Market Research Report
Ultra-Small Case Size Passive Electronic Components: World Markets, Technologies & Opportunities: 2017-2022
|Published by||Paumanok Publications, Inc.||Product code||550275|
|Published||Content info||280 Pages
Delivery time: 1-2 business days
|Ultra-Small Case Size Passive Electronic Components: World Markets, Technologies & Opportunities: 2017-2022|
|Published: August 30, 2017||Content info: 280 Pages||
This report analyzes the global markets for ultra-small capacitors, resistors and inductors consumed in portable electronics and other product markets where the volumetric efficiency of the passive component, and its ability to get smaller in the future, are key aspects behind purchases. The study focuses on the mass markets for surface mount components, with emphasis upon the multilayered ceramic chip capacitors, molded tantalum chip capacitors, polymer aluminum chip and SMD film chip capacitors; thick film chip resistors, ferrite beads and ceramic chip inductors. The study focuses on the consumption of these mass produced passive electronic components by end-use market segment and by world region. The study focuses on the value and volume of demand for each type of component and the changes in technology that enabled the component manufacturers to achieve such ultra-small volumetric efficiency using ceramics, metals and plastics. The study focuses on key ears of the market, especially the ability for MLCC to continually produce smaller case size chips with increasingly larger capacitance; while competing technologies, such as tantalum, polymer aluminum and PPS,PEN and PET film are attempting to match capacitance, or compete in markets on performance or voltage handling capability of the finished product. The study painstakingly compares the competitive nature of capacitors by case size and documents the movements in consumption based upon breakthroughs in volumetric efficiency of components, brought about by changes in engineered raw materials. The study also addresses the differences in sister components, such as capacitors, linear resistors, discrete inductors and non-linear resistors and which products are lagging behind other components and which components and case sizes are really growing in demand. The competitive nature of each sub-category of the passive component market is given with shares and market shares in MLCC, thick film chip resistors, tantalum capacitors, SMD plastic film chips and organic polymer aluminum capacitors. Detailed volume forecasts by case size are given by year from 2017 to 2022 for MLCC, tantalum chips and thick film chip resistors. Published August 2017, 280 pages, 139 Tables and Graphs. Key Topics within This Report Are- Global Passive Component Markets by Type and Case Size: 1991-2017 by year, with Forecasts to 2022 The Leading Edge Markets in 01005 and 008004 The Core Value Markets in The 0201 to 0805 Range The Leading Edge Markets in Polymer Molded Electrolytic Chips The Leading Edge Markets in Thick Film Chip Resistors BY Case Size Larger Case Markets in 1210 to 2917. Key Technology Changes in MLCC and tantalum Raw Materials Impacting Capacitance End-Market Drivers Behind Increased Demand For Ultra-Small Passive Components.
Passive Electronic Components, which are covered in this report are defined as Capacitors (C ), Linear Resistors (R ) and Discrete Inductors (L).
The 20 individual products that are covered in this report include the following: