Cover Image
Market Research Report

Thin Wafer Market with COVID-19 impact analysis by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology , Application, and Geography - Global Forecast to 2025

Published by MarketsandMarkets Product code 963015
Published Content info 173 Pages
Delivery time: 1-2 business days
Price
Back to Top
Thin Wafer Market with COVID-19 impact analysis by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology , Application, and Geography - Global Forecast to 2025
Published: October 1, 2020 Content info: 173 Pages
Description

The global thin wafer market size is estimated to be USD 7.6 billion in 2020 and is projected to reach 10.8 billion by 2025, at a CAGR of 7.2% during the forecast period. The market has a promising growth potential due to several factors, including the increased demand for connected devices owning to advancements in IoT, rising adoption of MEMS technology in portable health monitoring devices, increasing utilization of thin wafers in automotive communication and safety systems, miniaturization of electronic devices, and high amount of material saving.

COVID-19 sent both demand-side and supply-side shocks across the global economy. Leading thin wafer providers, such as GlobalWafers Co., Ltd. (Taiwan) and Siltronic (Germany), have incurred significant losses owing to the pandemic. Both companies have reported a decline of approximately 10% and 6% respectively in their half-year revenue as compared to the previous year. Also, devices such as MEMS, CIS, memory, RF devices, LEDs, interposers, and logic have experienced a decline in demand from end-user industries such as consumer electronics, automotive, industrial, and medical. This has resulted in a decline in the demand for thin wafers, further weakening the financial position of most of the key manufacturers.

"Polishing: The fastest growing technology segment of the thin wafer market."

The wafer polishing process creates thinner wafers than back-grinding alone and evens out any irregular topography and prevents warping that causes the wafers to weaken. The integration of RFIDs into various consumer electronic devices and identity solutions, such as smart cards and identification tags, demands thinner wafers with smooth surfaces to be able to be incorporated seamlessly into these devices. This is expected to boost the demand for wafer polishing equipment during the forecast period.

"Memory: The largest growing segment of thin wafer market, by application."

Memory segment accounted for the largest market share of the thin wafer market, by application and is dominated by smartphone manufacturers. New memory technologies such as dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), and flash memory (NAND) have replaced traditional technologies. Moreover, memory devices require high-precision bonding, and packaging for the best performance. This shift in the memory market has created a demand for thinner wafers to integrate memory chips easily into various consumer electronic devices.

"APAC is projected to be the fastest geographical market between 2020 and 2025"

APAC is expected to grow at the highest CAGR between 2020 and 2025. The high growth rate of APAC is attributed to the growing adoption of connected devices and increasing demand for wearable electronics during the forecast period. The rising number of users of smartphones and consumer devices due to growing disposable incomes is likely to stimulate the thin wafer market growth in APAC. Additionally, an increasing number of IDMs in the region is expected to boost the demand for thin wafers in the region.

Breakdown of Profiles of Primary Participants:

  • By Company: Tier 1 = 30%, Tier 2 = 45%, and Tier 3 = 25%
  • By Designation: C-level Executives = 55% and Managers = 45%
  • By Region: Americas - 45%, EMEA- 30%, and APAC - 25%

Major players profiled in this report:

The thin wafer market is dominated by a few globally established players such as Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), and SK Siltron (South Korea).

Research Coverage:

This research report segments the global thin wafer market based on Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology (Grinding, Polishing, and Dicing), Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic and Others), and Geography (Americas, EMEA, and APAC).

The report also provides a comprehensive review of market drivers, restraints, challenges, and opportunities pertaining to the thin wafer market and also includes value chain. The study also includes an in-depth competitive analysis of the key players in the market, along with their company profiles, key observations related to product and business offerings, recent developments, and key market strategies.

Key Benefits of Buying the Report:

The report will help market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall thin wafer market and the sub-segments. This report will help stakeholders understand the competitive landscape and gain more insights to position their businesses better and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.

