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Market Research Report

Voice of the IoT Engineer 2017: Survey Dataset and Analysis

Published by VDC Research Group, Inc. Product code 355891
Published Content info 33 Pages; 240 Exhibits
Delivery time: 1-2 business days
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Voice of the IoT Engineer 2017: Survey Dataset and Analysis
Published: January 31, 2018 Content info: 33 Pages; 240 Exhibits
Description

This report analyzes key trends that we derive from our annual survey of IoT and embedded engineers, managers, and decision-makers. We address major themes such as device development, technology adoption trends, vendor ratings, strategies for addressing the IoT, and more. The analysis provides data segmentations by all major industry and technology communities of interest, including target vertical market, geography, processor architecture, embedded operating system, and programming language. We include in an accompanying Excel file the full set of over 210 survey exhibits with associated segmentations across all major demographics and behavior groups.

What questions are addressed?

  • What is the current state of IoT adoption in the embedded market? What benefits are engineers realizing from integrating IoT capabilities into their organization's products?
  • How do the separate units within engineering organizations (engineers, technical managers, business managers) view the challenges and opportunities of the IoT?
  • What are the most popular types of processors, operating systems, programming languages, and tools?
  • What are the most important criteria for engineers when adopting these technologies and choosing from which vendors to purchase?
Table of Contents

TABLE OF CONTENTS

  • Executive Summary
  • Survey Demographics & Overview
  • Hardware Overview and Trends
  • Software Stack Overview and Trends
  • Programming Language Overview and Trends
  • Tooling Overview and Trends
  • IoT Adoption Trends
  • Appendix: Market Definitions
  • About VDC Research

LIST OF REPORT EXHIBITS

  • Exhibit 1: Organization's Primary Industry
  • Exhibit 2: Respondent's Primary Role Within Organization
  • Exhibit 3: Respondent's Region of Residence
  • Exhibit 4: Respondent's Industry/Vertical Market
  • Exhibit 5: Primary Processor Family/Architecture Used on Current Project
  • Exhibit 6: Bit-Width of Architecture Used on, Segmented by Primary Processor on Current Project
  • Exhibit 7: Most Important Characteristics when Selecting Embedded Processors, Segmented by Processor Type
  • Exhibit 8: Most Important Selection Criteria for IoT Gateway Hardware, Segmented by Vertical Market
  • Exhibit 9: Previous, Current and Expected OS Source
  • Exhibit 10: Current and Expected Use of Software Stack Components on Project (Aside from OS)
  • Exhibit 11: Expected Change in Source Lines of Code (SLOC) on Next Project, Segmented by Code Source
  • Exhibit 12: Percent of Total Software Code in Final Design from Different Sources, Segmented by Real-time Capability
  • Exhibit 13: Embedded Security Software Used on Project, Segmented by IoT Capability
  • Exhibit 14: Languages Used to Develop Software in Previous, Current, and Future Projects
  • Exhibit 15: Inclusion of Real-Time Response Capabilities in Current Project, Segmented by Programming Language
  • Exhibit 16: IoT Deployment Status in Current Project, Segmented by Programming Language
  • Exhibit 17: Types of Tools Used on Current Project and Expected to be Used in Three Years
  • Exhibit 18: Types of Tools Used on Current Project, Segmented by Primary Processor Type
  • Exhibit 19: Approximate Cost Budgeted for all Tools Used on Current Project, Segmented by Primary Processor Type
  • Exhibit 20: Development Methodology Use Rate, Segmented by System Deployment Type
  • Exhibit 21: Static Analysis and SAST Selection Criteria, Segmented by System Deployment Type
  • Exhibit 22: Schedule Performance on Current Project, Segmented by Tool Use
  • Exhibit 23: Deployment of IoT Capabilities and/or Applications into Organization's Products, 2016-2017
  • Exhibit 24: Primary Factor Driving Respondent's Organization to Utilize/Deploy IoT Capabilities, Segmented by Region
  • Exhibit 25: Largest Overall Challenge for Respondent's Organization in Developing IoT Solutions, Segmented by Primary Processor
  • Exhibit 26: Largest Overall Challenge for Respondent's Organization in Developing IoT Solutions, Segmented by Respondent Role

