Market Research Report
Global TCB Bonder Market Research Report 2018
|Published by||QYResearch||Product code||651700|
|Published||Content info||137 Pages
Delivery time: 2-3 business days
|Global TCB Bonder Market Research Report 2018|
|Published: June 13, 2018||Content info: 137 Pages||
Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global TCB Bonder market is driven by increased TCB Bonder usage: memory applications currently, logic devices next. Meanwhile, TCB Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
The global TCB Bonder Market size was valued at $32.68 million in 2017, and is expected to reach at $122.31 million by 2023, growing at a CAGR of 22.73% from 2018 to 2023. The TCB Bonder market has witnessed significant growth in the past few years, and is expected to maintain this trend during the forecast period.
This report studies the TCB Bonder market status and outlook of global and major regions, from angles of manufacturers, regions, product types and end industries; this report analyzes the top manufacturers in global and major regions, and splits the TCB Bonder market by product type and applications/end industries.
The major players in global TCB Bonder market include:
Geographically, this report is segmented into several key Regions, with production, consumption, revenue, market share and growth rate of TCB Bonder in these regions, from 2013 to 2023 (forecast), covering:
On the basis of product, the TCB Bonder market is primarily split into:
On the basis on the end users/applications, this report covers: