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Market Research Report

Flexible Printed Circuit Boards

Published by Global Industry Analysts, Inc.
Published February, 2010 Product code 115478
Content info Pages: 493
Price
US $ 4950 PDF by E-mail (Single user license)
US $ 14850 PDF By E-mail (Global License to Company and its Fully-owned Subsidiaries)


Flexible Printed Circuit Boards published by Global Industry Analysts, Inc. in February, 2010. This report consists of Pages: 493 and the price starts from US $ 4950.

Introduction

Abstract

This report analyzes the worldwide markets for Flexible Printed Circuit Boards in US$ Millions by the following end-use markets: Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical, and Packaging. The report provides separate comprehensive analytics for US, Canada, Japan, Europe, Asia-Pacific and Rest of World. Annual forecasts are provided for each region for the period 2007 through 2015. The report profiles 154 companies including many key and niche players worldwide such as 3M, Amphenol Corp, Benchmark Electronics, Inc., Career Technology (MFG.) Co., Ltd., Flexible Circuit Technologies, Inc., Fujikura Ltd., Hutchinson Technology, Inc., Innovex, Inc., MFS Technology Ltd., Minco Products, Inc., Molex, Inc., Multek Flexible Circuits Inc., Multi-Fineline Electronix, Inc., Nan Ya PCB Co., Ltd., Nippon Mektron, Ltd., Nitto Denko Corp., Northpoint Technologies, Inc., Parlex Corp, Si Flex Co., Ltd., Sony Chemical & Information Device Corp., Sumitomo Bakelite Co., Ltd., Sumitomo Electric Industries, Ltd., and Youngpoong Electronics Co., Ltd. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

  • Study Reliability and Reporting Limitations
  • Disclaimers
  • Data Interpretation & Reporting Level
  • Quantitative Techniques & Analytics
  • Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. GLOBAL OUTLOOK

  • Current Scenario and Outlook
  • Asia-Pacific Continues to Dominate Global Market
  • Communications End-use Segment Leads; While Consumer Electronics to Post Fastest Growth
  • Japan Continues to Dominate Flexible Circuits Production; China Catching Up Fast
  • Table 1: Leading Flexible and Rigid-flex Circuit Producers Worldwide (2007 & 2008) (In US$ Million) (includes corresponding Graph/Chart)
  • Table 2: Leading Flexible Circuit Producing Countries Worldwide: 2007 & 2008 (includes corresponding Graph/Chart)
  • Table 3: Leading Rigid-Flex Circuit Producing Countries Worldwide: 2007 & 2008 (includes corresponding Graph/Chart)
  • Competitive Scenario
  • Table 4: Global Flexible Printed Circuit Board Market (2007): Percentage Breakdown of Revenues for Nippon Mektron, Fujikura, Nitto Denko, 3M, M-Flex, MCS, Sony Chemical, Shindo Electric, Sumitomo Bakelite, Hutchinson and Others (includes corresponding Graph/Chart)
  • Overview of End-Use Markets
  • Major Applications of Flexible Printed Circuit Boards
  • Automotive
  • Communication
  • Computing
  • Consumer Electronics
  • Defense and Aerospace
  • Industrial and Medical Sciences
  • Packaging
  • Global PCB Industry - An Overview
  • PCB Production Across Major Producing Nations Declines
  • Table 5: Global Production of Printed Circuit Boards: 2000-2008 (includes corresponding Graph/Chart)
  • Table 6: Leading Producers of Printed Circuit Boards (2007 & 2008): Value Breakdown for China, Japan, Taiwan, South Korea, North America and Europe in US$ Millions (includes corresponding Graph/Chart)

2. MARKET TRENDS

  • Increased R&D Efforts in Substrate Materials
  • List of Common Substrate Materials and Compatible Adhesives
  • Polyimide Leads the FPC Substrate Materials Domain
  • Demand for New Materials to Surge
  • Product Related Advantages Fuel Market Growth
  • Wireless Telecommunications Spawning Significant Demand
  • Mobile Phones - A Key Application Area for Flexible Circuits
  • Less Complex FPCs Dominate Global FPC Market
  • Production Relocation to Low-cost Countries
  • EMS Providers Gain Prominence
  • Adhesiveless Laminates - Gain Popularity