Table of Contents
Product Code: SE 4029

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 STUDY OBJECTIVES
  • 1.2 MARKET DEFINITION
    • 1.2.1 INCLUSIONS AND EXCLUSIONS
  • 1.3 STUDY SCOPE
    • 1.3.1 MARKETS COVERED
    • FIGURE 1 GEOGRAPHIC SCOPE
    • 1.3.2 YEARS CONSIDERED
  • 1.4 CURRENCY
  • 1.5 PACKAGE SIZE
  • 1.6 MARKET STAKEHOLDERS
  • 1.7 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY

  • 2.1 RESEARCH DATA
    • FIGURE 2 THIN WAFER MARKET: RESEARCH DESIGN
    • 2.1.1 SECONDARY DATA
      • 2.1.1.1 Key data from secondary sources
    • 2.1.2 PRIMARY DATA
      • 2.1.2.1 Key data from primary sources
      • 2.1.2.2 Key industry insights
      • 2.1.2.3 Breakdown of primaries
  • 2.2 MARKET SIZE ESTIMATION
    • FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 1 (SUPPLY SIDE): REVENUE GENERATED FROM KEY MARKET PLAYERS IN THIN WAFER MARKET
    • FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 (SUPPLY SIDE): ILLUSTRATION OF REVENUE ESTIMATION OF KEY MARKET PLAYERS IN THIN WAFER MARKET
    • FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3-BOTTOM-UP ESTIMATION OF THIN WAFER MARKET, BY WAFER SIZE
    • 2.2.1 BOTTOM-UP APPROACH
      • 2.2.1.1 Approach for capturing market size by bottom-up analysis (demand side)
    • FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
    • 2.2.2 TOP-DOWN APPROACH
      • 2.2.2.1 Approach for capturing market size by top-down analysis (supply side)
    • FIGURE 7 MARKET SIZE ESTIMATION METH0DOLOGY: TOP-DOWN APPROACH
  • 2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
    • FIGURE 8 DATA TRIANGULATION
  • 2.4 RESEARCH ASSUMPTIONS AND LIMITATIONS
    • 2.4.1 ASSUMPTIONS
    • 2.4.2 LIMITATIONS

3 EXECUTIVE SUMMARY

  • 3.1 SCENARIO ANALYSIS
    • FIGURE 9 COMPARISON OF PRE- AND POST-COVID-19 MARKET SIZE AND CAGR OF THIN WAFER MARKET, BY SCENARIO, 2016-2025
    • FIGURE 10 COMPARISON OF PRE- AND POST-COVID-19 MARKET SIZE AND CAGR OF WAFER THINNING EQUIPMENT MARKET, BY SCENARIO, 2016-2025
    • 3.1.1 PRE-COVID-19 SCENARIO
    • 3.1.2 PESSIMISTIC SCENARIO (POST-COVID-19)
    • 3.1.3 OPTIMISTIC SCENARIO (POST-COVID-19)
    • 3.1.4 REALISTIC SCENARIO (POST-COVID-19)
    • FIGURE 11 300 MM WAFER TO ACCOUNT FOR LARGEST MARKET SHARE IN 2020
    • FIGURE 12 THIN WAFER MARKET, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • FIGURE 13 MEMORY APPLICATION TO HOLD LARGEST SIZE OF THIN WAFER MARKET IN 2025
    • FIGURE 14 WAFER THINNING EQUIPMENT MARKET FOR LED APPLICATION TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
    • FIGURE 15 APAC TO BE MOST FAVOURABLE REGION FOR THIN WAFER MARKET IN 2025
    • FIGURE 16 WAFER THINNING EQUIPMENT MARKET IN APAC TO HOLD LARGEST SHARE IN 2025

4 PREMIUM INSIGHTS

  • 4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN THIN WAFER MARKET
    • FIGURE 17 THIN WAFERS EXPECTED TO WITNESS HIGH ADOPTION RATE DURING FORECAST PERIOD
  • 4.2 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY
    • FIGURE 18 DICING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN COMING YEARS
  • 4.3 THIN WAFER MARKET, BY APPLICATION
    • FIGURE 19 MARKET FOR LED EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
  • 4.4 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY AND APPLICATION
    • FIGURE 20 MEMORY AND LOGIC TO BE MOST FAVOURABLE APPLICATION AREAS FOR WAFER THINNING EQUIPMENT MARKET IN 2025
  • 4.5 GEOGRAPHICAL ANALYSIS OF THIN WAFER MARKET
    • FIGURE 21 CHINA TO EXHIBIT HIGHEST CAGR IN THIN WAFER MARKET GLOBALLY BETWEEN 2020 AND 2025

5 MARKET OVERVIEW

  • 5.1 INTRODUCTION
  • 5.2 MARKET DYNAMICS
    • FIGURE 22 THIN WAFER MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
    • 5.2.1 DRIVERS
      • 5.2.1.1 Rising adoption of MEMS technology in portable health monitoring devices
      • 5.2.1.2 Increasing focus on e-learning amid COVID-19 drives demand for smartphones, tablets, laptops, and telecommunication systems
      • 5.2.1.3 Reducing sizes of electronic devices
      • 5.2.1.4 Growing smartphone and consumer electronics markets
      • 5.2.1.5 High amount of material saving
    • FIGURE 23 DRIVERS: IMPACT ANALYSIS
    • 5.2.2 RESTRAINTS
      • 5.2.2.1 Efficiency maintenance-major issue for thin wafers
    • FIGURE 24 RESTRAINTS: IMPACT ANALYSIS
    • 5.2.3 OPPORTUNITIES
      • 5.2.3.1 Expanding IC industry in China
      • 5.2.3.2 Growing adoption of IoT and AI in automotive sector
    • FIGURE 25 ESTIMATION OF IOT CONNECTIONS BY 2025 (BILLION)
      • 5.2.3.3 Rising adoption of portable devices
    • FIGURE 26 OPPORTUNITIES: IMPACT ANALYSIS
    • 5.2.4 CHALLENGES
      • 5.2.4.1 Thin wafers being volatile and susceptible to damage caused by pressure or stress
      • 5.2.4.2 Delay of investment plans for capacity expansion by wafer manufacturers due to COVID-19
    • FIGURE 27 CHALLENGES: IMPACT ANALYSIS
  • 5.3 AVERAGE SELLING PRICE TREND
    • FIGURE 28 AVERAGE COST OF THIN WAFERS PER SQUARE INCH
  • 5.4 REGULATORY UPDATE
  • 5.5 VALUE CHAIN ANALYSIS
    • FIGURE 29 VALUE CHAIN ANALYSIS: INTEGRATED DEVICE MANUFACTURERS ADD MAJOR VALUE
  • 5.6 MARKET MAP
  • 5.7 TECHNOLOGY ANALYSIS
    • 5.7.1 SILICON CARBIDE (SIC) TECHNOLOGY
    • TABLE 1 COMPARISON OF BENEFITS OF SIC TECHNOLOGY WITH OTHER TECHNOLOGIES
  • 5.8 CASE STUDY ANALYSIS
    • 5.8.1 STMICROELECTRONICS SELECT CREE'S SILICON CARBIDE BARE AND EPITAXIAL WAFERS
    • 5.8.2 INFINEON TECHNOLOGIES AND UMC ANNOUNCE MANUFACTURING AGREEMENT

6 THIN WAFER MARKET, BY PROCESS

  • 6.1 INTRODUCTION
    • FIGURE 30 TEMPORARY BONDER AND DEBONDER MARKET SIZE
  • 6.2 TEMPORARY BONDING & DEBONDING
    • 6.2.1 MARKET ADHESIVES
      • 6.2.1.1 UV-release adhesives
      • 6.2.1.2 Thermal-release adhesives
      • 6.2.1.3 Solvent-release adhesives
  • 6.3 CARRIER-LESS APPROACH (TAIKO PROCESS)

7 THIN WAFER MARKET, BY WAFER SIZE

  • 7.1 INTRODUCTION
    • FIGURE 31 300-MM WAFER MARKET TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
    • TABLE 2 THIN WAFER MARKET, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 3 THIN WAFER MARKET, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 4 THIN WAFER MARKET, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 5 THIN WAFER MARKET, BY WAFER SIZE, 2020-2025 (USD MILLION)
  • 7.2 125 MM
    • 7.2.1 MARKET FOR 125 MM WAFERS TO BE IMPACTED DUE TO GROWING ADOPTION OF LARGER DIAMETER WAFERS BY SEMICONDUCTOR MANUFACTURERS
    • TABLE 6 THIN WAFER MARKET FOR 125 MM WAFER SIZE BY APPLICATION, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 7 THIN WAFER MARKET FOR 125 MM WAFER SIZE BY APPLICATION, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 8 THIN WAFER MARKET FOR 125 MM WAFER SIZE, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 9 THIN WAFER MARKET FOR 125 MM WAFER SIZE, BY APPLICATION, 2020-2025 (USD MILLION)
  • 7.3 200 MM
    • 7.3.1 DEMAND FOR 200 MM WAFERS TO WITNESS A STEADY GROWTH DURING THE FORECAST PERIOD
    • TABLE 10 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 11 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 12 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 13 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2020-2025 (USD MILLION)
  • 7.4 300 MM
    • 7.4.1 300 MM WAFER MARKET EXPECTED TO WITNESS HIGHEST GROWTH RATE DURING THE FORECAST PERIOD
    • TABLE 14 THIN WAFER MARKET FOR 300MM WAFER SIZE, BY APPLICATION, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 15 THIN WAFER MARKET FOR 300MM WAFER SIZE, BY APPLICATION, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 16 THIN WAFER MARKET FOR 300 MM WAFER SIZE, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 17 THIN WAFER MARKET FOR 300 MM WAFER SIZE, BY APPLICATION, 2020-2025 (USD MILLION)

8 THIN WAFER MARKET, BY APPLICATION

  • 8.1 INTRODUCTION
    • FIGURE 32 THIN WAFER SHIPMENTS FOR LED APPLICATIONS TO GROW AT HIGHEST RATE BETWEEN 2020 AND 2025
    • TABLE 18 THIN WAFER MARKET SIZE, BY APPLICATION, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 19 THIN WAFER MARKET SIZE, BY APPLICATION, 2020-2025 (MILLION SQUARE INCHES)
    • FIGURE 33 MEMORY TO BE LARGEST SEGMENT OF THIN WAFERS MARKET IN 2020
    • TABLE 20 THIN WAFER MARKET SIZE, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 21 THIN WAFER MARKET SIZE, BY APPLICATION, 2020-2025 (USD MILLION)
    • TABLE 22 WAFER THINNING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 23 WAFER THINNING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020-2025 (USD MILLION)
  • 8.2 MEMS
    • 8.2.1 GROWTH OF MEMS IS ATTRIBUTED TO ITS HUGE ADOPTION IN PORTABLE ELECTRONIC DEVICES
    • TABLE 24 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 25 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 26 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 27 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2020-2025 (USD MILLION)
    • TABLE 28 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMS APPLICATION, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 29 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMS APPLICATION, BY REGION, 2020-2025 (USD MILLION)
  • 8.3 CIS
    • 8.3.1 INCREASING DEMAND FOR CIS FROM AUTOMOTIVE VERTICAL IS EXPECTED TO DRIVE THE DEMAND
    • TABLE 30 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 31 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • FIGURE 34 300 MM WAFER SIZE SEGMENT TO HOLD LARGEST MARKET SHARE IN 2020
    • TABLE 32 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 33 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2020-2025 (USD MILLION)
    • TABLE 34 WAFER THINNING EQUIPMENT MARKET SIZE FOR CIS APPLICATION, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 35 WAFER THINNING EQUIPMENT MARKET SIZE FOR CIS APPLICATION, BY REGION, 2020-2025 (USD MILLION)
  • 8.4 MEMORY
    • 8.4.1 GROWING ADOPTION OF NAND FLASH MEMORY IN MOBILE ELECTRONICS TO DRIVE THE DEMAND
    • TABLE 36 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 37 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • FIGURE 35 300 MM WAFER SIZE SEGMENT TO REGISTER HIGHEST CAGR BETWEEN 2020 AND 2025
    • TABLE 38 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 39 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2020-2025 (USD MILLION)
    • TABLE 40 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMORY APPLICATION, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 41 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMORY APPLICATION, BY REGION, 2020-2025 (USD MILLION)
  • 8.5 RF DEVICES
    • 8.5.1 GROWING ADOPTION OF RF DEVICES IN SMARTPHONES TO PROPEL THE MARKET GROWTH DURING THE FORECAST PERIOD
    • TABLE 42 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 43 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 44 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 45 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2020-2025 (USD MILLION)
    • TABLE 46 WAFER THINNING EQUIPMENT MARKET SIZE FOR RF DEVICES APPLICATION, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 47 WAFER THINNING EQUIPMENT MARKET SIZE FOR RF DEVICES APPLICATION, BY REGION, 2020-2025 (USD MILLION)
  • 8.6 LED
    • 8.6.1 INCREASING DEMAND FOR LED COMPONENTS IN HOME AND INFRASTRUCTURE MARKET TO AUGMENT THE GROWTH DURING THE FORECAST PERIOD
    • TABLE 48 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 49 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • FIGURE 36 300 MM TO BE LARGEST SEGMENT IN 2020
    • TABLE 50 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 51 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2020-2025 (USD MILLION)
    • TABLE 52 WAFER THINNING EQUIPMENT MARKET SIZE FOR LED APPLICATION, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 53 WAFER THINNING EQUIPMENT MARKET SIZE FOR LED APPLICATION, BY REGION, 2020-2025 (USD MILLION)
  • 8.7 INTERPOSERS
    • 8.7.1 REQUIREMENT FOR ADVANCED ARCHITECTURE IN MINIATURE ELECTRONIC DEVICES TO DRIVE THE DEMAND
    • TABLE 54 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 55 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 56 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 57 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2020-2025 (USD MILLION)
    • TABLE 58 WAFER THINNING EQUIPMENT MARKET SIZE FOR INTERPOSER APPLICATION, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 59 WAFER THINNING EQUIPMENT MARKET SIZE FOR INTERPOSER APPLICATION, BY REGION, 2020-2025 (USD MILLION)
  • 8.8 LOGIC
    • 8.8.1 HIGH PENETRATION OF AFFORDABLE CLOUD COMPUTING SOLUTIONS TO DRIVE THE DEMAND FOR LOGIC DEVICES
    • TABLE 60 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 61 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 62 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 63 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE, 2020-2025 (USD MILLION)
    • TABLE 64 WAFER THINNING EQUIPMENT MARKET SIZE FOR LOGIC APPLICATION, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 65 WAFER THINNING EQUIPMENT MARKET SIZE FOR LOGIC APPLICATION, BY REGION, 2020-2025 (USD MILLION)
  • 8.9 OTHERS
    • TABLE 66 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE, 2016-2019 (MILLION SQUARE INCHES)
    • TABLE 67 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
    • TABLE 68 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE, 2016-2019 (USD MILLION)
    • TABLE 69 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE, 2020-2025 (USD MILLION)
    • TABLE 70 WAFER THINNING EQUIPMENT MARKET SIZE FOR OTHER APPLICATIONS, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 71 WAFER THINNING EQUIPMENT MARKET SIZE FOR OTHER APPLICATIONS, BY REGION, 2020-2025 (USD MILLION)
  • 8.10 MOST NEGATIVELY IMPACTED INDUSTRY BY COVID-19
    • 8.10.1 RF DEVICES
    • FIGURE 37 PRE- AND POST-COVID-19 MARKET COMPARISON FOR THIN WAFER MARKET, BY RF DEVICES APPLICATION
    • FIGURE 38 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT, BY RF DEVICES APPLICATION
    • TABLE 72 THIN WAFER MARKET FOR RF DEVICES APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD MILLION)
    • TABLE 73 WAFER THINNING EQUIPMENT MARKET FOR RF DEVICES APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD MILLION)
      • 8.10.1.1 Impact analysis
  • 8.11 LEAST IMPACTED INDUSTRY BY COVID-19
    • 8.11.1 LED
    • FIGURE 39 PRE- AND POST-COVID-19 MARKET COMPARISON FOR THIN WAFER MARKET, BY LED APPLICATION
    • FIGURE 40 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT, BY LED APPLICATION
    • TABLE 74 THIN WAFER MARKET FOR LED APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD MILLION)
    • TABLE 75 WAFER THINNING EQUIPMENT MARKET FOR LED APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD MILLION)
      • 8.11.1.1 Impact analysis

