M2M/IoT Development - Sub-1GHz Communications: Technologies, Markets, Applications

PUBLISHED: May 12, 2023

PAGES: 201 Pages

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The rapid development of Internet-of-Things (IoT) and Machine-to-Machine (M2M) communications requires plenty of the frequency spectra.

This report addresses features and properties of Sub-1GHz communication, and its applications for IoT/M2M. The report is updated and revised issue of a Practel's report on this subject issued previously.

The Sub-1GHz unlicensed industrial, scientific, and medical (ISM) bands of 315, 433, 800 and 902 to 928 MHz represent a great solution for some uses. Based on pure physics, these lower frequencies naturally deliver more distance than higher frequencies for a given power level, receiver sensitivity, and antenna gain.

The following Sub-1GHz technologies, related markets, standards and applications have been addressed to show their value in the IoT/M2M development:

Short range communications

ZigBee/802.15.4
Z-Wave
EnOcean.

Long range communications

IEEE 802.15.4g
IEEE 802.11af
IEEE 802.11ah
IEEE 802.22
Weightless
UNB (Ultra-narrow Band)
Other.

The major attractions of these Sub-1GHz technologies for IoT/M2M communications include:

Extended range - they allow 5-10 times longer reaches over 2.4 GHz band transmissions. This is the result of smaller losses when signal is traveling through various obstacles; besides, Sub-1GHz ISM bands are less crowded

Low power consumption

Support of multiple applications.

The industry and consumers show great interest in the utilization of Sub-1GHz ISM bands for IoT/M2M communications; there are great opportunities that have not been realized until recently.

The report also surveys related to this report industries and patents.

The report is written for a wide audience of technical and managerial staff involved in the development of the IoT/M2M market.

1.0. Introduction

1.1. General
1.2. Specifics
1.3. Scope
1.4. Research Methodology
1.5. Target Audience

2.0. Efforts: Development of M2M Communications and IoT

2.1. M2M Communications Development
- 2.1.1. Special Needs
  - 2.1.1.1. Spectrum
  - 2.1.1.2. Summary
- 2.1.2. Standardization - Industry Activities
  - 2.1.2.1. IEEE
  - 2.1.2.2. ETSI
  - 2.1.2.3. ITU
  - 2.1.2.4. oneM2M Alliance
    - 2.1.2.4.1. Service Layer Architecture
    - 2.1.2.4.2. Benefits
  - 2.1.2.5. M2M Alliance
  - 2.1.2.6. Open Mobile Alliance (OMA)
  - 2.1.2.7. Summary
- 2.1.3. Market
  - 2.1.3.1. Statistics
  - 2.1.3.2. Estimate
- 2.1.4. Industry: Innovations
  - Arqiva/Sensus
  - Iota Networks
  - Kore Telematics
  - SigFox/Telit
  - Telensa/Plextek
2.2. IoT
- 2.2.1. M2M and IoT
  - 2.2.1.1. M2M
  - 2.2.1.2. IoT
  - 2.2.1.3. IoT - M2M
- 2.2.2. Open Interconnect Consortium
- 2.2.3. Industrial Internet Consortium
- 2.2.4. IoT Platforms
- 2.2.5. IoT and ITU
- 2.2.6. IoT International Forum
- 2.2.7. IEEE 2413 and IoT
  - 2.2.7.1. 2413.1
  - 2.2.7.2. P2413.2
- 2.2.8. ISO/IEC
  - 2.2.8.1. Layered Structure
- 2.2.9. IoT - Market
- 2.2.10. Applications