LIST OF SURVEY EXHIBITS

  • Exhibit 1: Types of Projects in Current Role's Purview
  • Exhibit 2: Primary Area of Expertise
  • Exhibit 3: Primary Classification of Current or Most Recently Completed Project
  • Exhibit 4: Personal Involvement with Engineering in Project
  • Exhibit 5: Products Purchased by Respondent's Organization
  • Exhibit 6: Organization's Primary Industry
  • Exhibit 7: Number of People Working for Respondent's Organization Worldwide
  • Exhibit 8: Respondent's Primary Role Within Organization
  • Exhibit 9: Respondent's Country of Residence
  • Exhibit 10: Respondent's Region of Residence
  • Exhibit 11: Industry/Vertical Market
  • Exhibit 12: Type of Aerospace & Defense Product
  • Exhibit 13: Type of Automotive In-Vehicle Product
  • Exhibit 14: Type of Communications & Networking Product
  • Exhibit 15: Type of Consumer Electronics Product
  • Exhibit 16: Type of Digital Security Product
  • Exhibit 17: Type of Digital Signage Product
  • Exhibit 18: Type of Energy & Utilities Product
  • Exhibit 19: Type of Gaming Product
  • Exhibit 20: Type of Industrial Automation & Control Product
  • Exhibit 21: Type of Medical Product
  • Exhibit 22: Type of Mobile Phone Product
  • Exhibit 23: Type of Office/Business Automation Product
  • Exhibit 24: Type of Transportation Product
  • Exhibit 25: Type of Retail Automation Product
  • Exhibit 26: Type of Non-Manufacturing/Services Product
  • Exhibit 27: Capabilities or Features Included in Current Project
  • Exhibit 28: Capabilities or Features Expected for Similar Project in Three Years
  • Exhibit 29: Project's Real-Time Deadlines
  • Exhibit 30: Project's Shortest Response Deadline
  • Exhibit 31: Implementation of Software-Defined Networking (SDN) and/or Network Function Virtualization (NFV) on Current Project
  • Exhibit 32: Expected Use of Software-Defined Networking (SDN) and/or Network Function Virtualization (NFV) on Similar Project in Three Years
  • Exhibit 33: Estimate of Total Project Length in Calendar Months (Time from Initial Specification to Shipment)
  • Exhibit 34: Current Project's Schedule
  • Exhibit 35: Estimate of Total Years for Which Current Product will be Manufactured Once Initial Development is Complete
  • Exhibit 36: Estimate of Product's Average Years of Useful Life Once Deployed in Field by End Customer
  • Exhibit 37: Reasons for Any Delays in Current Project
  • Exhibit 38: Engineering Tasks in which the Respondent is Personally Involved for the Current Project
  • Exhibit 39: Portion of Time Spent on Engineering Tasks in which the Respondent is Personally Involved for the Current Project
  • Exhibit 40: Tasks where Respondent Personally Planned for/Designed, Identified, or Remediated Security Issues
  • Exhibit 41: Percent of Time Spent on Each Task Personally Planning for/Designing, Identifying, or Remediating Security Issues
  • Exhibit 42: Estimated Distribution of Full-Time Engineers Working on Project
  • Exhibit 43: Estimated Number of Full-Time Engineers Employed by Respondent's Organization
  • Exhibit 44: Estimated Distribution of Full-Time Engineers Employed by Respondent's Organization
  • Exhibit 45: Estimated Total Cost of Development for Current Project
  • Exhibit 46: Estimated Bill of Material (BOM) for Current Project
  • Exhibit 47: Estimated Number of Units to be Shipped for Current Project
  • Exhibit 48: Estimated Distribution of Development Costs on Current Project
  • Exhibit 49: Estimated Distribution of Development Costs on Similar Project Three Years from Now
  • Exhibit 50: Estimate of the Fully-Loaded Labor Cost (including salary, benefits, overhead, etc.) for a Typical Embedded Engineer at Respondent's Location
  • Exhibit 51: Estimated Total Number of Defects or Software Patches Reported/Required per Year once Product is Deployed in Field
  • Exhibit 52: Estimated Combined IT and Engineering Time (man-hours) Required for Each Patch or Defect Remediation
  • Exhibit 53: Estimated Percentage of Devices that Will Become Inoperable and Require Repair or Replacement Each Year
  • Exhibit 54: Primary Method for Updating Devices Once Deployed in Field
  • Exhibit 55: Types of Computer System Components or Sub-Systems Purchased by Organization
  • Exhibit 56: Types of Processors Used on Project
  • Exhibit 57: Types of Processors Expected to be Used on Similar Project in Three Years
  • Exhibit 58: Primary/Application Processor Used on Project
