The Global Market for Advanced Semiconductor Packaging 2024-2035

TABLE OF CONTENTS

1. RESEARCH METHODOLOGY

2. EXECUTIVE SUMMARY

• 2.1. Semiconductor Packaging Technology Overview
  • 2.1.1. Key challenges
  • 2.1.2. Evolution of semiconductor packaging
    • 2.1.2.1. From 1D to 3D
  • 2.1.3. Conventional packaging approaches
  • 2.1.4. Advanced packaging approaches
• 2.2. Semiconductor Supply Chain
• 2.3. Advanced Packaging Supply Chain
• 2.4. Key Technology Trends in Advanced Packaging
• 2.5. Market Growth Drivers
• 2.6. Competitive Landscape
• 2.7. Market Challenges
• 2.8. Future outlook
  • 2.8.1. Heterogeneous Integration
  • 2.8.2. Chiplets and Die Disaggregation
  • 2.8.3. Advanced Interconnects
  • 2.8.4. Scaling and Miniaturization
  • 2.8.5. Thermal Management
  • 2.8.6. Materials Innovation
  • 2.8.7. Supply Chain Developments
  • 2.8.8. Role of Simulation and Data Analytics

3. SEMICONDUCTOR PACKAGING TECHNOLOGIES

• 3.1. Transistor Device Scaling
  • 3.1.1. Overview
  • 3.1.2. Heterogeneous Architecture Transition
  • 3.1.3. Co-Design Focus Areas
• 3.2. Wafer Level Packaging
• 3.3. Fan-Out Wafer Level Packaging
• 3.4. Chiplets
  • 3.4.1. AMD EPYC and Ryzen processor families
  • 3.4.2. Disaggregation Needs
• 3.5. Interconnection in Semiconductor Packaging
  • 3.5.1. Overview
  • 3.5.2. Wire Bonding
  • 3.5.3. Flip-chip bonding
  • 3.5.4. Interposer
  • 3.5.5. Through-silicon via (TSV) bonding
  • 3.5.6. Hybrid bonding with chiplets
• 3.6. 2.5D and 3D Packaging
  • 3.6.1. 2.5D packaging
    • 3.6.1.1. Overview
      • 3.6.1.1.1. Silicon Interposer 2.5D
        • 3.6.1.1.1.1. Through Si Via (TSV)
        • 3.6.1.1.1.2. (SiO2) based redistribution layers (RDLs)
      • 3.6.1.1.2. 2.5D Organic-based packaging
        • 3.6.1.1.2.1. Chip-first and chip-last fan-out packaging
        • 3.6.1.1.2.2. Organic substrates
        • 3.6.1.1.2.3. Organic RDL
      • 3.6.1.1.3. 2.5D glass-based packaging
        • 3.6.1.1.3.1. Benefits
        • 3.6.1.1.3.2. Glass Si interposers in advanced packaging
        • 3.6.1.1.3.3. Glass material properties
        • 3.6.1.1.3.4. 2/2 micro m line/space metal pitch on glass substrates
        • 3.6.1.1.3.5. 3D Glass Panel Embedding (GPE) packaging
        • 3.6.1.1.3.6. Thermal management
        • 3.6.1.1.3.7. Polymer dielectric films
        • 3.6.1.1.3.8. Challenges
        • 3.6.1.1.3.9. Comparison with other substrates
      • 3.6.1.1.4. 2.5D vs. 3D Packaging
    • 3.6.1.2. Benefits
    • 3.6.1.3. Challenges
    • 3.6.1.4. Trends
    • 3.6.1.5. Market players
  • 3.6.2. 3D packaging
    • 3.6.2.1. Overview
      • 3.6.2.1.1. Conventional 3D packaging
      • 3.6.2.1.2. Advanced 3D Packaging with through-silicon vias (TSVs)
      • 3.6.2.1.3. Three-dimensional (3D) hybrid bonding
        • 3.6.2.1.3.1. Devices using hybrid bonding
    • 3.6.2.2. 3D Microbump technology
      • 3.6.2.2.1. Technologies
      • 3.6.2.2.2. Challenges
      • 3.6.2.2.3. Bumpless copper-to-copper (Cu-Cu) hybrid bonding
    • 3.6.2.3. Trends