3. PRODUCT OVERVIEW

  • Flexible Circuits- An Introduction
  • Introduction to Flexible Circuit Technology
  • History and Evolution of Flexible Circuits
  • Types of Flexible Circuits
  • Single Layered Flexible Circuits
  • Single Layered Single-Sided Flexible Circuits
  • Single Layered Double-Sided Flex Circuits
  • Multilayered Flex Circuits
  • Rigid-Flex Circuits
  • Other Select Types
  • Double Access Flexible Circuits
  • Sculptured Flex
  • Backplanes
  • Materials Used in Flexible Circuit Manufacture
  • Base Material
  • Polyimide
  • Polyester
  • Polyimide Vs. Polyester
  • New Substrates
  • Conductor Materials
  • Copper as a Conducting Material
  • Non-Copper Metal Foils
  • Promising Direct Apply Technologies
  • Adhesives
  • Polyester Adhesives
  • Polyimide Adhesives
  • Epoxies and Modified Epoxies
  • Acrylic Adhesives
  • Supplementary Adhesives
  • Protective Coatings
  • Selection of Cover-lay Film
  • Benefits of Coverlay
  • Benefits of Cover Coatings
  • Manufacturing of Flexible Circuits
  • The Two Generic Methods of Manufacturing
  • Subtractive Method of Producing Flexible Circuits
  • Image Resist
  • Resist Removal
  • Placement of Cover Layer
  • Creation of Outlines and Holes
  • Testing and Verification
  • Key Advantages of Flexible Circuits
  • Minimization of Packaging Size
  • Minimization of Packaging Weight
  • Reduction in Assembly Time & Cost
  • Reduction in Assembly Error
  • Enhancing System Reliability
  • Other Benefits

4. PRODUCT INTRODUCTIONS

  • IMEC Develops a Novel 3-Dimensional Flex Circuit Integration Process
  • DuPont Launches a New APR Copper Clad Resistor Laminate, Pyralux(r)
  • Pacothane Technologies Introduces PACOFLEX 5000
  • All Flex Develops Customized Flexible Heater circuits
  • Oki Electric Cable Pioneers the Launch of a Three- Dimensional FPC
  • Oki Electric Cable Launches High-Speed Transmission Flexible Circuits

5. RECENT INDUSTRY ACTIVITY

  • Midwest and Bartlett to Integrate PCB Manufacturing Businesses
  • Bomin Electronics Sets-up Facility to Produce PCBs and HDI Board
  • Falcon Holdings Takes Over MBM Flexible Circuits
  • Molex Acquires AFlextech
  • FTG Corp. Inks Supply Deal with Honeywell Aerospace
  • 3M and Arrow Electronics Extend Distribution Agreement
  • Honeywell Inks New Collaborative Agreement with the USDC
  • Circuitronics Takes Over Price Printed Circuits
  • Hanita Coatings Takes Over Stakes in Cidav Printed Circuits
  • Vulcan Flex Circuit Buys and Installs Real-Time X-Ray Inspection System, XRI-1
  • Vulcan Flex Circuit Completes Acquisition of Polar Impedance Test System
  • Flextronics Obtains EC Clearance for Acquiring Solectron
  • Molex Expands Production of Copper Flex Circuits and Assemblies
  • AirBorn Takes Over StrataFlex
  • Tohoku Fujikura to Initiate Construction of US$16.3 Million FPC Facility
  • Fair Friend Group Acquires J & T Flex
  • Cirflex Signs Agreement with PRECO
  • Nistica and Fujikura Sign a Strategic Partnership
  • ITRI Sets up First Flexible Electronics R&D Laboratory in Taiwan
  • Vitex Systems Signs Strategic Partnership with Samsung America
  • General Electric Takes Over GE Fuji Drives America
  • Tonka Bay Completes Acquisition of All Flex Inc

