Market Research Report
Failure Analysis Market by Equipment (Optical Microscope, SEM, TEM, FIB, Scanning Probe Microscope, Dual Beam), Technology (SIMS, EDX, CMP, FIB, BIM, RIE), Application, & Geography - Forecast to 2025
|Published by||MarketsandMarkets||Product code||936184|
|Published||Content info||165 Pages
Delivery time: 1-2 business days
|Failure Analysis Market by Equipment (Optical Microscope, SEM, TEM, FIB, Scanning Probe Microscope, Dual Beam), Technology (SIMS, EDX, CMP, FIB, BIM, RIE), Application, & Geography - Forecast to 2025|
|Published: May 6, 2020||Content info: 165 Pages||
"The failure analysis market is projected to grow at a CAGR of 8.3% from 2020 to 2025"
The failure analysis market is estimated to be valued at USD 3.9 billion in 2020 and is projected to reach USD 5.9 billion by 2025; it is expected to grow at a CAGR of 8.3% from 2020 to 2025. A few key factors driving the growth of this market include imposition of safety rules & regulations by governments and international bodies, rise in demand for failure analysis from the electronics & semiconductor industry, technological advancements in microscopes, and rising focus on nanotechnology and regenerative medicine.
"Energy Dispersive X-Ray Spectroscopy (EDX) technology expected to hold the largest share of failure analysis market during the forecast period"
Energy Dispersive X-Ray Spectroscopy (EDX) technology is expected to hold the largest share of failure analysis market during the forecast period. This growth is anticipated due to the integration of EDX with failure analysis equipment such as Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), and Scanning Transmission Electron Microscopy (STEM). EDX is widely used as an attachment for elemental analysis.
"Focused Ion Beam System of the failure analysis market projected to grow at the highest CAGR of during the forecast period"
Focused Ion Beam System (FIB) of the failure analysis market projected to grow at the highest CAGR of during the forecast period. FIBs are primarily used for semiconductor manufacturing. The development of commercially focused FIBs has led to their increased applications in the field of material sciences. In addition to circuit editing and Transmission Electron Microscopy (TEM) sample preparation, FIBs can now be used for microstructural analysis and prototyping nanomachining. The fastest growth of this segment can be attributed to the growing adoption of FIB systems in material science and bioscience applications.
"Failure analysis market in APAC is expected to grow at the highest CAGR during the forecast period"
Failure analysis market in APAC is expected to grow at the highest CAGR during the forecast period. This growth is attributed to opportunities in emerging economies such as India and China, establishment of collaboration centers for microscopy research, and increasing applications of correlative microscopy in life sciences and nanotechnology research in this region.
Thermo Fisher Scientific, Inc. (US), Hitachi High-Technologies Corporation (Japan), Carl Zeiss (Germany), JOEL, Ltd. (Japan), TESCAN OSRAY HOLDING (Czech Republic), Bruker (US), Semilab (Hungary), A&D Company, Ltd. (Japan), HORIBA, Ltd. (Japan), Leica Microsystems GmbH (Germany), Veeco Instruments (US), Oxford Instruments (UK), and Eurofins Scientific (Luxembourg) are among a few major players in the failure analysis market.
The failure analysis market has been segmented, based on equipment, into Optical Microscope, Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Scanning Probe Microscope, Focused Ion Beam System (FIB), Dual Beam System (FIB-SEM) and others (X-ray microscopes, Raman microscopes, and scanning acoustic microscopes). Based on technology, the failure analysis market is segmented into Energy Dispersive X-Ray Spectroscopy (EDX), Secondary Ion Mass Spectrometry (SIMS), Focused Ion Beam (FIB), Broad Ion Milling (BIM), Relative Ion Etching (RIE), Scanning Probe Microscopy (SPM) and Others (Chemical Mechanical Planarization (CMP) and X-ray Photoelectron Spectroscopy (XPS)). Based on application failure analysis market has been segmented into electronics & semiconductor, industrial science, material science, and bioscience. On the basis of geographic regions, the failure analysis market has been classified into North America, Europe, Asia Pacific (APAC), and Rest of the World (RoW).
Reasons to Buy the Report
1. This report segments the failure analysis market comprehensively and provides the closest approximations of the overall market's size, as well as that of the subsegments across different equipment, technologies, applications, and regions.
2. The report helps stakeholders understand the pulse of the market and provides information on key market drivers, restraints, challenges, and opportunities.
3. This report would help stakeholders understand their competitors better and gain more insights to enhance their position in the business. The competitive landscape section includes competitive leadership mapping, product launches, product developments, agreements, acquisitions, collaborations, and partnerships in the failure analysis market.
(Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*