3.0. Specifics of Sub-1GHz Transmission

3.1. ITU Designation
3.2. Sub-1GHz Transmission Benefits and Limitations
3.3. Generations
- 3.3.1. Details

4.0. Sub-1GHz Transmission: Support for Long-reach IoT/M2M Communications

4.1. IEEE-802.15.4g-Smart Utility Network
- 4.1.1. General
- 4.1.2. Need
- 4.1.3. Value
- 4.1.4. Overview-PHY
- 4.1.5. Regions
  - 4.1.5.1. Frequencies Allocations
- 4.1.6. Details
  - 4.1.6.1. Requirements: Major Characteristics
  - 4.1.6.2. Considerations
  - 4.1.6.3. Network Specifics
  - 4.1.6.4. PHY/MAC Modifications
- 4.1.7. Market
- 4.1.8. Summary
- 4.1.9. Wi-SUN
- 4.1.10. Manufacturers - Examples
  - Analog Devices
  - Elster (a part of Honeywell)
  - Microchip
  - TI
4.2. IEEE 802.22-19
- 4.2.1. General
- 4.2.2. Status - IEEE 802.22-19
- 4.2.3. Developments
- 4.2.4. IEEE 802.22-2019 Overview
  - 4.2.4.1. Major Characteristics
- 4.2.5. IEEE 802.22 Details
  - 4.2.5.1. Physical Layer - Major Characteristics
  - 4.2.5.2. MAC Layer
- 4.2.6. Cognitive Functions
- 4.2.7. IEEE 802.22 - Marketing Considerations for SG
- 4.2.8. Major Applications
- 4.2.9. Usage Models
- 4.2.10. Benefits
- 4.2.11. Summary
- 4.2.12. Group
  - 4.2.12.1. IEEE 802.22.1
  - 4.2.12.2. IEEE 802.22.2
  - 4.2.12.3. IEEE 802.22a-2014
  - 4.2.12.4. IEEE 802.22b-2015
  - 4.2.12.5. IEEE P802.22.3-Standard for Spectrum Characterization and Occupancy Sensing
  - 4.2.12.6. 8802-22:2015/Amd 1-2017
4.3. IEEE 802.11ah (Wi-Fi HaLow)
- 4.3.1. General
- 4.3.2. Goal and Schedule
- 4.3.3. Attributes
- 4.3.4. Use Cases
- 4.3.5. PHY
  - 4.3.5.1. Bandwidth
  - 4.3.5.2. Channelization
  - 4.3.5.3. Transmission Modes and MIMO
- 4.3.6. MAC Layer
- 4.3.7. Summary
- 4.3.8. Vendors
  - Methods2Business
  - Morse Micro
  - Newracom-Aviacomm
  - Palma Ceia SemiDesign
  - Silex
4.4. IEEE 802.11af - White-Fi
- 4.4.1. General: Expectations - White-Fi
- 4.4.2. Differences
- 4.4.3. Benefits
- 4.4.4. Specifics
  - 4.4.4.1. Interference
  - 4.4.4.2. Main Principles
- 4.4.5. PHY
- 4.4.6. Architecture
- 4.4.7. Market
- 4.4.8. Vendors
  - Aviacomm
  - Carlson Wireless
4.5. Ultra Narrow Band (UNB)
- 4.5.1. Origin
- 4.5.2. Support
- 4.5.3. Major Features
- 4.5.4. SigFox
  - 4.5.4.1. Company
  - 4.5.4.2. Technology-Details
  - 4.5.4.3. Uplink
  - 4.5.4.4. Downlink
  - 4.5.4.5. SmartLNB
  - 4.5.4.6. Coverage
  - 4.5.4.7. Use Cases
  - 4.5.4.8. Industry
    - Adeunis RF
    - Innocomm
    - Microchip
    - On Semiconductor
    - Telit
    - TI
4.6. Weightless Communications
- 4.6.1. SIG
- 4.6.2. Weightless-N
  - 4.6.2.1. General
  - 4.6.2.2. Open Standard
  - 4.6.2.3. Nwave
  - 4.6.2.4. Summary
- 4.6.3. Weightless-P
  - 4.6.3.1. General
  - 4.6.3.2. Details
  - 4.6.3.3. Vendors
- 4.6.4. Weightless Technologies and Competition

5.0. Sub-1GHz Transmission: Support of Short-reach IoT/M2M Communications

5.1. ZigBee - IEEE 802.15.4
- 5.1.1. General
- 5.1.2. Sub-1GHz ZigBee: Specifics
- 5.1.3. ZigBee Acceptance
- 5.1.4. Major Features: ZigBee/802.15.4
- 5.1.5. Device Types
- 5.1.6. Protocol Stack
  - 5.1.6.1. Physical and MAC Layers - IEEE802.15.4
  - 5.1.6.2. Upper Layers
- 5.1.7. Security
- 5.1.8. Power Consumption
- 5.1.9. ZigBee Technology Benefits and Limitations
- 5.1.10. Standardization Process
  - 5.1.10.1. Ratifications
  - 5.1.10.2. Alliance
    - 5.1.10.2.1. ZigBee Pro 2017
- 5.1.11. Applications Specifics - Application Profiles
  - 5.1.11.1. "Green" ZigBee
  - 5.1.11.2. ZigBee Telecom Services
  - 5.1.11.3. Building Automation
  - 5.1.11.4. Smart Energy Profile
    - 5.1.11.4.1. Features
    - 5.1.11.4.2. Smart Energy Profile V.2.0
    - 5.1.11.4.3. ZigBee IP
  - 5.1.11.5. ZigBee Network Devices-IP Gateway
- 5.1.12. Market
  - 5.1.12.1. Expectations-Technology Stack
  - 5.1.12.2. Segments
  - 5.1.12.3. Forecast
- 5.1.13. Sub-1GHz ZigBee: Certification
- 5.1.14. Industry
  - Adaptive Networks Solutions (RF Sub-1GHz)
  - Microchip Technologies (Modules, Sub-1GHz)
  - NXP
  - Renesas (Platforms, AMR, Sub-1GHz)
  - Silicon Laboratories (Chipsets, Modules, Sub-1GHz)
  - TI (Chipsets, Sub-1GHz)
5.2. EnOcean: General
- 5.2.1. The Company
- 5.2.2. EnOcean Alliance
- 5.2.3. Standard
  - 5.2.3.1. Features
  - 5.2.3.2. Drivers
- 5.2.4. Technology Details
  - 5.2.4.1. Framework
  - 5.2.4.2. Generations
- 5.2.5. Profiles
- 5.2.6. Benefits
- 5.2.7. Market Estimate
- 5.2.8. Industry
  - BSC Magnum
  - Beckhoff
  - Echoflex
  - Illumra
  - Leviton
  - Thermokon
5.3. Z-Wave
- 5.3.1. General
- 5.3.2. Z-Wave Alliance
- 5.3.3. Benefits
- 5.3.4. Details
  - 5.3.4.1. General
  - 5.3.4.2. Characteristics
  - 5.3.4.3. ITU G.9959
- 5.3.5. Advanced Energy Control Framework
- 5.3.6. Z-Wave and Smart Metering
- 5.3.7. Selected Vendors
  - Aeon Labs-Aeotec
  - NorthQ
  - Vera Control
- 5.3.8. Market Estimate
  - 5.3.8.1. Model
  - 5.3.8.2. Results

6.0. Conclusions

Appendix I: IEEE 802.15.4g Characteristics

Appendix II: 802.11ah - related Patents Survey (2018-2022)

Appendix III: Z-Wave - related Patents Survey (2018-2022)

Appendix IV: 802.22 - related Patents Survey (2018-2022)

Appendix V: EnOcean - related Patents Survey (2018-2022)

Appendix VI: 802.11af - related Patents Survey (2018-2022)

List of Figures

Figure 1: Regions: Sub-1GHz Band
Figure 2: IoT Environment
Figure 3: Key M2M Elements
Figure 4: ETSI Activity
Figure 5: Use Cases
Figure 6: ETSI-High-level M2M Architecture
Figure 7: oneM2M Layered Model
Figure 8: Service Layer Positioning
Figure 9: Summary - M2M Standardization
Figure 10: M2M Major Applications
Figure 11: Estimate: M2M Traffic Growth (PB/Month)
Figure 12: Estimate-M2M Service Market - Global ($B)
Figure 13: Estimate: Cellular Operators Revenue - M2M Services - Global ($B)
Figure 15: IoT - Layered Structure
Figure 16: Estimate: IoT Technologies and Applications Market - Global ($T)
Figure 17: Estimate - Total Number of Smart Devices in Smart Homes - Global (Bil. Units)
Figure 18: M2M/IoT Spectrum of Applications
Figure 19: Bands - ITU Designation
Figure 20: Range
Figure 21: Power Consumption
Figure 22: Rates
Figure 23: Global Sub-1GHz Frequencies
Figure 24: Sub-1GHz Transmission Characteristics
Figure 25: ZigBee-2.4 GHz vs. 900 MHz
Figure 26: Properties Comparison
Figure 27: SUN Connectivity
Figure 28: 802.15.4g Radio Operating Bands
Figure 29: Estimate: Global Market - Smart Grid SUN ($B)
Figure 30: Estimate: 802.22 Technology- U.S. Market Size ($B)
Figure 31: IEEE 802.22 Usage Scenarios
Figure 32: Major Characteristics: IEEE 802.22
Figure 33: Standardized Frequency Spectrum (sub-1 GHz)
Figure 34: 802.11ah - Channelization Plan in U.S.
Figure 35: 802.11ah Features Summary
Figure 36: 802.11af Network Setup
Figure 37: Comparison
Figure 38: Uplink Frame Format
Figure 39: Downlink Frame Format
Figure 40: ZigBee Characteristics
Figure 41: ZigBee/802.15.4 Protocol Stack
Figure 42: ZigBee/802.15.4 Characteristics
Figure 43: Profiles
Figure 44: ZigBee IP Gateway Protocol Stack
Figure 45: Technology Stack
Figure 46: Estimate - U.S. Market Size - ZigBee Chips Shipped ($B)
Figure 47: Estimate - U.S. Market Size - ZigBee Chips - Sub-1GHz Shipped ($B)
Figure 48: ZigBee Market Segmentation (2022)
Figure 49: ZigBee Market Segmentation (2026)
Figure 50: Functionalities
Figure 51: Major Features
Figure 52: Energy Consumption Requirements
Figure 53: Estimate: EnOcean Equipment Sales - Global ($B)
Figure 54: Estimate: EnOcean Industry Modules Sales - Global (Mil. Units)
Figure 55: Estimate: U.S. Small SH Z-Wave IC Market Size ($B)
Figure 56: Estimate: U.S. Large SH Z-Wave IC Market ($B)