6. FOCUS ON SELECT GLOBAL PLAYERS

  • 3M (US)
  • Amphenol Corp. (US)
  • Benchmark Electronics, Inc. (USA)
  • Career Technology (MFG.) Co., Ltd. (Taiwan)
  • Flexible Circuit Technologies, Inc. (USA)
  • Fujikura Ltd. (Japan)
  • Hutchinson Technology, Inc. (US)
  • Innovex, Inc. (USA)
  • MFS Technology Ltd. (Singapore)
  • Minco Products, Inc. (USA)
  • Molex, Inc. (USA)
  • Multek Flexible Circuits Inc. (USA)
  • Multi-Fineline Electronix, Inc. (US)
  • Nan Ya PCB Co., Ltd. (Taiwan)
  • Nippon Mektron, Ltd. (Japan)
  • Nitto Denko Corp. (Japan)
  • Northpoint Technologies, Inc. (USA)
  • Parlex Corp. (USA)
  • Si Flex Co., Ltd. (South Korea)
  • Sony Chemical & Information Device Corp. (Japan)
  • Sumitomo Bakelite Co., Ltd. (Japan)
  • Sumitomo Electric Industries, Ltd. (JAPAN)
  • Youngpoong Electronics Co., Ltd. (South Korea)

7. GLOBAL MARKET PERSPECTIVE

  • By Region
  • Table 7: World Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
  • Table 8: World Historic Analysis for Flexible Printed Circuit Board Market by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
  • Table 9: World 15-year Perspective for Flexible Printed Circuit Board Market by Geographic Region - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and Rest of World Markets for Years 2003, 2009 & 2015 (includes corresponding Graph/Chart)
  • By End-Use Segment
  • Table 10: World Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market by End-Use Segment- Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical and Packaging Markets Independently Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
  • Table 11: World Historic Analysis for Flexible Printed Circuit Board Market by End-Use Segment- Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical and Packaging Markets Independently Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
  • Table 12: World 15-year Perspective for Flexible Printed Circuit Board Market by End-Use Segment - Percentage Breakdown of Dollar Sales for Automotive, Communication, Computing, Consumer Electronics, Defense & Aerospace, Industrial/Medical and Packaging Markets for Years 2003, 2009 & 2015 (includes corresponding Graph/Chart)

III. MARKET

1. NORTH AMERICA

  • Industry Overview
  • Flexible Circuit Production Statistics
  • Table 13: North American Flexible Circuit Production by Bare Circuits, and Circuit Assembly and Services: 2001 - 2008 (includes corresponding Graph/Chart)
  • Table 14: North American Flexible Circuit Production (1994-2000): A Historical Perspective (includes corresponding Graph/Chart)
  • Slowdown Affects Shipments and Bookings
  • Market Participants

1a. THE UNITED STATES

  • A. Market Analysis
    • Current and Future Analysis
    • Exports & Imports
    • Table 15: US Exports of Flexible Circuits: 2000-2008 (includes corresponding Graph/Chart)
    • Table 16: US Exports of Flexible Circuits by Region: 2008 (includes corresponding Graph/Chart)
    • Table 17: US Imports of Flexible Circuits: 2000-2008 (includes corresponding Graph/Chart)
    • Table 18: US Imports of Flexible Circuits by Region: 2008 (includes corresponding Graph/Chart)
    • Product Launches
    • Strategic Corporate Developments
    • Select Players
  • B. Market Analytics
    • Table 19: US Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
    • Table 20: US Historical Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)

1b. CANADA

  • A. Market Analysis
    • Current and Future Analysis
  • B. Market Analytics
    • Table 21: Canadian Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
    • Table 22: Canadian Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)

2. JAPAN

  • A. Market Analysis
    • Current and Future Analysis
    • Japan - A Global Leader in the Production of Flexible Circuits
    • FPC and PCB Production Declines in 2008
    • Table 23: Japanese Production of Bare Printed Circuit Boards by Type (2007 and 2008): Single and Double Sided Rigid PCBs, Standard Multilayer Rigid PCBs, HDI/Microvial/Build-Up PCBs, Flexible and Rigid Flex Circuits, and IC Substrates and Others (includes corresponding Graph/Chart)
    • Vertical Integration Keeps Japanese Producers in the Lead
    • Japan' s PCB Industry Suffers; Korea and Taiwan Head Out of Recession
    • Strategic Corporate Developments
    • Select Players
  • B. Market Analytics
    • Table 24: Japanese Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
    • Table 25: Japanese Historical Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)

