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Market Research Report

Die Attach Equipment - Global Market Outlook (2018-2027)

Published by Stratistics Market Research Consulting Product code 939170
Published Content info 134 Pages
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Die Attach Equipment - Global Market Outlook (2018-2027)
Published: May 1, 2020 Content info: 134 Pages
Description

According to Stratistics MRC, the Global Die Attach Equipment market is expected to growing at a CAGR of 7.8% during the forecast period. Some of the key factors propelling the market growth include growing demand of ausn eutectic die-attach technology, increasing demand of discrete power devices, Rising demand for compact devices, and growing adoption of copper clips. However, dimensional changes during processing and service life and mechanical unbalance are restricting the market growth.

Die attach is a key process step in semiconductor packaging. It covers all devices across various applications and is a key contributor to assembly cost. The die attach equipment business will benefit from assembly and packaging opportunities created by the above-mentioned trends. This equipment can be classified into two categories: die bonders and flip-chip (FC) bonders. The die attach equipment offering includes multi-chip bonders for advanced packaging through market techniques such as epoxy, soft solder bonders, etc. to various applications such as Memory, RF & MEMS, LED, etc.

By application, light-emitting diode (LED) segment is expected to grow at the significant rate during the forecast period. Die attach material represents a key role in the performance and reliability of mid, high, and super-high power LEDs. With an increasing LED penetration rate, the demand for die-attach equipment is increasing. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and the sintered materials have all been used for LED die attach.

On the basis of geography, Asia Pacific region is anticipated to witness considerable market growth during the forecast period, due to increasing number of IDMs (Integrated Device Manufacturer) in the region. The mass production of electronic products, which includes smartphones, wearables, and white goods, in China and Taiwan, makes use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die-attach equipment in the assembly process of these components. Furthermore, India is also witnessing growth in a number of smart cities, due to government initiatives and is expected to incorporate electronic solutions for purposes, such as surveillance, maintenance, monitoring, etc.

Some of the key players in die attach equipment market include Fasford Technology Co Ltd., ASM Pacific Technology Limited, Inseto UK Limited, Kulicke and Soffa Industries, Inc., Anza Technology Inc., Be Semiconductor Industries N.V., Palomar Technologies, Inc., Dr. Tresky AG, Shinkawa Ltd., Toray Engineering, MicroAssembly Technologies, Ltd., DIAS Automation, Panasonic, West-Bond, and Hybond.

Bonding Techniques Covered:

  • Soft Solder
  • Hybrid Bonding
  • Epoxy
  • Eutectic
  • Sintering
  • Mass Reflow
  • Thermo-Compression Bonding (TCB)
  • Laser Assisted Bonding (LAB)

Types Covered:

  • Flip Chip Bonder
  • Die Bonder

Applications Covered:

  • Logic
  • Optoelectronics / Photonics
  • RF & MEMS
  • Light-Emitting Diode (LED)
  • CMOS Image Sensor
  • Memory
  • Discretes
  • Integrated Device Manufacturers (IDMs)
  • Outsourced Semiconductor Assembly and Test (OSAT)

Product Types Covered:

  • 12 Wafer Handling
  • 8 Wafer Handling
  • 6 Wafer Handling

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • Italy
    • UK
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2017, 2018, 2019, 2023 and 2027
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter's five forces analysis, SWOT analysis, etc.
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances
Table of Contents

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Die Attach Equipment Market, By Bonding Technique

  • 5.1 Introduction
  • 5.2 Soft Solder
  • 5.3 Hybrid Bonding
  • 5.4 Epoxy
  • 5.5 Eutectic
  • 5.6 Sintering
  • 5.7 Mass Reflow
  • 5.8 Thermo-Compression Bonding (TCB)
  • 5.9 Laser Assisted Bonding (LAB)

6 Global Die Attach Equipment Market, By Type

  • 6.1 Introduction
  • 6.2 Flip Chip Bonder
  • 6.3 Die Bonder

7 Global Die Attach Equipment Market, By Application

  • 7.1 Introduction
  • 7.2 Logic
  • 7.3 Optoelectronics / Photonics
  • 7.4 RF & MEMS
  • 7.5 Light-Emitting Diode (LED)
  • 7.6 CMOS Image Sensor
  • 7.7 Memory
    • 7.7.1 DRAM
    • 7.7.2 NAND
    • 7.7.3 3D TSV Memory
  • 7.8 Discretes
  • 7.9 Integrated Device Manufacturers (IDMs)
  • 7.10 Outsourced Semiconductor Assembly and Test (OSAT)