4. WAFER-LEVEL PACKAGING

• 4.1. Introduction
• 4.2. Benefits
• 4.3. Types of Wafer Level Packaging
  • 4.3.1. Wafer Level Chip Scale Packaging
    • 4.3.1.1. Overview
    • 4.3.1.2. Advantages
    • 4.3.1.3. Applications
  • 4.3.2. Wafer Level Fan-Out Packaging
    • 4.3.2.1. Overview
    • 4.3.2.2. Advantages
    • 4.3.2.3. Applications
  • 4.3.3. Wafer Level Fan-In Packaging
    • 4.3.3.1. Overview
    • 4.3.3.2. Advantages
    • 4.3.3.3. Applications
  • 4.3.4. Other Types of WLP
    • 4.3.4.1. Cu-Pillar Flip Chip
    • 4.3.4.2. Advantages
      • 4.3.4.2.1. Applications
    • 4.3.4.3. Embedded Wafer Level BGA (eWLB)
    • 4.3.4.4. Advantages
      • 4.3.4.4.1. Applications
    • 4.3.4.5. Chip-last FO-WLP
      • 4.3.4.5.1. Advantages
      • 4.3.4.5.2. Applications
    • 4.3.4.6. Wafer-on-Wafer (WoW)
      • 4.3.4.6.1. Applications
• 4.4. WLP Manufacturing Processes
  • 4.4.1. Wafer Preparation
  • 4.4.2. RDL Buildup
  • 4.4.3. Bumping
  • 4.4.4. Encapsulation
  • 4.4.5. Integration
  • 4.4.6. Test and Singulation
• 4.5. Wafer Level Packaging Trends
• 4.6. Applications of Wafer Level Packaging
  • 4.6.1. Mobile and Consumer Electronics
  • 4.6.2. Automotive Electronics
  • 4.6.3. IoT and Industrial
  • 4.6.4. High Performance Computing
  • 4.6.5. Aerospace and Defense
• 4.7. Wafer Level Packaging Outlook

5. SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION

• 5.1. Introduction
• 5.2. Approaches for heterogenous integration
  • 5.2.1. Technology Building Blocks
• 5.3. SiP Manufacturing Approaches
  • 5.3.1. 2.5D Integrated Interposers
  • 5.3.2. Multi-Chip Modules
  • 5.3.3. 3D Stacked packages
  • 5.3.4. Fan-Out Wafer Level Packaging
  • 5.3.5. Flip Chip Package-on-Package
• 5.4. SiP Component Integration
• 5.5. Heterogeneous Integration Drivers
• 5.6. Trends Driving SiP Adoption
• 5.7. SiP Applications
• 5.8. SiP Industry Landscape
• 5.9. Future Outlook on Heterogeneous Integration

6. MONOLITHIC 3D IC

• 6.1. Overview
  • 6.1.1. Transitioning from 2D Systems
  • 6.1.2. Motivation for developing monolithic 3D manufacturing
  • 6.1.3. Improved M3D Interconnect Density
  • 6.1.4. Heterogenous 3D vs Monolithic 3D
  • 6.1.5. 2D Materials
• 6.2. Benefits
• 6.3. Challenges
• 6.4. Future outlook

