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Market Research Report

3D Printed Metals: A Patent Landscape Analysis - 2018

Published by SmarTech Analysis Product code 666886
Published Content info 114 Pages
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3D Printed Metals: A Patent Landscape Analysis - 2018
Published: October 2, 2018 Content info: 114 Pages
Description

New 3D Printed Metals Patent Analysis Report from SmarTech

Metals-based 3D printing is one of the fastest growing sectors of the 3D printing industry. SmarTech has already published widely on the growing market opportunities available in this space. Building on our extensive knowledge and understanding of this area, we are now offering an updated and revamped report on the patent landscape for 3D-printed metals. This report will be one of a series of reports on the 3D printing patent landscape.

Coverage

The 2018 report is based on an extensive search of relevant U.S. and foreign patents issued over a 20-year rolling period and patent applications published through June 2018 related to metals used for 3D printing and processes for making such metals. This report - which is the only one of its kind - has two components: (1) a 3D printing metals patent database and (2) a visually illustrative presentation of the data in charts and graphs, accompanied by granular analysis and guidance by SmarTech's in-house IP analyst.

This 3D printed metals patent analysis report covers such vital questions as:

Which companies are obtaining patents in the 3D printed metals space?

  • Top 20 companies
  • Cumulatively, over a 20-year rolling period
  • Subsisting patents
  • Published applications
  • Patent filing and issuance trends over a 20-year rolling period

Which universities and research institutions are obtaining patents in the 3D printed metals space?

  • Top 20 institutions
  • Patent filing and issuance trends over a 20-year rolling period

Who are the inventors in this space?

  • Top 20 inventors
  • Top inventors by company
  • Patent filing and issuance trends over a 20-year rolling period

What are the patent filing and issuance trends over a 20-year rolling period (total numbers)?

  • U.S.
  • WIPO countries

Which patents are being cited against pending applications (forward citation)?

  • Top 20 references, ranked
  • Top 20 references, by description

How is technology in this space distributed among patent classifications?

  • U.S. classes
  • International classes

How has the technology evolved, by company?

  • U.S. Classes
  • International classes

How has the technology evolved, by type?

  • U.S. Classes
  • International classes

Which countries are leading patent issuance in this space?

  • Top 20 countries, cumulatively
  • Top 20 countries, current
  • Top inventors, by country

How are metals patents distributed?

  • By type of metal
  • By company
  • By 3D printing process

How are metals applications distributed?

  • By process and company

What is the patent landscape for metals?

  • By type of metal
  • By 3D printing process that uses the metal
  • By company

What are the trends in patent abandonment in this space?

  • 20-year rolling period

What metals patents are expiring in this space over a 3-year rolling period?

This 3D printed metals patent analysis report will be required reading for anyone who makes or uses metals for 3D printing, or who wants to identify opportunities or risks in this space. It is aimed at CTOs, inventors and researchers, patent attorneys, investors, and others who need a comprehensive overview of the 3D printed metals patent landscape.

Patent Database

SmarTech's patent database for 3D printed metals is based on searches for U.S. and WIPO patents and published patent applications over a 20-year rolling period. The database provides the following details: patent/publication number, assignee, title, abstract, filing date, publication date, status, PCT data, priority date, priority country, inventor, patent family information, forward citation, backward citation.

This database is provided in an Excel spreadsheet so that users can perform their own analytics with the data.

3D Printed Metals: A Patent Landscape Analysis - 2018 will provide exceptional value to participants in every part the 3D printing community.

Table of Contents
Product Code: SMP-PA-Metals 0718

Table of Contents

Chapter One: Research Findings and Summary

  • 1.1 Patent Database
  • 1.2 Patent Search Methodology and Cutoff

Chapter Two: Assignees

  • 2.1 Top 50 Assignees: Cumulative U.S. Patents
    • 2.1.1 Analysis
  • 2.2 Top 50 Assignees: Subsisting U.S. Patents
    • 2.2.1 Analysis
  • 2.3 Top 50 Assignees: Published US Applications
    • 2.3.1 Analysis
  • 2.4 Top 20 Assignees: U.S. Patents and Applications
    • 2.4.1 Analysis
  • 2.5 Assignee Activity Over Time
    • 2.5.1 Analysis

Chapter Three: Universities and Research Institutions

  • 3.1 Top 20 Universities and Research Institutions: Patents and Applications
    • 3.1.1 Analysis
  • 3.2 Institutional Activity Over Time
    • 3.2.1 Analysis

Chapter Four: Key Inventors

  • 4.1 Top 20 Inventors
    • 4.1.1 Analysis
  • 4.2 Top 20 Inventors by Assignee
    • 4.2.1 Analysis
  • 4.3 Inventor Activity Over Time
    • 4.3.1 Analysis

Chapter Five: Patents and Published Applications

  • 5.1 Issued U.S. Patents and Published Applications: Trends
    • 5.1.1 Analysis
  • 5.2 WIPO Published Applications
    • 5.2.1 Analysis

Chapter Six: Forward Citation

  • 6.1 Top 20 Patent References (Forward Citation): Rank
    • 6.1.1 Analysis
  • 6.2 Top 20 Patent References (Forward Citation): Description

