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System-On-A-Chip

Abstract

Description

This report analyzes the worldwide markets for System-On-A-Chip in US$ Million. The global market is analyzed for following end-use segments- Computers, Communication Equipment, Consumer Electronic Devices, Automotive Applications, and Others (Including Industrial Automation, Military, Medical and Other Applications). The report also analyzes the global market for SOCs by the following two major types- SoCs Based on Standard Cell, and SoCs Based on Embedded IP.The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2009 through 2017. Also, a six-year historic analysis is provided for these markets. The report profiles 191 companies including many key and niche players such as Microsemi SoC Products Group, Altera Corporation, ARM Holdings Plc, Broadcom Corporation, Freescale Semiconductor, Inc., GCT Semiconductor Inc., Infineon Technologies AG, Intel Corporation, LSI Corporation, Marvell Technology Group Ltd., Panasonic Corporation, Mentor Graphics Corporation, Renesas Electronics Corporation, NVIDIA Corporation, Palmchip Corporation, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Synopsys, Inc., Taiwan Semiconductor Manufacturing Co., Ltd., Texas Instruments Inc Toshiba America Electronics Components, Inc., Xilinx Inc., Zilog Inc., ON Semiconductors Corporation, and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based upon search engine sources in the public domain.

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

  • Study Reliability and Reporting Limitations
    • Disclaimers
  • Data Interpretation & Reporting Level
    • Quantitative Techniques & Analytics
  • Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEW

  • Semiconductor and IC Industry: A Rudimentary Overview
  • Developments in ICs Over the Years
  • System-on-A-Chip (SoC): A Major Breakthrough in Semiconductor Industry
  • Market Overview
  • Increasing Need for Compactness and High Speed Performance - Rationale for Adoption of SoCs in Electronics Industry
  • Market Scenario
  • 2007-2009 Recession in Restrospect: Instability of the Chip Industry Echoes Downstream into the SoC Market
  • Recovery Gets Underway in the Year 2010
  • Impact of European Debt Crisis: A Review
  • Outlook
  • Computers and Consumer Electronics - Primary Revenue Contributors
  • Use of SoCs in Communication Equipment Gains Traction
    • Wide Application of SoCs in Mobile Phones and Broadband Networks
  • SoCs Market Embracing New Changes in Design Methodology
  • Developments in Multiple Systems-on-a-Chip Augurs Well for SoC Market
  • Key Growth Drivers
  • New End-Use Devices Spark Up SoCs Market
  • Standardization to Drive the Market
  • Innovations to Drive Growth
  • Advent of Three-Dimensional Chips to Boost the Market
    • Appeal of 3D Chip Soars Among End-Use Sectors
  • Competitive Overview
  • Historic Statistical Findings: A Review
    • Table 1: Global Hard Disk Drives (HDD) SoCs Market (2005): Market Share Breakdown by Company for Agere, Marvell and STMicroelectronics (includes corresponding Graph/Chart)
    • Table 2: Global Programmable Logic Device (PLD) Market (2005): Percentage Share Breakdown by Company for Xilinx, Altera and Others (includes corresponding Graph/Chart)