7. MARKETS AND APPLICATIONS

• 7.1. Market value chain
  • 7.1.1. SiP OEM/Designers
  • 7.1.2. Chiplet OEM/Designer and Chiplet Foundry
  • 7.1.3. Chiplet Integrator
    • 7.1.3.1. Integrated Device Manufacturers (IDMs)
    • 7.1.3.2. Outsourced Semiconductor Assembly and Test (OSAT) Providers
  • 7.1.4. Material Suppliers
  • 7.1.5. Equipment Suppliers
  • 7.1.6. Substrate and PCB suppliers
  • 7.1.7. EDA Tools Suppliers
  • 7.1.8. Interposer Foundry
• 7.2. Packaging trends by market
  • 7.2.1. Mobile Devices
  • 7.2.2. High-Performance Computing (HPC)
  • 7.2.3. Automotive
  • 7.2.4. Internet of Things (IoT)
  • 7.2.5. Consumer Electronics
  • 7.2.6. Aerospace and Defense
  • 7.2.7. Medical Devices
• 7.3. Design requirements
• 7.4. Artificial Intelligence (AI)
  • 7.4.1. Challenges in AI
  • 7.4.2. Advanced Packaging Solutions
    • 7.4.2.1. 2.5D and 3D Integration
    • 7.4.2.2. Chiplet-based Packaging
    • 7.4.2.3. Wafer-Level Packaging (WLP)
  • 7.4.3. Addressing AI Challenges through Advanced Packaging
    • 7.4.3.1. Processing Power
    • 7.4.3.2. Memory Bandwidth
    • 7.4.3.3. Energy Efficiency
    • 7.4.3.4. Scalability
  • 7.4.4. Applications
    • 7.4.4.1. Data Center and Cloud Computing
    • 7.4.4.2. Edge Devices and IoT
    • 7.4.4.3. Healthcare and Medical Devices
    • 7.4.4.4. Autonomous Vehicles
• 7.5. Mobile Devices
  • 7.5.1. Challenges
  • 7.5.2. Advanced Packaging Solutions
    • 7.5.2.1. System-in-Package (SiP)
    • 7.5.2.2. Fan-Out Wafer-Level Packaging (FOWLP)
    • 7.5.2.3. 3D IC Packaging
    • 7.5.2.4. Wafer-Level Chip-Scale Packaging (WLCSP)
  • 7.5.3. Addressing Challenges through Advanced Packaging
    • 7.5.3.1. Power Consumption and Thermal Management
    • 7.5.3.2. Size Constraints
    • 7.5.3.3. Cost
  • 7.5.4. Applications
    • 7.5.4.1. Smartphones
    • 7.5.4.2. Tablets
    • 7.5.4.3. Wearables
    • 7.5.4.4. AR/VR Devices
  • 7.5.5. Future trends
• 7.6. High Performance Computing (HPC)
  • 7.6.1. Challenges
  • 7.6.2. Advanced Packaging Solutions for HPC
    • 7.6.2.1. 2.5D and 3D Integration
    • 7.6.2.2. Hybrid bonding
    • 7.6.2.3. Multi-Chip Modules (MCMs)
    • 7.6.2.4. Chiplet-based Architectures
    • 7.6.2.5. Advanced Interconnect Technologies
  • 7.6.3. Addressing HPC Challenges through Advanced Packaging
    • 7.6.3.1. Performance Scaling
    • 7.6.3.2. Power Consumption
    • 7.6.3.3. Interconnect Bandwidth
    • 7.6.3.4. Reliability
  • 7.6.4. Applications
    • 7.6.4.1. Supercomputers
    • 7.6.4.2. Data Center and Cloud Computing
    • 7.6.4.3. Artificial Intelligence and Machine Learning
    • 7.6.4.4. Scientific Computing and Simulation
    • 7.6.4.5. Co-Packaged Optics
      • 7.6.4.5.1. Network Switch
      • 7.6.4.5.2. Optical communication in data centers