9 THIN WAFER MARKET, BY TECHNOLOGY

  • 9.1 INTRODUCTION
    • FIGURE 41 WAFER POLISHING EQUIPMENT MARKET TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
    • TABLE 76 WAFER THINNING EQUIPMENT MARKET SIZE, BY TECHNOLOGY, 2016-2019 (USD MILLION)
    • TABLE 77 WAFER THINNING EQUIPMENT MARKET SIZE, BY TECHNOLOGY, 2020-2025 (USD MILLION)
  • 9.2 WAFER GRINDING
    • 9.2.1 WAFER GRINDING PROCESS IS ATTRACTING MANUFACTURERS DUE TO ITS PROMISING APPLICATION IN THE MINIATURIZATION AND PACKAGING OF SEMICONDUCTOR DEVICES
    • TABLE 78 WAFER GRINDING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 79 WAFER GRINDING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020-2025 (USD MILLION)
    • TABLE 80 WAFER GRINDING EQUIPMENT MARKET SIZE, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 81 WAFER GRINDING EQUIPMENT MARKET SIZE, BY REGION, 2020-2025 (USD MILLION)
  • 9.3 WAFER POLISHING
    • 9.3.1 DEMAND FOR THIN WAFERS WITH SMOOTH SURFACE FOR SEAMLESS INTEGRATION TO DRIVE THE DEMAND FOR WAFER POLISHING EQUIPMENT
    • TABLE 82 WAFER POLISHING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 83 WAFER POLISHING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020-2025 (USD MILLION)
    • TABLE 84 WAFER POLISHING EQUIPMENT MARKET SIZE, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 85 WAFER POLISHING EQUIPMENT MARKET SIZE, BY REGION, 2020-2025 (USD MILLION)
  • 9.4 WAFER DICING
    • 9.4.1 WAFER DICING EQUIPMENT MARKET TO ACCOUNT FOR THE LARGEST MARKET SHARE DURING THE FORECAST PERIOD
    • TABLE 86 WAFER DICING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 87 WAFER DICING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020-2025 (USD MILLION)
    • TABLE 88 WAFER DICING EQUIPMENT MARKET SIZE, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 89 WAFER DICING EQUIPMENT MARKET SIZE, BY REGION, 2020-2025 (USD MILLION)