  • Exhibit 59: Primary Processor Family/Architecture Used on Project
  • Exhibit 60: Processor Families/Architectures Considered for Project
  • Exhibit 61: Bit-Width of Architecture Used by Primary Processor on Project
  • Exhibit 62: Most Important Characteristics When Selecting Embedded Processors
  • Exhibit 63: CPU/MPU Suppliers Currently Used on Project
  • Exhibit 64: MCU Suppliers Currently Used on Project
  • Exhibit 65: SoC Suppliers Currently Used on Project
  • Exhibit 66: ASSP Suppliers Currently Used on Project
  • Exhibit 67: FPGA Suppliers Currently Used on Project
  • Exhibit 68: Satisfaction with Embedded Processor Suppliers That Respondent Has Purchased from
  • Exhibit 69: Most Important Product Selection Criteria (Excluding Cost) when Purchasing/Specifying CPU Boards, Blades and/or Modules
  • Exhibit 70: Architectures or Form Factors of Boards/Modules Used on Project
  • Exhibit 71: Architectures or Form Factors of Boards/Modules Expected to be Used on a Similar Project in Three Years
  • Exhibit 72: Embedded Board Vendors Currently Used on Project
  • Exhibit 73: Most Important Product Selection Criteria (Excluding Cost) when Purchasing/Specifying Embedded Computing and/or Storage Systems
  • Exhibit 74: Architectures or Form Factors Used in Embedded Computing Systems that are Purchased by Respondent's Organization on Project
  • Exhibit 75: Architectures or Form Factors in Embedded Computing Systems Expected to be Purchased by Respondent's Organization on Similar Project in Three Years
  • Exhibit 76: Motherboard Form Factors Currently Used in Organization's Systems
  • Exhibit 77: Motherboard Form Factors Expected to be Used in Organization's Systems on Similar Project in Three Years
  • Exhibit 78: COM Form Factors Currently Used in Organization's Systems
  • Exhibit 79: COM Form Factors Expected to be Used in Organization's Systems on Similar Project in Three Years
  • Exhibit 80: Types of Wired, Optical, and/or Wireless Connections Used in Systems/Services Produced by Organization
  • Exhibit 81: Types of Wired, Optical, and/or Wireless Connections Expected to be Used in Systems/Services Produced by Organization in Three Years
  • Exhibit 82: Types of Low-Powered Wide-Area-Networks (LPWAN) Used in Systems/Services Produced by Organization
  • Exhibit 83: Types of Low-Powered Wide-Area-Networks (LPWAN) Expected to be Used in Embedded Systems/Services Produced by Organization on Similar Project in Three Years
  • Exhibit 84: Estimated Amount of Data Generated by Organization's Products on Average each Day per Device
  • Exhibit 85: Estimated Amount of Data Generated by Organization's Products on Average each Day per Device on Similar Project in Three years
  • Exhibit 86: IoT Middleware Frameworks/Platforms Used on Project
  • Exhibit 87: IoT Protocols Used on Project
  • Exhibit 88: Approximate Distance Needed for Devices to Communicate Wirelessly
  • Exhibit 89: Source of Primary Operating System Used on Previous Project
  • Exhibit 90: Source of Primary Operating System Used on Current Project
  • Exhibit 91: Expected Source of Primary Operating System on Similar Project in Three Years
  • Exhibit 92: Commercially Obtained, NON Open Source OS Used on Current Project
  • Exhibit 93: Commercially or Consortia Obtained, Open Source OS Used on Current Project
  • Exhibit 94: Freely and/or Publicly Available, Open Source OS Used on Current Project
  • Exhibit 95: Chip/Board Vendor-Supplied OS Used on Current Project
  • Exhibit 96: Most Important Characteristics when Selecting Primary Operating System
  • Exhibit 97: Likelihood of Using Same Operating System on Similar Project in Three Years
  • Exhibit 98: Software Stack Components Required on Project (Aside from OS)
  • Exhibit 99: Software Stack Components Required on Similar Project Three Years from Now (Aside from OS)
  • Exhibit 100: Importance of Security in Project
  • Exhibit 101: Actions Organization has Taken in Response to Security Requirements
  • Exhibit 102: How Well Organization has Addressed Security Requirements
  • Exhibit 103: Primary Reason Security is Not Important for Project
  • Exhibit 104: Have Any Security Vulnerabilities or Failures Within Organization's Products Been Exposed or Identified
  • Exhibit 105: Were Any Vulnerabilities Disclosed to Customers
  • Exhibit 106: Results of Security Vulnerabilities
  • Exhibit 107: Implications of Security Vulnerabilities