      • 7.6.4.5.3. Thermal Management
      • 7.6.4.5.4. Challenges in CPO
      • 7.6.4.5.5. Package Structure
      • 7.6.4.5.6. Fan-Out Embedded Bridge (FOEB) structure
      • 7.6.4.5.7. Advancing Switching and AI Networks
  • 7.6.5. Future Trends
• 7.7. Automotive Electronics
  • 7.7.1. Challenges
  • 7.7.2. Advanced Packaging Solutions for Automotive Electronics
    • 7.7.2.1. System-in-Package (SiP)
    • 7.7.2.2. Flip-Chip and Wafer-Level Packaging (WLP)
    • 7.7.2.3. 3D Integration and Through-Silicon Vias (TSVs)
  • 7.7.3. Addressing Automotive Electronics Challenges through Advanced Packaging
    • 7.7.3.1. ADAS/Autonomous driving systems
    • 7.7.3.2. Harsh Environment Reliability
    • 7.7.3.3. Safety and Reliability
    • 7.7.3.4. Miniaturization and Integration
    • 7.7.3.5. High-Speed Communication
    • 7.7.3.6. Thermal Management
  • 7.7.4. Applications
    • 7.7.4.1. Advanced Driver Assistance Systems (ADAS) and Autonomous Driving
      • 7.7.4.1.1. Radar packaging
    • 7.7.4.2. Electric Vehicle (EV) Power Electronics
    • 7.7.4.3. Infotainment and Telematics
    • 7.7.4.4. Sensors and Actuators
  • 7.7.5. Future Trends
• 7.8. Internet of Things (IoT) Devices
  • 7.8.1. Challenges
  • 7.8.2. Advanced Packaging Solutions for IoT Devices
    • 7.8.2.1. Wafer-Level Packaging (WLP)
    • 7.8.2.2. System-in-Package (SiP)
    • 7.8.2.3. Fan-Out Wafer-Level Packaging (FOWLP)
    • 7.8.2.4. 3D Packaging and Through-Silicon Vias (TSVs)
  • 7.8.3. Addressing IoT Device Challenges through Advanced Packaging
    • 7.8.3.1. Size Constraints
    • 7.8.3.2. Power Consumption
    • 7.8.3.3. Cost Pressures
    • 7.8.3.4. Integration and Functionality
    • 7.8.3.5. Reliability and Robustness
  • 7.8.4. Applications
    • 7.8.4.1. Wearable Devices
    • 7.8.4.2. Smart Home Devices
    • 7.8.4.3. Industrial IoT Devices
    • 7.8.4.4. Medical IoT Devices
  • 7.8.5. Future Trends
• 7.9. 5G & 6G Communications Infrastructure
  • 7.9.1. Challenges
  • 7.9.2. Trends in 5G and 6G packaging
  • 7.9.3. Advanced Packaging Solutions for 5G and 6G Communications Infrastructure
    • 7.9.3.1. Antenna-in-Package (AiP)
    • 7.9.3.2. System-in-Package (SiP)
    • 7.9.3.3. 3D Packaging and Through-Silicon Vias (TSVs)
    • 7.9.3.4. Fan-Out Wafer-Level Packaging (FOWLP)
  • 7.9.4. Addressing 5G and 6G Infrastructure Challenges through Advanced Packaging
    • 7.9.4.1. High-Frequency Operation
    • 7.9.4.2. Massive MIMO and Beamforming
    • 7.9.4.3. Energy Efficiency
    • 7.9.4.4. Cost and Scalability
    • 7.9.4.5. Thermal Management
  • 7.9.5. Applications
    • 7.9.5.1. Base Stations and Small Cells
    • 7.9.5.2. Backhaul and Fronthaul Networks
    • 7.9.5.3. Edge Computing and Network Slicing
    • 7.9.5.4. Satellite and Non-Terrestrial Networks
  • 7.9.6. Future Trends