3. EUROPE

  • A. Market Analysis
    • Current and Future Analysis
    • Production of FPCs Rises in 2008; Total PCB Production Plunges
    • Table 26: European PCB Production by Type (2007 & 2008): Values for Single and Double Sided Rigid PCBs, Standard Multilayer Rigid PCBs, HDI/Microvial/Build- Up PCBs, Flexible and Rigid Flex Circuits, and IC Substrates and Others in US$ Million (includes corresponding Graph/Chart)
    • Table 27: European PCB Production by Country (2008): Value Breakdown By Country (includes corresponding Graph/Chart)
    • Product Launches
    • Strategic Corporate Developments
  • B. Market Analytics
    • Table 28: European Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
    • Table 29: European Historical Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)

4. ASIA-PACIFIC

  • A. Market Analysis
    • Current and Future Analysis
    • Industry Overview
  • B. Market Analytics
    • Table 30: Asia-Pacific Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market by Geographic Region - China, and Rest of Asia-Pacific - Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
    • Table 31: Asia-Pacific Historical Analysis for Flexible Printed Circuit Board Market by Geographical Region - China, and Rest of Asia-Pacific - Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)
    • Table 32: Asia-Pacific 15-year Perspective for Flexible Printed Circuit Board Market by Geographic Region - China, and Rest of Asia-Pacific - for Years 2003, 2009 & 2015

4a. CHINA

  • A. Market Analysis
    • Current and Future Analysis
    • China - Leading Consumer of Flexible Circuits Worldwide
    • China- The Second Largest Supplier of FPCs Worldwide
    • FPC Production Rises in 2008
    • Table 33: Chinese PCB Production by Product Type (2007 & 2008): Values for Single and Double Sided Rigid PCBs, Standard Multilayer Rigid PCBs, HDI/ Microvial/Build-Up PCBs, Flexible and Rigid Flex Circuits, and IC Substrates and Others (includes corresponding Graph/Chart)
    • Chinese Printed Circuit Board Industry - An Overview
    • China Leads the Global PCB Industry
    • PCB Production in China Falls in 2009
    • Table 34: PCB Production in China (2000-2009) (includes corresponding Graph/Chart)
    • Challenges Aplenty in Chinese PCB Industry
    • Strategic Corporate Developments
  • B. Market Analytics
    • Table 35: Chinese Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
    • Table 36: Chinese Historical Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)

4b. REST OF ASIA-PACIFIC

  • A. Market Analysis
    • Current and Future Analysis
    • FPC Production Continues to Rise in Taiwan
    • Table 37: Taiwanese PCB Production by Product Type (2007 & 2008): Value Breakdown for Single and Double Sided Rigid PCBs, Standard Multilayer Rigid PCBs, HDI/Microvial/Build-Up PCBs, Flexible and Rigid Flex Circuits, and IC Substrates and Others (includes corresponding Graph/Chart)
    • Production of FCPs and PCBs Decline in South Korea
    • Table 38: South Korean PCB Production by Product Type (2007 & 2008): Value Breakdown for Single and Double Sided Rigid PCBs, Standard Multilayer Rigid PCBs, HDI/Microvial/ Build-Up PCBs, Flexible and Rigid Flex Circuits, and IC Substrates and Others (includes corresponding Graph/Chart)
    • Strategic Corporate Developments
    • Select Players
  • B. Market Analytics
    • Table 39: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
    • Table 40: Rest of Asia-Pacific Historical Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)

5. REST OF WORLD

  • A. Market Analysis
    • Current and Future Analysis
  • B. Market Analytics
    • Table 41: Rest of World Recent Past, Current & Future Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2007 through 2015 (includes corresponding Graph/Chart)
    • Table 42: Rest of World Historical Analysis for Flexible Printed Circuit Board Market Analyzed with Annual Sales in US$ Million for Years 2001 through 2006 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

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