size to satisfy the range and will have more thermal demands with the rise of fast charging; a complete overview of the thermal management solutions is included within this report. The role in electric vehicles is not just limited to the battery packs, power electronic modules playing a key role and with increasing power demands. 5G will become dominant over the next 10-year period and with that there will be a shift in both the baseband units (BBU) and remote radio units (RRU), which provides opportunities for thermal interface materials even with the corresponding decline of 4G/LTE base station installations.
As players prepare for these growing markets there are new products and notable new entrants and acquisitions. A notable example being the 2019 acquisition of Lord by Parker Hannifin, with Lord being one of the players driving a low-cost solution for the EV market.
To achieve the desired thermal conductivity new materials are coming to the fore. This report gives significant detail on the use of graphite, carbon fiber, carbon nanotubes, graphene, and boron nitride nanostructures. There is also the development in achieving alignment, particularly of anisotropic additives, this manipulation can give key advantages for enhanced through-plane conductivity.
There are already notable use-cases of these materials in a variety of consumer electronic applications; it is becoming evident that these materials may provide the solution to some of the electronic device manufacturers' toughest questions.
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