• 7.10. Aerospace and Defense Electronics
  • 7.10.1. Challenges
  • 7.10.2. Advanced Packaging Solutions for Aerospace and Defense Electronics
    • 7.10.2.1. 3D Packaging and Through-Silicon Vias (TSVs)
    • 7.10.2.2. Chip-Scale Packaging (CSP) and Wafer-Level Packaging (WLP)
    • 7.10.2.3. Flip-Chip and Ball Grid Array (BGA) Packaging
    • 7.10.2.4. Hermetic Packaging and Sealing
  • 7.10.3. Addressing Aerospace and Defense Electronics Challenges through Advanced Packaging
    • 7.10.3.1. Size, Weight, and Power (SWaP) Optimization
    • 7.10.3.2. Harsh Environment Reliability
    • 7.10.3.3. High Performance and Speed
    • 7.10.3.4. Long-Term Reliability and Maintainability
    • 7.10.3.5. Security and Anti-Tamper Features
  • 7.10.4. Applications
    • 7.10.4.1. Avionics and Flight Control Systems
    • 7.10.4.2. Radar and Electronic Warfare Systems
    • 7.10.4.3. Satellite Communications and Payload Electronics
    • 7.10.4.4. Missile Guidance and Control Electronics
  • 7.10.5. Future Trends
• 7.11. Medical Electronics
  • 7.11.1. Challenges
  • 7.11.2. Advanced Packaging Solutions for Medical Electronics
    • 7.11.2.1. 3D Packaging and Through-Silicon Vias (TSVs)
    • 7.11.2.2. Wafer-Level Packaging (WLP) and Chip-Scale Packaging (CSP)
    • 7.11.2.3. Flexible and Stretchable Packaging
    • 7.11.2.4. Microfluidic Packaging
  • 7.11.3. Addressing Medical Electronics Challenges through Advanced Packaging
    • 7.11.3.1. Miniaturization
    • 7.11.3.2. Biocompatibility
    • 7.11.3.3. Reliability
    • 7.11.3.4. Power Efficiency
    • 7.11.3.5. High Performance
  • 7.11.4. Applications
    • 7.11.4.1. Implantable Devices
    • 7.11.4.2. Wearable Health Monitors
    • 7.11.4.3. Diagnostic Imaging Equipment
    • 7.11.4.4. Surgical Robotics and Instruments
  • 7.11.5. Future Trends
• 7.12. Consumer Electronics
  • 7.12.1. Challenges
  • 7.12.2. Advanced Packaging Solutions for Consumer Electronics
    • 7.12.2.1. System-in-Package (SiP)
    • 7.12.2.2. Fan-Out Wafer-Level Packaging (FOWLP)
    • 7.12.2.3. 3D Packaging and Through-Silicon Vias (TSVs)
    • 7.12.2.4. Embedded Die Packaging
  • 7.12.3. Addressing Consumer Electronics Challenges through Advanced Packaging
    • 7.12.3.1. Miniaturization
    • 7.12.3.2. Power Efficiency
    • 7.12.3.3. High Performance
    • 7.12.3.4. Cost Reduction
    • 7.12.3.5. Time-to-Market
  • 7.12.4. Applications
    • 7.12.4.1. Smartphones and Tablets
    • 7.12.4.2. Wearables and IoT Devices
    • 7.12.4.3. Gaming Consoles and VR/AR Devices
    • 7.12.4.4. Smart Home Devices
  • 7.12.5. Future Trends
• 7.13. Additive manufacturing for advanced packaging
• 7.14. Silicon photonics
• 7.15. Global market (Revenues)
  • 7.15.1. By type
  • 7.15.2. By market
  • 7.15.3. By region