10 THIN WAFER MARKET, BY GEOGRAPHY

  • 10.1 INTRODUCTION
    • FIGURE 42 THIN WAFER MARKET: GEOGRAPHIC SNAPSHOT, 2020-2025
    • TABLE 90 THIN WAFER MARKET, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 91 THIN WAFER MARKET, BY REGION, 2020-2025 (USD MILLION)
    • TABLE 92 WAFER THINNING EQUIPMENT MARKET, BY REGION, 2016-2019 (USD MILLION)
    • TABLE 93 WAFER THINNING EQUIPMENT MARKET, BY REGION, 2020-2025 (USD MILLION)
  • 10.2 AMERICAS
    • FIGURE 43 AMERICAS: GEOGRAPHIC SNAPSHOT, 2019
    • TABLE 94 AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2016-2019 (USD MILLION)
    • TABLE 95 AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2020-2025 (USD MILLION)
    • TABLE 96 AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 97 AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2020-2025 (USD MILLION)
    • 10.2.1 IMPACT OF COVID-19 ON THIN WAFER MARKET IN AMERICAS
    • FIGURE 44 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR THIN WAFER MARKET IN AMERICAS
    • FIGURE 45 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN AMERICAS
    • TABLE 98 THIN WAFER MARKET IN AMERICAS, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD BILLION)
    • TABLE 99 WAFER THINNING EQUIPMENT MARKET IN AMERICAS, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD MILLION)
    • 10.2.2 US
      • 10.2.2.1 US would lead thin wafer market in Americas during forecast period
    • 10.2.3 CANADA
      • 10.2.3.1 Government support to promote use of electric vehicles and growing telecom industry to drive thin wafer market in Canada
    • 10.2.4 REST OF AMERICAS
      • 10.2.4.1 Growing demand for semiconductor devices from consumer electronics and automotive industries to fuel thin wafer market growth in Rest of Americas
  • 10.3 EMEA
    • FIGURE 46 EMEA: GEOGRAPHIC SNAPSHOT, 2019
    • TABLE 100 EMEA: THIN WAFER MARKET, BY COUNTRY, 2016-2019 (USD MILLION)
    • TABLE 101 EMEA: THIN WAFER MARKET, BY COUNTRY, 2020-2025 (USD MILLION)
    • TABLE 102 EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 103 EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2020-2025 (USD MILLION)
    • 10.3.1 IMPACT OF COVID-19 ON THIN WAFER MARKET IN EMEA
    • FIGURE 47 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR THIN WAFER MARKET IN EMEA
    • FIGURE 48 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN EMEA
    • TABLE 104 THIN WAFER MARKET IN EMEA, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD BILLION)
    • TABLE 105 WAFER THINNING EQUIPMENT MARKET IN EMEA, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD MILLION)
    • 10.3.2 UK
      • 10.3.2.1 Increase in demand for portable medical devices in UK to spur demand for thin wafers
    • 10.3.3 GERMANY
      • 10.3.3.1 Growing adoption of MEMS sensors in automotive industry to drive thin wafer market
    • 10.3.4 FRANCE
      • 10.3.4.1 Increased EV manufacturing to bolster market growth in France
    • 10.3.5 REST OF EMEA
      • 10.3.5.1 Dearth of thin wafer manufacturers could be an opportunity for new investments in Rest of EMEA
  • 10.4 APAC
    • FIGURE 49 APAC: GEOGRAPHIC SNAPSHOT, 2019
    • TABLE 106 APAC: THIN WAFER MARKET, BY COUNTRY, 2016-2019 (USD MILLION)
    • TABLE 107 APAC: THIN WAFER MARKET, BY COUNTRY, 2020-2025 (USD MILLION)
    • TABLE 108 APAC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2016-2019 (USD MILLION)
    • TABLE 109 APAC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2020-2025 (USD MILLION)
    • 10.4.1 IMPACT OF COVID-19 ON THIN WAFER MARKET IN APAC
    • FIGURE 50 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR THIN WAFER MARKET IN APAC
    • FIGURE 51 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN APAC
    • TABLE 110 THIN WAFER MARKET IN APAC, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD BILLION)
    • TABLE 111 WAFER THINNING EQUIPMENT MARKET IN APAC, BY PRE- AND POST-COVID-19 SCENARIO, 2016-2025 (USD MILLION)
    • 10.4.2 TAIWAN
      • 10.4.2.1 Presence of several fabrication facilities and IC manufacturing firms to drive thin wafer market in Taiwan
    • 10.4.3 CHINA
      • 10.4.3.1 China's focus on achieving 70% IC self-sufficiency by 2025 to drive thin wafer market
    • 10.4.4 JAPAN
      • 10.4.4.1 Presence of major market players and end-user industries drive thin wafer market in Japan
    • 10.4.5 SOUTH KOREA
      • 10.4.5.1 South Korea is expected to hold largest share of thin wafer market in APAC
    • 10.4.6 REST OF APAC
      • 10.4.6.1 Growing demand for connected devices to drive thin wafer market in Rest of APAC