8 Global Die Attach Equipment Market, By Product Type

  • 8.1 Introduction
  • 8.2 12 Wafer Handling
  • 8.3 8 Wafer Handling
  • 8.4 6 Wafer Handling

9 Global Die Attach Equipment Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 Fasford Technology Co Ltd.
  • 11.2 ASM Pacific Technology Limited
  • 11.3 Inseto UK Limited
  • 11.4 Kulicke and Soffa Industries, Inc.
  • 11.5 Anza Technology Inc.
  • 11.6 Be Semiconductor Industries N.V.
  • 11.7 Palomar Technologies, Inc.
  • 11.8 Dr. Tresky AG
  • 11.9 Shinkawa Ltd.
  • 11.10 Toray Engineering
  • 11.11 MicroAssembly Technologies, Ltd.
  • 11.12 DIAS Automation
  • 11.13 Panasonic
  • 11.14 West-Bond
  • 11.15 Hybond

List of Tables

  • Table 1 Global Die Attach Equipment Market Outlook, By Region (2017-2027) ($MN)
  • Table 2 Global Die Attach Equipment Market Outlook, By Bonding Technique (2017-2027) ($MN)
  • Table 3 Global Die Attach Equipment Market Outlook, By Soft Solder (2017-2027) ($MN)
  • Table 4 Global Die Attach Equipment Market Outlook, By Hybrid Bonding (2017-2027) ($MN)
  • Table 5 Global Die Attach Equipment Market Outlook, By Epoxy (2017-2027) ($MN)
  • Table 6 Global Die Attach Equipment Market Outlook, By Eutectic (2017-2027) ($MN)
  • Table 7 Global Die Attach Equipment Market Outlook, By Sintering (2017-2027) ($MN)
  • Table 8 Global Die Attach Equipment Market Outlook, By Mass Reflow (2017-2027) ($MN)
  • Table 9 Global Die Attach Equipment Market Outlook, By Thermo-Compression Bonding (TCB) (2017-2027) ($MN)
  • Table 10 Global Die Attach Equipment Market Outlook, By Laser Assisted Bonding (LAB) (2017-2027) ($MN)
  • Table 11 Global Die Attach Equipment Market Outlook, By Type (2017-2027) ($MN)
  • Table 12 Global Die Attach Equipment Market Outlook, By Flip Chip Bonder (2017-2027) ($MN)
  • Table 13 Global Die Attach Equipment Market Outlook, By Die Bonder (2017-2027) ($MN)
  • Table 14 Global Die Attach Equipment Market Outlook, By Application (2017-2027) ($MN)
  • Table 15 Global Die Attach Equipment Market Outlook, By Logic (2017-2027) ($MN)
  • Table 16 Global Die Attach Equipment Market Outlook, By Optoelectronics / Photonics (2017-2027) ($MN)
  • Table 17 Global Die Attach Equipment Market Outlook, By RF & MEMS (2017-2027) ($MN)
  • Table 18 Global Die Attach Equipment Market Outlook, By Light-Emitting Diode (LED) (2017-2027) ($MN)
  • Table 19 Global Die Attach Equipment Market Outlook, By CMOS Image Sensor (2017-2027) ($MN)
  • Table 20 Global Die Attach Equipment Market Outlook, By Memory (2017-2027) ($MN)
  • Table 21 Global Die Attach Equipment Market Outlook, By DRAM (2017-2027) ($MN)
  • Table 22 Global Die Attach Equipment Market Outlook, By NAND (2017-2027) ($MN)
  • Table 23 Global Die Attach Equipment Market Outlook, By 3D TSV Memory (2017-2027) ($MN)
  • Table 24 Global Die Attach Equipment Market Outlook, By Discretes (2017-2027) ($MN)
  • Table 25 Global Die Attach Equipment Market Outlook, By Integrated Device Manufacturers (IDMs) (2017-2027) ($MN)
  • Table 26 Global Die Attach Equipment Market Outlook, By Outsourced Semiconductor Assembly and Test (OSAT) (2017-2027) ($MN)
  • Table 27 Global Die Attach Equipment Market Outlook, By Product Type (2017-2027) ($MN)
  • Table 28 Global Die Attach Equipment Market Outlook, By 12 Wafer Handling (2017-2027) ($MN)
  • Table 29 Global Die Attach Equipment Market Outlook, By 8 Wafer Handling (2017-2027) ($MN)
  • Table 30 Global Die Attach Equipment Market Outlook, By 6 Wafer Handling (2017-2027) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.

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