8. MARKET PLAYERS

• 8.1. Integrated Device Manufacturers
• 8.2. Outsourced Semiconductor Assembly and Test (OSAT) Companies
• 8.3. Foundries
• 8.4. Electronics OEMs
• 8.5. Packaging Equipment and Materials Companies

9. MARKET CHALLENGES

10. COMPANY PROFILES

• 10.1. AaltoSemi
• 10.2. Absolic, Inc
• 10.3. ACCRETECH (Europe) GmbH
• 10.4. Adeia, Inc
• 10.5. Advanced Micro Devices, Inc. (AMD)
• 10.6. Analog Devices, Inc. (ADI)
• 10.7. Amkor Technology
• 10.8. Anmuquan Intelligent Technology (AMQ Intelligent)
• 10.9. Apple
• 10.10. Applied Materials
• 10.11. Ardentec Corporation
• 10.12. ARM
• 10.13. ASE
• 10.14. ASMPT Ltd.
• 10.15. Besi
• 10.16. Biren Technology
• 10.17. Blue Ocean Smart System
• 10.18. Brewer Science
• 10.19. Broadcom
• 10.20. BroadPak
• 10.21. Cambricon Technologies Co.,
• 10.22. Capcon Semiconductor
• 10.23. CAS Microelectronics Integration
• 10.24. CD Micro-Technology
• 10.25. CEA-Leti
• 10.26. Cerebras
• 10.27. China Wafer Level CSP Co
• 10.28. Chipbond Technology Corporation
• 10.29. Chipletz
• 10.30. ChipMOS Technologies, Inc
• 10.31. Corning
• 10.32. Dewo Advanced Automation (DAA
• 10.33. Disco
• 10.34. Dupont
• 10.35. Ebara
• 10.36. Eliyan
• 10.37. EMC Semi-Conductor Technology
• 10.38. EPS Technology
• 10.39. Entegris
• 10.40. EV Group
• 10.41. GlobalFoundries
• 10.42. Global Unichip
• 10.43. Gloway
• 10.44. Goldenscope Tech
• 10.45. Gona Semiconductor Technology
• 10.46. Graphcore
• 10.47. Greatek Electronics Inc
• 10.48. Hangke Chuangxing (Aero Inno-Star)
• 10.49. Hanmi Semiconductor
• 10.50. HiSilicon
• 10.51. HLMC (Shanghai Huali Microelectronics Corporation)
• 10.52. Huatian Huichuang Technology (Xi'an) Co., Ltd.
• 10.53. Huawei
• 10.54. Ibiden
• 10.55. IBM
• 10.56. ICLeague Technology Co Ltd.
• 10.57. IMEC
• 10.58. Infineon Technologies AG
• 10.59. Integra
• 10.60. Inari Amertron Berhad
• 10.61. Intel Corporation
• 10.62. JCET Group
• 10.63. Jiangsu IC Assembly & Test (ICAT)
• 10.64. Jingdu Semiconductor
• 10.65. Keyang Semiconductor (KYS)
• 10.66. King Yuan Electronics Co., Ltd.
• 10.67. Kioxia
• 10.68. KyLitho
• 10.69. Kyocera
• 10.70. Lam Research
• 10.71. Lapis Technology
• 10.72. LB Semicon Co Ltd.
• 10.73. Leading Interconnect Semiconductor Technology
• 10.74. Lidrotec GmbH
• 10.75. Lux Semiconductors
• 10.76. Malaysian Pacific Industries Berhad
• 10.77. Micron Technology, Inc
• 10.78. Mediatek
• 10.79. Micross Components
• 10.80. Mitsubishi
• 10.81. National Center For Advanced Packaging China (NCAP China)
• 10.82. NEC
• 10.83. Nvidia Corporation
• 10.84. Nepes Corporation
• 10.85. Onsemi
• 10.86. Orient Semiconductor Electronics Ltd.
• 10.87. Panasonic
• 10.88. Powertech Technology Inc
• 10.89. Pragmatic Semiconductor
• 10.90. Qorvo
• 10.91. Renesas
• 10.92. Rigger Micro Technologies (RMT)
• 10.93. Rohm
• 10.94. Rong Semiconductor
• 10.95. Samsung Electronics
• 10.96. Samtec, Inc
• 10.97. Schott AG
• 10.98. Sharp
• 10.99. Shinko Electric Industries
• 10.100. Showa Denko
• 10.101. Sigurd Microelectronics Corporation
• 10.102. Silicon Box
• 10.103. Siliconware Precision Industries (SPIL)
• 10.104. SJ Semiconductor
• 10.105. SK Hynix
• 10.106. Skywater
• 10.107. Sony Corporation
• 10.108. Starmask
• 10.109. STMicroelectronics
• 10.110. Suss Microtec
• 10.111. SZLQ Intelligence (Suzhou Lieqi Intelligent Equipment)
• 10.112. Taiwan Semiconductor Manufacturing Company (TSMC)
• 10.113. Techsense International
• 10.114. Tezzaron Semiconductor
• 10.115. Tongfu Microelectronics Co., Ltd.
• 10.116. Texas Instruments
• 10.117. Tokyo Seimitsu Co., Ltd.
• 10.118. Tong Hsing Electronic Industries, Ltd.
• 10.119. Toshiba
• 10.120. Tower Semiconductor
• 10.121. Unimicron
• 10.122. Unisem
• 10.123. UTAC Group
• 10.124. Walton Advanced Engineering Inc
• 10.125. Winstek Semiconductor Technology Co., Ltd.
• 10.126. Xinhe Semiconductor
• 10.127. Yibu Semiconductor
• 10.128. Yuehai Integrated