11 COMPETITIVE LANDSCAPE

  • 11.1 COMPETITIVE LANDSCAPE OVERVIEW
    • FIGURE 52 KEY DEVELOPMENTS OF LEADING PLAYERS IN THIN WAFER MARKET BETWEEN JANUARY 2017 AND JULY 2020
  • 11.2 MARKET SHARE ANALYSIS OF KEY COMPANIES, 2019
    • TABLE 112 SHARE OF TOP 5 PLAYERS IN THIN WAFER MARKET, 2019
  • 11.3 COMPETITIVE SITUATION AND TRENDS
    • FIGURE 53 PRODUCT LAUNCHES IS THE KEY STRATEGY ADOPTED BY THE PLAYERS IN THE THIN WAFER MARKET
    • 11.3.1 PRODUCT LAUNCHES
    • TABLE 113 PRODUCT LAUNCHES, JANUARY 2017-JULY 2020
    • 11.3.2 AGREEMENTS, COLLABORATIONS, AND CONTRACTS
    • TABLE 114 AGREEMENTS, COLLABORATIONS, AND CONTRACTS, JANUARY 2017-JULY 2020
    • 11.3.3 EXPANSIONS AND MERGERS & ACQUISITIONS
    • TABLE 115 EXPANSIONS AND MERGERS & ACQUISITIONS, JANUARY 2017-JULY 2020
  • 11.4 THIN WAFER MARKET, COMPANY EVALUATION MATRIX, 2019
    • 11.4.1 STAR
    • 11.4.2 PERVASIVE
    • 11.4.3 PARTICIPANT
    • 11.4.4 EMERGING LEADER
    • FIGURE 54 THIN WAFER MARKET, COMPANY EVALUATION MATRIX (2019)
  • 11.5 STRENGTH OF PRODUCT PORTFOLIO
    • FIGURE 55 PRODUCT PORTFOLIO ANALYSIS OF TOP PLAYERS IN THIN WAFER MARKET, 2019
  • 11.6 BUSINESS STRATEGY EXCELLENCE
    • FIGURE 56 BUSINESS STRATEGY EXCELLENCE OF TOP PLAYERS IN THIN WAFER MARKET, 2019

12 COMPANY PROFILES

  • 12.1 INTRODUCTION

(Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view)**

  • 12.2 KEY PLAYERS
    • 12.2.1 SK SILTRON
    • FIGURE 57 SK SILTRON: COMPANY SNAPSHOT
    • 12.2.2 SHIN-ETSU CHEMICAL CO., LTD.
    • FIGURE 58 SHIN-ETSU CHEMICAL CO., LTD.: COMPANY SNAPSHOT
    • 12.2.3 SILTRONIC
    • FIGURE 59 SILTRONIC: COMPANY SNAPSHOT
    • 12.2.4 SUMCO CORPORATION
    • FIGURE 60 SUMCO CORPORATION: COMPANY SNAPSHOT
    • 12.2.5 GLOBALWAFERS CO., LTD.
    • FIGURE 61 GLOBALWAFERS CO., LTD.: COMPANY SNAPSHOT
    • 12.2.6 SUSS MICROTEC
    • FIGURE 62 SUSS MICROTEC AG: COMPANY SNAPSHOT
    • 12.2.7 LINTEC CORPORATION
    • FIGURE 63 LINTEC CORPORATION: COMPANY SNAPSHOT
    • 12.2.8 DISCO CORPORATION
    • FIGURE 64 DISCO CORPORATION: COMPANY SNAPSHOT
    • 12.2.9 3M
    • FIGURE 65 3M: COMPANY SNAPSHOT
    • 12.2.10 APPLIED MATERIALS
    • FIGURE 66 APPLIED MATERIALS, INC.: COMPANY SNAPSHOT
  • 12.3 FIVE YEAR REVENUE ANALYSIS OF MAJOR PLAYERS IN THE THIN WAFER MARKET
    • FIGURE 67 THIN WAFER MARKET: FIVE YEAR REVENUE SNAPSHOT OF MAJOR PLAYERS (USD MILLION)
  • 12.4 RIGHT TO WIN
  • 12.5 OTHER COMPANIES
    • 12.5.1 NISSAN CHEMICAL CORPORATION
    • 12.5.2 MECHATRONIC SYSTEMTECHNIK
    • 12.5.3 SYNOVA
    • 12.5.4 EV GROUP
    • 12.5.5 BREWER SCIENCE
    • 12.5.6 ULVAC GMBH
    • 12.5.7 WAFER WORKS CORPORATION
    • 12.5.8 OKMETIC
    • 12.5.9 ATECOM TECHNOLOGY CO., LTD.
    • 12.5.10 SILTRONIX SILICON TECHNOLOGIES

*Details on Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view might not be captured in case of unlisted companies.

13 APPENDIX

  • 13.1 INSIGHTS OF INDUSTRY EXPERTS
  • 13.2 DISCUSSION GUIDE
  • 13.3 KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
  • 13.4 AVAILABLE CUSTOMIZATIONS
  • 13.5 RELATED REPORTS
  • 13.6 AUTHOR DETAILS
Back to Top