  • Exhibit 108: Commercial Security Vendors Used on Project
  • Exhibit 109: Embedded Security Software Used on Project
  • Exhibit 110: Embedded Security Hardware Used on Project
  • Exhibit 111: Inclusion of Public Key Infrastructure (PKI) in Project
  • Exhibit 112: Functions of Digital Certificates/Keys
  • Exhibit 113: Place Where Digital Certificates/Keys Are Stored
  • Exhibit 114: How Digital Certificates Are Provisioned
  • Exhibit 115: Certificate Authority (CA) Primarily Used to Issue Digital Certificates
  • Exhibit 116: Cost Per Device of Digital Certificates
  • Exhibit 117: Types of Devices Connected to Organization's Enterprise/IT Network on Project
  • Exhibit 118: Types of Devices Expected to Be Connected to Organization's Enterprise/IT Network on Similar Project in Three Years
  • Exhibit 119: Do Organization's Current IT Security Policies Cover IoT Devices
  • Exhibit 120: Has Organization Enacted IT Security Policies Specifically to Cover IoT Devices
  • Exhibit 121: Will Organization Enact Specific Security Policies for IoT Devices in Three Years
  • Exhibit 122: Expected Coverage of IoT Security Solutions from Organization's IT Security Vendor
  • Exhibit 123: Types of Security Threats Organization is Concerned About for IoT Devices
  • Exhibit 124: Extent of Agreement with Following IoT Security Statements
  • Exhibit 125: Security Solutions Currently Used to Protect IoT Devices Connected to Organization's Network
  • Exhibit 126: Security Solutions Expected to be Used to Protect IoT Devices Connected to Organization's Network in Three Years
  • Exhibit 127: Commercial IT Security Vendors Currently Used by Respondent's Organization
  • Exhibit 128: Use of Security Solutions from IoT Specialist Vendors
  • Exhibit 129: Percentage of Organization's IT Security Budget Related to Security
  • Exhibit 130: Percentage of Organization's IT Security Budget Related to Commercial Security Software/ Services
  • Exhibit 131: Percentage of Organization's IT Security Budget Related to Security on a Similar Project in Three Years
  • Exhibit 132: Person Responsible for Selection and Purchase of Enterprise Security Solutions
  • Exhibit 133: Types of Tools Used on Project
  • Exhibit 134: Types of Tools Expected to Be Used on Similar Project in Three Years
  • Exhibit 135: Most Important Characteristics when Selecting Compiler Used on Project
  • Exhibit 136: Types of Compiler Purchased by Respondent's Organization
  • Exhibit 137: Compilation Tools Currently Used on Project
  • Exhibit 138: Static Analysis or SAST Tools Used on Project
  • Exhibit 139: Most Important Characteristics when Selecting Static Analysis or SAST Tool Used on Project
  • Exhibit 140: Who Makes Purchasing Decision for Static Analysis and SAST Tools
  • Exhibit 141: Dynamic Testing or DAST Tools Used on Project
  • Exhibit 142: Most Important Characteristics when Selecting Dynamic Testing or DAST Tools Used on Project
  • Exhibit 143: Who Makes Purchasing Decision for Dynamic Testing or DAST Tools
  • Exhibit 144: Requirements Management/Definition Tools Used on Project
  • Exhibit 145: Most Important Characteristics when Selecting Requirements Management/Definition Tools Used on Project
  • Exhibit 146: Who Makes Purchasing Decision for Requirements Management/Definition Tools
  • Exhibit 147: Product Line Engineering (PLE) Tools Used on Project
  • Exhibit 148: Most Important Characteristics when Selecting PLE Tools Used on Project
  • Exhibit 149: Who Makes Purchasing Decision for PLE Tools
  • Exhibit 150: Release Management/Continuous Deployment Tools Used on Project
  • Exhibit 151: Most Important Characteristics when Selecting Release Management/Continuous Deployment Tools Used on Project
  • Exhibit 152: Who Makes Purchasing Decision for Release Management/Continuous Deployment Tools
  • Exhibit 153: Software Composition Analysis (SCA)/IP Compliance Tools Used on Project
  • Exhibit 154: Most Important Characteristics when Selecting SCA/IP Compliance Tools Used on Project
  • Exhibit 155: Who Makes SCA/IP Compliance Tool Purchasing Decisions
  • Exhibit 156: Organization Linking System Requirements on Project
  • Exhibit 157: Description of Organization's Requirements Engineering
  • Exhibit 158: Implementation/Investigation of ALM, PLM, EDA
  • Exhibit 159: Advantages/Benefits of Cross-Engineering Domain Integrations
  • Exhibit 160: Investigation/Implementation of Enhanced Delivery of Continuous Post-Deployment Content and Services Support