11. REFERENCES

List of Tables

• Table 1. Evolution of semiconductor packaging
• Table 2. Summary of key advanced semiconductor packaging approaches
• Table 3. Key Technology Trends in Advanced Semiconductor Packaging
• Table 4. Market Growth Drivers for advanced semiconductor packaging
• Table 5. Challenges Facing Advanced Packaging Adoption
• Table 6. Challenges in transistor scaling
• Table 7. Use cases and benefits of using chiplets in semiconductor design
• Table 8. Specifications of interconnection methods
• Table 9. Interconnection technique in semiconductor packaging
• Table 10. Passive vs active interposer
• Table 11. Comparative benchmark overview table of key semiconductor interconnection technologies
• Table 12. Fan-out packaging process overview
• Table 13. Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates
• Table 14. Benefits of glass in 2.5D glass-based packaging
• Table 15. Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications
• Table 16. Challenges of glass semiconductor packaging
• Table 17. Comparison between silicon, organic laminates and glass as packaging substrates
• Table 18. 2.5D vs. 3D packaging
• Table 19. 2.5D packaging challenges
• Table 20. Market players in 2.5D packaging
• Table 21. Advantages and disadvantages of 3D packaging
• Table 22. Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding
• Table 23. Challenges in 3D Hybrid Bonding
• Table 24. Challenges in scaling bumps
• Table 25. Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:
• Table 26. Micro bumps vs Cu-Cu bumpless hybrid bonding
• Table 27. Benefits of Wafer-Level Packaging
• Table 28. Types of wafer level packaging
• Table 29. Key trends shaping wafer level packaging
• Table 30. Packaging approaches utilized for assembling System-in-Package modules
• Table 31. Considerations for integrating key component categories into system-in-package (SiP) modules/
• Table 32. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages
• Table 33. Key trends influencing adoption of System-in-Package modules
• Table 34. System-in-package (SiP) module applications
• Table 35. Comparison between heterogeneous 3D integration and monolithic 3D integration
• Table 36. Key 2D materials in monolithic 3D integrated circuits
• Table 37. Benefits of monolithic 3D ICs
• Table 38. Challenges of monolithic 3D ICs
• Table 39. Advanced semiconductor packaging trends by market
• Table 40. Design requirements in advanced packaging, by market
• Table 41. Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD)
• Table 42. Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD)
• Table 43. Recent expansion activities by companies in Malaysia
• Table 44. Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD)
• Table 45 : Main Global Wafer Foundry Companies 2023
• Table 46. Market challenges for advanced semiconductor packaging
• Table 47. AMD AI chip range
• Table 48. Intel's products that adopt 3D FOVEROS

List of Figures

• Figure 1. Timeline of different packaging technologies
• Figure 2. Evolution roadmap for semiconductor packaging
• Figure 3. Semiconductor Supply Chain
• Figure 4. Advanced packaging supply chain
• Figure 5. Scaling technology roadmap
• Figure 6. Wafer-level chip scale packaging (WLCSP)
• Figure 7. Embedded wafer-level ball grid array (eWLB)
• Figure 8. Fan-out wafer-level packaging (FOWLP)
• Figure 9. Chiplet design
• Figure 10. Chiplet SoC
• Figure 11. 2D chip packaging
• Figure 12. Typical structure of 2.5D IC package utilizing interposer
• Figure 13. Fan-out chip-first process flow and Fan-out chip-last process flow
• Figure 14. Manufacturing process for glass interposers
• Figure 15. 3D Glass Panel Embedding (GPE) package
• Figure 16. Typical FOWLP structure
• Figure 17. System-in-Package (SiP) for HI
• Figure 18. 2.5D chiplet integration
• Figure 19. Advanced packaging supply chain
• Figure 20. Packaging of sensors used in advanced driver assistance systems (ADAS) and autonomous driving
• Figure 21. Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD)
• Figure 22. Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD)
• Figure 23. Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD)
• Figure 24. Absolic glass substrate
• Figure 25. AMD Radeon Instinct
• Figure 26. AMD Ryzen 7040
• Figure 27. Alveo V70
• Figure 28. Versal Adaptive SOC
• Figure 29. AMD's MI300 chip
• Figure 30. 12-layer HBM3