Chapter Seven: Classification

  • 7.1 Relevant US Patent Main Classes and Subclasses - Definitions
  • 7.2 Technology Distribution: U.S. Main Classes
    • 7.2.1 Analysis
  • 7.3 Technology Distribution: U.S. Main Classes - Percentage of Applications ..
    • 7.3.1 Analysis
  • 7.4 Technology Distribution: U.S. Sub-Classes
    • 7.4.1 Analysis
  • 7.5 Technology Distribution: U.S. Sub-Classes - Percentage
    • 7.5.1 Analysis
  • 7.6 Relevant International Classes
  • 7.7 Technology Distribution: International Classifications
    • 7.7.1 Analysis
  • 7.8 Technology Distribution: International Classes - Percentage
    • 7.8.1 Analysis
  • 7.9 Technology Evolution By Assignee and U.S. Class
    • 7.9.1 Analysis
  • 7.10 Technology Evolution By Assignee and International Class
    • 7.10.1 Analysis
  • 7.11 Technology Evolution By U.S. Class
    • 7.11.1 Analysis
  • 7.12 Technology Evolution By International Class
    • 7.12.1 Analysis

Chapter Eight: Top Countries By Patent Issuance

  • 8.1 Top Countries of Patent Issuance: Cumulative
    • 8.1.1 Analysis
  • 8.2 Top Assignees in Top Countries
    • 8.2.1 Analysis

Chapter Nine: Technology Analysis

  • 9.1 Metals Patents Distribution
    • 9.1.1 Analysis
  • 9.2 Metals Patents by Assignee (U.S.)
    • 9.2.1 Analysis
  • 9.3 Metals Patents and Applications by Process (U.S.)
    • 9.3.1 Analysis

Chapter Ten: Legal Status

  • 10.1 U.S. Patent Abandonment: Trends
    • 10.1.1 Analysis
  • 10.2 U.S. Patent Survival
    • 10.2.1 Analysis

Chapter Eleven: Expected Expiration Data

  • 11.1 Expected Expiration Data
    • 11.1.1 Analysis

Chapter Twelve: Closing Commentary

  • 12.1 Top Assignees
  • 12.2 Experience
  • 12.3 Inventors
  • 12.4 Worldwide Patent Filing and Issuance
    • 12.4.1 Forward Citation
    • 12.4.2 Patent Coverage
    • 12.4.3 Patent Expiration
  • 12.5 Opportunities

Chapter Thirteen: Synonym Matrix - Keywords

  • 13.1 Important Search Terms and Alternative Terminologies

Appendix A: Databases and Acronyms

  • A-1 Patent databases searched
  • Acronyms Used In this Report

About the Analyst

About SmarTech Publishing

List of Exhibits

  • Exhibit 2-1: Top 50 Assignees: Cumulative U.S. Patents
  • Data Table for Exhibit 2-1
  • Exhibit 2-2: Top 50 Assignees: Subsisting US Patents
  • Data Table for Exhibit 2-2
  • Exhibit 2-3: Top 50 Assignees: Published US Applications
  • Data Table for Exhibit 2-3
  • Exhibit 2-4: Top 20 Assignees: U.S. Patents and Applications
  • Table 2-5: Assignee Activity Over Time
  • Exhibit 3-1: Top 20 Universities and Research Institutions: Patents and Applications
  • Table 3-2: Institutional Activity Over Time
  • Exhibit 4-1: Top 20 Inventors
  • Exhibit 4-2: Top 20 Inventors by Assignee
  • Table 4-3: Inventor Activity Over Time
  • Exhibit 5-1: Issued US Patents and Published Applications: Trends
  • Table 5-2: WIPO Published Applications
  • Exhibit 6-1: Top 20 Patent References (Forward Citation)
  • Exhibit 6-2: Descriptions of the top 20 forward Patent Citations for 20-Year Period
  • Exhibit 7.1.1: U.S. Main classes and definitions
  • Exhibit 7.1.2: U.S. Sub-classes and definitions
  • Exhibit 7-2: Technology Distribution: U.S. Main Classes
  • Exhibit 7-3: Technology Distribution: U.S. main Classes - Percentage of Applications
  • Exhibit 7-4: Technology Distribution: U.S. Sub-Classes
  • Exhibit 7-5: Technology Distribution: U.S. Sub-Classes - Percentage
  • Exhibit 7-6: International Patent classes and definitions
  • Exhibit 7-7: Technology Distribution: International Classes
  • Exhibit 7-8: Technology Distribution: International Classes -Percentage
  • Data Table for Exhibit 7-8
  • Table 7-9: Technology Evolution By Assignee and U.S. Class
  • Table 7-10: Technology Evolution By Assignee and IPC class
  • Table 7-11: Technology Evolution By U.S. Class
  • Table 7-12: Technology Evolution By International Class
  • Exhibit 7-9: Class with Least Inventive Activity
  • Table 8-1: Top Countries By Patent Issuance: Cumulative
  • Country key for Table 8-1
  • Table 8-2: Top Assignees in Top Countries
  • Table 9-1: Metals Patents Distribution
  • Table 9-2: Metals Patents by Assignee (U.S.)
  • Exhibit 10-1: U.S. Patent Abandonment Trends
  • Exhibit 10-2: U.S. Patent Survival
  • Exhibit 11-1: Expected Patent Expiration Data
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