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Market Research Report
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1060625

Asia Pacific Wafer Backgrinding Tape Market By Type (Non-UV and UV-Curable), By Wafer Size (12-Inch, 8-Inch, 6-Inch, and Others), By Country, Opportunity Analysis and Industry Forecast, 2021 - 2027

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Asia Pacific Wafer Backgrinding Tape Market By Type (Non-UV and UV-Curable), By Wafer Size (12-Inch, 8-Inch, 6-Inch, and Others), By Country, Opportunity Analysis and Industry Forecast, 2021 - 2027
Published: January 31, 2022
KBV Research
Content info: 62 Pages
Delivery time: 1-2 business days
  • Description
  • Table of Contents
  • List of Tables

The Asia Pacific Wafer Backgrinding Tape Market would witness market growth of 3.9% CAGR during the forecast period (2021-2027).

The principal protection of the wafer against mechanical grinding pressures is Wafer BG tape. BG tape would not only cover the active circuit of the wafer, but it would also assist minimise water penetration, breaking, or cushioning absorption during the grinding process, as well as maintain uniformity after the grind, as seen by total thickness variance (TTV). Wafer breakage or adhesive contamination will occur if the adhesion strength of the BG tape is not carefully assessed.

Also, BG tapes are divided into two varieties based on their adhesive material: conventional non-ultraviolet (non-UV) tape and UV curable tape. Because SOI wafers contain inherent wafer warpage, the two different varieties were tested to see if they could aid adsorb grinding stress and avoid wafer breakage during the grinding/detaping process. Both BG tapes have a tape thickness of 124-74 125m, however the adhesive substance used is different.

Because of the growing population across this region, the demand for consumer electronics would also increase in this region. This would rise the usage of wafer backgrinding tape in consumer electronics. Along with that, the presence of major semiconductor companies is also increasing in this region. In addition, the growing number of suppliers of the semiconductor material needed to make ICs is boosting memory IC output and hence, accelerate the demand for wafer backgrinding tap across this region.

The China market dominated the Asia Pacific Wafer Backgrinding Tape Market by Country 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $42 million by 2027. The Japan market is anticipated to grow a CAGR of 3.2% during (2021 - 2027). Additionally, The India market would experience a CAGR of 4.8% during (2021 - 2027).

Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.

Scope of the Study

Market Segments covered in the Report:

By Type

  • Non-UV and
  • UV-Curable

By Wafer Size

  • 12-Inch
  • 8-Inch
  • 6-Inch
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Companies Profiled

  • Furukawa Electric Co., Ltd.
  • Mitsui Chemicals, Inc.
  • Lintec Corporation
  • Nitto Denko Corporation
  • AI Technology, Inc.
  • AMC Co., Ltd.
  • Force-One Applied Materials Co., Ltd.
  • Denka Company Limited

Unique Offerings from KBV Research

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  • Highest number of market tables and figures
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  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology

  • 1.1 Market Definition
  • 1.2 Objectives
  • 1.3 Market Scope
  • 1.4 Segmentation
    • 1.4.1 Asia Pacific Wafer Backgrinding Tape Market, by Type
    • 1.4.2 Asia Pacific Wafer Backgrinding Tape Market, by Wafer Size
    • 1.4.3 Asia Pacific Wafer Backgrinding Tape Market, by Country
  • 1.5 Methodology for the research

Chapter 2. Market Overview

  • 2.1 Introduction
    • 2.1.1 Overview
      • 2.1.1.1 Market Composition and Scenario
  • 2.2 Key Factors Impacting the Market
    • 2.2.1 Market Drivers
    • 2.2.2 Market Restraints

Chapter 3. Asia Pacific Wafer Backgrinding Tape Market by Type

  • 3.1 Asia Pacific Non-UV Wafer Backgrinding Tape Market by Country
  • 3.2 Asia Pacific UV Curable Wafer Backgrinding Tape Market by Country

Chapter 4. Asia Pacific Wafer Backgrinding Tape Market by Wafer Size

  • 4.1 Asia Pacific 12-Inch Wafer Backgrinding Tape Market by Country
  • 4.2 Asia Pacific 8-Inch Wafer Backgrinding Tape Market by Country
  • 4.3 Asia Pacific 6-Inch Wafer Backgrinding Tape Market by Country
  • 4.4 Asia Pacific Others Wafer Backgrinding Tape Market by Country

Chapter 5. Asia Pacific Wafer Backgrinding Tape Market by Country

  • 5.1 China Wafer Backgrinding Tape Market
    • 5.1.1 China Wafer Backgrinding Tape Market by Type
    • 5.1.2 China Wafer Backgrinding Tape Market by Wafer Size
  • 5.2 Japan Wafer Backgrinding Tape Market
    • 5.2.1 Japan Wafer Backgrinding Tape Market by Type
    • 5.2.2 Japan Wafer Backgrinding Tape Market by Wafer Size
  • 5.3 India Wafer Backgrinding Tape Market
    • 5.3.1 India Wafer Backgrinding Tape Market by Type
    • 5.3.2 India Wafer Backgrinding Tape Market by Wafer Size
  • 5.4 South Korea Wafer Backgrinding Tape Market
    • 5.4.1 South Korea Wafer Backgrinding Tape Market by Type
    • 5.4.2 South Korea Wafer Backgrinding Tape Market by Wafer Size
  • 5.5 Singapore Wafer Backgrinding Tape Market
    • 5.5.1 Singapore Wafer Backgrinding Tape Market by Type
    • 5.5.2 Singapore Wafer Backgrinding Tape Market by Wafer Size
  • 5.6 Malaysia Wafer Backgrinding Tape Market
    • 5.6.1 Malaysia Wafer Backgrinding Tape Market by Type
    • 5.6.2 Malaysia Wafer Backgrinding Tape Market by Wafer Size
  • 5.7 Rest of Asia Pacific Wafer Backgrinding Tape Market
    • 5.7.1 Rest of Asia Pacific Wafer Backgrinding Tape Market by Type
    • 5.7.2 Rest of Asia Pacific Wafer Backgrinding Tape Market by Wafer Size

Chapter 6. Company Profiles

  • 6.1 Furukawa Electric Co., Ltd.
    • 6.1.1 Company Overview
    • 6.1.2 Financial Analysis
    • 6.1.3 Segmental and Regional Analysis
    • 6.1.4 Research & Development Expense
  • 6.2 Mitsui Chemicals, Inc.
    • 6.2.1 Company Overview
    • 6.2.2 Financial Analysis
    • 6.2.3 Segmental and Regional Analysis
    • 6.2.4 Research & Development Expense
    • 6.2.5 Recent Strategies and developments:
      • 6.2.5.1 Geographical Expansions:
  • 6.3 Lintec Corporation
    • 6.3.1 Company Overview
    • 6.3.2 Financial Analysis
    • 6.3.3 Regional & Segmental Analysis
    • 6.3.4 Research & Development Expenses
    • 6.3.5 Recent Strategies and developments:
      • 6.3.5.1 Product Launches and Product Expansions:
  • 6.4 Nitto Denko Corporation
    • 6.4.1 Company Overview
    • 6.4.2 Financial Analysis
    • 6.4.3 Segmental and Regional Analysis
    • 6.4.4 Research & Development Expense
  • 6.5 AI Technology, Inc.
    • 6.5.1 Company Overview
  • 6.6 AMC Co., Ltd.
    • 6.6.1 Company Overview
  • 6.7 Force-One Applied Materials Co., Ltd.
    • 6.7.1 Company Overview
  • 6.8 Denka Company Limited
    • 6.8.1 Company Overview
    • 6.8.2 Financial Analysis
    • 6.8.3 Regional & Segmental Analysis
    • 6.8.4 Research and Development Expenses

LIST OF TABLES

  • TABLE 1 Asia Pacific Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
  • TABLE 2 Asia Pacific Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
  • TABLE 3 Asia Pacific Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
  • TABLE 4 Asia Pacific Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
  • TABLE 5 Asia Pacific Non-UV Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
  • TABLE 6 Asia Pacific Non-UV Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
  • TABLE 7 Asia Pacific UV Curable Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
  • TABLE 8 Asia Pacific UV Curable Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
  • TABLE 9 Asia Pacific Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
  • TABLE 10 Asia Pacific Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
  • TABLE 11 Asia Pacific 12-Inch Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
  • TABLE 12 Asia Pacific 12-Inch Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
  • TABLE 13 Asia Pacific 8-Inch Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
  • TABLE 14 Asia Pacific 8-Inch Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
  • TABLE 15 Asia Pacific 6-Inch Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
  • TABLE 16 Asia Pacific 6-Inch Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
  • TABLE 17 Asia Pacific Others Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
  • TABLE 18 Asia Pacific Others Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
  • TABLE 19 Asia Pacific Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
  • TABLE 20 Asia Pacific Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
  • TABLE 21 China Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
  • TABLE 22 China Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
  • TABLE 23 China Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
  • TABLE 24 China Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
  • TABLE 25 China Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
  • TABLE 26 China Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
  • TABLE 27 Japan Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
  • TABLE 28 Japan Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
  • TABLE 29 Japan Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
  • TABLE 30 Japan Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
  • TABLE 31 Japan Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
  • TABLE 32 Japan Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
  • TABLE 33 India Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
  • TABLE 34 India Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
  • TABLE 35 India Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
  • TABLE 36 India Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
  • TABLE 37 India Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
  • TABLE 38 India Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
  • TABLE 39 South Korea Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
  • TABLE 40 South Korea Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
  • TABLE 41 South Korea Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
  • TABLE 42 South Korea Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
  • TABLE 43 South Korea Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
  • TABLE 44 South Korea Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
  • TABLE 45 Singapore Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
  • TABLE 46 Singapore Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
  • TABLE 47 Singapore Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
  • TABLE 48 Singapore Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
  • TABLE 49 Singapore Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
  • TABLE 50 Singapore Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
  • TABLE 51 Malaysia Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
  • TABLE 52 Malaysia Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
  • TABLE 53 Malaysia Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
  • TABLE 54 Malaysia Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
  • TABLE 55 Malaysia Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
  • TABLE 56 Malaysia Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
  • TABLE 57 Rest of Asia Pacific Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
  • TABLE 58 Rest of Asia Pacific Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
  • TABLE 59 Rest of Asia Pacific Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
  • TABLE 60 Rest of Asia Pacific Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
  • TABLE 61 Rest of Asia Pacific Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
  • TABLE 62 Rest of Asia Pacific Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
  • TABLE 63 Key Information -Furukawa Electric Co., Ltd.
  • TABLE 64 Key Information - Mitsui Chemicals, Inc.
  • TABLE 65 Key information - Lintec Corporation
  • TABLE 66 Key Information -Nitto Denko Corporation
  • TABLE 67 Key information - AI TECHNOLOGY, INC.
  • TABLE 68 Key information - AMC Co., Ltd.
  • TABLE 69 Key information - FORCE-ONE APPLIED MATERIALS CO., LTD.
  • TABLE 70 Key information - DENKA COMPANY LIMITED

List of Figures

  • FIG 1 Methodology for the research