List of Tables

• Table 1. Evolution of semiconductor packaging.
• Table 2. Summary of key advanced semiconductor packaging approaches.
• Table 3. Key Technology Trends in Advanced Semiconductor Packaging.
• Table 4. Market Growth Drivers for advanced semiconductor packaging.
• Table 5. Challenges Facing Advanced Packaging Adoption.
• Table 6. Challenges in transistor scaling.
• Table 7. Use cases and benefits of using chiplets in semiconductor design.
• Table 8. Specifications of interconnection methods.
• Table 9. Interconnection technique in semiconductor packaging
• Table 10. Passive vs active interposer.
• Table 11. Comparative benchmark overview table of key semiconductor interconnection technologies
• Table 12. Fan-out packaging process overview.
• Table 13. Comparison between mainstream silicon dioxide (SiO2) and leading organic dielectrics for electronic interconnect substrates.
• Table 14. Benefits of glass in 2.5D glass-based packaging.
• Table 15. Comparison between key properties of glass and polymer molding compounds commonly used in semiconductor packaging applications.
• Table 16. Challenges of glass semiconductor packaging.
• Table 17. Comparison between silicon, organic laminates and glass as packaging substrates.
• Table 18. 2.5D vs. 3D packaging.
• Table 19. 2.5D packaging challenges.
• Table 20. Market players in 2.5D packaging.
• Table 21. Advantages and disadvantages of 3D packaging.
• Table 22. Comparison between 2.5D, 3D micro bump, and 3D hybrid bonding.
• Table 23. Challenges in 3D Hybrid Bonding.
• Table 24. Challenges in scaling bumps.
• Table 25. Key methods for enabling copper-to-copper (Cu-Cu) hybrid bonding in advanced semiconductor packaging:
• Table 26. Micro bumps vs Cu-Cu bumpless hybrid bonding.
• Table 27. Benefits of Wafer-Level Packaging.
• Table 28. Types of wafer level packaging.
• Table 29. Key trends shaping wafer level packaging.
• Table 30. Packaging approaches utilized for assembling System-in-Package modules.
• Table 31. Considerations for integrating key component categories into system-in-package (SiP) modules/
• Table 32. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages.
• Table 33. Key trends influencing adoption of System-in-Package modules.
• Table 34. System-in-package (SiP) module applications.
• Table 35. Comparison between heterogeneous 3D integration and monolithic 3D integration.
• Table 36. Key 2D materials in monolithic 3D integrated circuits.
• Table 37. Benefits of monolithic 3D ICs.
• Table 38. Challenges of monolithic 3D ICs.
• Table 39. Advanced semiconductor packaging trends by market.
• Table 40. Design requirements in advanced packaging, by market.
• Table 41. Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD).
• Table 42. Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD).
• Table 43. Recent expansion activities by companies in Malaysia.
• Table 44. Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD).
• Table 45 : Main Global Wafer Foundry Companies 2023.
• Table 46. Market challenges for advanced semiconductor packaging.
• Table 47. AMD AI chip range.
• Table 48. Intel's products that adopt 3D FOVEROS.

List of Figures

• Figure 1. Timeline of different packaging technologies.
• Figure 2. Evolution roadmap for semiconductor packaging.
• Figure 3. Semiconductor Supply Chain.
• Figure 4. Advanced packaging supply chain.
• Figure 5. Scaling technology roadmap.
• Figure 6. Wafer-level chip scale packaging (WLCSP)
• Figure 7. Embedded wafer-level ball grid array (eWLB).
• Figure 8. Fan-out wafer-level packaging (FOWLP).
• Figure 9. Chiplet design.
• Figure 10. Chiplet SoC.
• Figure 11. 2D chip packaging.
• Figure 12. Typical structure of 2.5D IC package utilizing interposer.
• Figure 13. Fan-out chip-first process flow and Fan-out chip-last process flow.
• Figure 14. Manufacturing process for glass interposers.
• Figure 15. 3D Glass Panel Embedding (GPE) package.
• Figure 16. Typical FOWLP structure.
• Figure 17. System-in-Package (SiP) for HI.
• Figure 18. 2.5D chiplet integration.
• Figure 19. Advanced packaging supply chain.
• Figure 20. Packaging of sensors used in advanced driver assistance systems (ADAS) and autonomous driving.
• Figure 21. Global market for Advanced semiconductor packaging, 2020-2035, by packaging type, (billions USD).
• Figure 22. Global market for Advanced semiconductor packaging, 2020-2035, by end use market (billions USD).
• Figure 23. Global market for Advanced semiconductor packaging, 2020-2035, by region (billions USD).
• Figure 24. Absolic glass substrate.
• Figure 25. AMD Radeon Instinct.
• Figure 26. AMD Ryzen 7040.
• Figure 27. Alveo V70.
• Figure 28. Versal Adaptive SOC.
• Figure 29. AMD's MI300 chip.
• Figure 30. 12-layer HBM3.