  • Exhibit 161: Approximate Cost Budgeted for all Tools Used on Project
  • Exhibit 162: Type of Prototyping Solutions Used on Project
  • Exhibit 163: Source of Prototyping Board Used on Project
  • Exhibit 164: ASIC Gate Count of Current Prototype
  • Exhibit 165: Number of FPGAs Used on Current Prototype
  • Exhibit 166: FPGA Vendors Used for Prototype Hardware on Project
  • Exhibit 167: Challenges of FPGA-based Prototyping
  • Exhibit 168: FPGA-based/Physical Prototyping Vendors Used on Project
  • Exhibit 169: Tasks for which Respondent Uses Virtual Prototyping
  • Exhibit 170: Virtual Prototyping Vendors Used on Project
  • Exhibit 171: Most Important Factors when Selecting Current Virtual Prototyping Platform
  • Exhibit 172: Team Responsible for Virtual Prototype Creation within Organization
  • Exhibit 173: Languages Used on Previous Project
  • Exhibit 174: Languages Used on Current Project
  • Exhibit 175: Languages Expected to Be Used on Similar Project in Three Years
  • Exhibit 176: Estimated Total Source Lines of Code (SLOC) on Project
  • Exhibit 177: Percent of Total Software Code in Final Design from Following Sources
  • Exhibit 178: Expected Change in Source Lines of Code (SLOC) on Next Project: Commercial Third-Party Software
  • Exhibit 179: Expected Change in Source Lines of Code (SLOC) on Next Project: Open Source Third-Party Software
  • Exhibit 180: Expected Change in Source Lines of Code (SLOC) on Next Project: In-house Developed Code
  • Exhibit 181: Percent Increase Expected for SLOC: Commercial Third-Party Software
  • Exhibit 182: Percent Increase Expected for SLOC: Open Source Third-Party Software
  • Exhibit 183: Percent Increase Expected for SLOC: In-house Developed Code
  • Exhibit 184: Percent Decrease Expected for SLOC: Commercial Third-Party Software
  • Exhibit 185: Percent Decrease Expected for SLOC: Open Source Third-Party Software
  • Exhibit 186: Percent Decrease Expected for SLOC: In-House Developed Code
  • Exhibit 187: Percent of In-House Developed Software Code for Project by Source
  • Exhibit 188: Software Design Methodologies Used on Project
  • Exhibit 189: Software Design Methodologies Expected to Be Used on Similar Project Three Years from Now
  • Exhibit 190: Certification/Process Standard(s) Adhered to
  • Exhibit 191: Adherence to Coding Standards
  • Exhibit 192: Deployment of IoT Capabilities and/or Applications into Organization's Products
  • Exhibit 193: Primary Factor Driving Respondent's Organization to Utilize/Deploy IoT Capabilities
  • Exhibit 194: IoT Will Allow Respondent's Organization to...
  • Exhibit 195: Largest Overall Challenge for Respondent's Organization in Developing IoT Solutions
  • Exhibit 196: Most Important Factors when Selecting Suppliers of IoT Components and Solutions
  • Exhibit 197: Use of IoT Cloud Services to Build Embedded/IoT Project
  • Exhibit 198: Use of IoT Cloud Services to Connect, Manage, or Analyze Any of IoT Devices on IT Networks
  • Exhibit 199: Types of IoT Cloud Services Used on Project
  • Exhibit 200: Types of IoT Cloud Services Expected to Be Used on Similar Project in Three Years
  • Exhibit 201: Plans to Resell IoT Services as Value-Added Service
  • Exhibit 202: Types of Cloud Analytics Used for IoT Data
  • Exhibit 203: Types of Non-Cloud IoT Services Used to Support Customers on Project
  • Exhibit 204: IoT Cloud Platforms-as-a-Service (PaaS) Used in Project
  • Exhibit 205: IoT Cloud Platforms-as-a-Service (PaaS) Used on a Similar Project Three Years from Now
  • Exhibit 206: IoT Platform Functions Used on Project
  • Exhibit 207: IoT Platform Functions Expected to Be Used on Similar Project in Three Years
  • Exhibit 208: Purchase/Use and Creation/Integration of IoT Gateways
  • Exhibit 209: Future Plans to Purchase/Integrate IoT Gateways
  • Exhibit 210: Expected Sourcing of Gateway Technology on Future Project
  • Exhibit 211: Expected Number of Endpoints/Devices that Will Be Supported by the IoT Gateways Purchased/ Used/Integrated by Respondent's Company
  • Exhibit 212: Most Important Requirements when Selecting Embedded Connectivity Products for IoT Gateways Purchased/Used/Integrated by Respondent's Company
  • Exhibit 213: Types of Other Devices/Systems IoT Gateways Designed to Connect to in Project
  • Exhibit 214: Percent of Overall Computation being Done at Each Level of Full System
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