2. MARKET TRENDS & CHALLENGES

  • Increasing Usage of SoC Solutions in Medical Field
  • Growing Demand for 90-nm Technology
  • Customization to Meet Client's Requirements
  • Customizable Analog IPs Add New Dimension to Complex SoCs
  • Embedded Software to Power System-on-a-Chip (SoC) Solutions
  • Advanced ESL Design-for-Verification Solution to Reduce Verification Time for Complex SoCs
  • Dual-Core Processors Gain Ground
  • SoC IP Designs Witness Rising Demand
  • ASIC Designs for Supersystems Make a Foray
  • Development of IP Market
  • Emergence of System-above-Chip (SaC) Market
  • Advent of Lab-on-a-Chip (LoC) Technology
  • Development of Reusable IPs
  • Innovations Address Power Leakage and Multiple Tasks Handling
  • Multi-Tasking Microprocessors Gain Significance
  • EDA and Silicon Intellectual-Property (IP), Two Burgeoning Sectors
  • FPGA Makes Inroads in the Semiconductor Chips Market
  • Development of Premanufactured ASICs, and Flash-and SRAM-Series of FPGAs
  • Innovative Design Configuration of FPGAs
  • Emergence of Three-Tier Design Approach of FPGA-Based Chips
  • Evolution of System-On-A-Programmable Chip (SOPC)
  • Standard Logic and Interface Equipment Prevails
  • Compact Size of Logic Devices Favors Growth
  • Key Challenges
  • High Costs, a Major Deterrent
  • Time-to-Market Pressures
  • Verification Challenges
    • Testers - A Solution to the Challenge
  • IP Compatibility Issue
  • Issues Related to Marketing of ICs
  • Customer & Software Support and Staffing Challenges
  • System-in-Package (SiP) : A Potential Threat to System-on-a-Chip
    • SiP Market

3. SEMICONDUCTOR INDUSTRY OVERVIEW

  • Global Semiconductor Industry - An Overview
  • The Moore's Law Gives Rise to Sophisticated, Faster and Cheaper Chips
  • Technology Advancements Provide Necessary Impetus
  • Semiconductor Industry by Geographic Markets
  • Asia and the US - Two Major Semiconductors Market
  • Leading Semiconductor Players
    • Table 3: World Market for Semiconductors (2009): Breakdown of Revenue of Top 20 Players (In US$ Billion) (includes corresponding Graph/Chart)
    • Table 4: Global Semiconductors Market (2008): Percentage Market Share Breakdown by End-Use Segment (includes corresponding Graph/Chart)
  • MEMS Market

4. PRODUCT OVERVIEW

  • SoC - Emerging Technology in the Global Semiconductor Industry
  • Components of SoC
  • System-on-a-Chip (SoC) Block Diagram
  • SoC Design Benefits
  • "Second-Generation" SoCs
  • ASIC SSOC - A New Dimension
  • SoC Device Types
  • Standard Cells
  • Embedded IP
  • Micro Logic IP
  • Memory IP
  • ASIC/PLD IP
  • Analog IP & Other Components
  • Standards For SOCs
  • SoC Processor Types
  • Soft Instruction Processors
  • Configurable Processors
  • Total Design Strategies for SoC
  • Architecture Strategy
  • Design-for-Test Strategy
  • Validation Strategy
  • Synthesis and Back-End Strategy
  • Integration Strategy

5. SOC END-USE APPLICATIONS

  • Computers
  • Communications Equipment
  • Consumer Electronics Devices
  • Automotive Applications
  • Others
  • Industrial Automation & Military
  • Medical & Office Devices
    • CRM and Hearing Aid Products Dominate the Category
    • New Mixed-Signal Radio-Frequency (RF) Technology Design
    • SoC-Equipped Nanorobots

6. SOC INTELLECTUAL PROPERTY (IP)

  • Interconnect - A Growing Sector of Semiconductor IP Market

7. SOC TECHNOLOGICAL DEVELOPMENTS BY SELECT MARKET PLAYERS

  • System-on-a-Chip (SoC) for Printers
  • W-OFDM-SoCs
  • Xilinx® Virtex™ FPGAs and Embedded Solutions
  • EPON-Based System-on-a-Chip (SoC)
  • RapidChip® SoC Prototyping Platform
  • Analog Devices Othello-E Transceiver
  • True System-on-a-Chip (SoC)

8. PRODUCT DEVELOPMENTS & LAUNCHES

  • Fujitsu Unveils Three SoC Products
  • Texas Instruments Develops SoC Architecture Based on Multicore DSPs
  • Broadcom Launches New Bluetooth SoC Solution
  • Triad Semiconductor Unveils Mocha-1™ Line of SoCs
  • Broadcom Releases High Definition Cable Converter Box
  • STMicroelectronics Unveils STi7108 System-on-Chip
  • DesignArt Unveils DAN3000 System-on-Chip Platform
  • Freescale Unveils i.MX508 Application Processor to Support eReaders
  • Digi Releases Rabbit 6000
  • GlobalFoundries Releases SoC Platform Jointly with ARM
  • CSEM Introduces Customized SoC with Integrated DSP
  • Broadcom Rolls Out Foremost DTA SoC Solution
  • NEC Electronics to Launch Camera Engine 151 SoC
  • Scintera Networks Launches SC1887: Adaptive RFPAL System-on-Chip
  • Actions Semiconductor Launches Series 25 Product Range
  • ChipWrights Unveils CW5631 SoC Based Hardware Development Kit
  • Multi-Protocol, Multi-Rate PHY Offered as Single SoC Solution
  • Conexant Unveils SoC Solution CX92137
  • AppliedMicro Launches APM 83290 SoC
  • Ambarella Introduces A5s SoC
  • Silicon Laboratories Releases EZRadio Wireless IC Solution
  • Savi Technology Launches RFID SoC
  • DiBcom Releases Tuner-Demodulator SoC for DVB-T and ISDB-T
  • Sigma Releases SMP8656 Media Processor SoC
  • Dust Networks Launches ARM Cortex-M3 Processor
  • Teridian Launches 6618 Energy Measurement SoC
  • DesignArt Launches DAN3000 SoC Series
  • Broadcom Unveils WLAN Router SoC Solutions
  • Cavium Networks Introduces PureVu Family of Single-Chip Video Processors
  • Broadcom Introduces SoC Solutions for Digital TV Transmission in Japan
  • IMEC Announces Tools to Optimize MPSoC Design Platforms
  • Maxim Integrated Products Rolls Out MAXQ7667 Microcontroller
  • Creative Introduces ZiiLABS ZMS-05
  • Xilinx Introduces Innovative Development Kits
  • Symwave Develops Single Chip USB 3.0 SW6316, a Storage Controller
  • Broadcom Introduces MoCA-integrated SoCs in the US Market
  • ViXS Systems Plans to Integrate CryptoFirewall Security into XCode 4000 Array
  • NEC Electronics Releases Universal Serial Bus 3.0 SoC Design
  • Broadcom Launches Multi-Format HD STB SoC Solution
  • Aptina Unveils SoC Image Sensor
  • Broadcom Unveils PND on a Chip SoC BCM4760
  • Sequans Communications Launches SQN1220
  • Atheros Communications Introduces Combined WLAN and Bluetooth Connectivity
  • GCT Semiconductor Rolls Out GDM7205 Single Chip Mobile WiMAX Solution
  • Intel Plans to Debut 32-nm Westmere Chips
  • Avnera Introduces AudioMagic 2G
  • Magma Unveils RTL-to-GDSII Reference Flow for POWERVR SGX Graphic Accelerator Cores
  • Cyprus Introduces CY8C28xxx PSoC 1

9. PRODUCT INNOVATIONS/INTRODUCTIONS - A HISTORIC PERSPECTIVE BUILDER

  • MosChip Unveiled System-on-a-Chip (SoC) Processor
  • Freescale Releases MPC8536E PowerQUICC III Processor
  • Intel Introduces CE3100 Processor
  • Intel Introduces EP80579 SoC
  • Samsung Electronics Launches S5K4AW CMOS Image Sensor
  • Win Enterprises Introduces Two New Network Platforms with Intel SoC
  • Panovasic Develops a New System-on-Chip, Apollo I
  • austriamicrosystems Rolls Out a New SoC Magnetic Rotary Encoder
  • Cypress Launches a New PSoC NV Series
  • Neotion Unveils a New Common Interface (CI) Module Range
  • Intel Unveils Intel Media Processor CE 3100
  • Broadcom Launches BCM3545 DTA SoC Solution
  • Eurotech Introduces Eurotech A3pci8024
  • CPU Technology to Launch Acalis CPU872 SoC with Embedded DRAM, Tamper Protection
  • picoChip Unveils PC3xx SoC Range for the Femtocell Sector
  • Samsung Unveils Processors for Digital Photo Frames
  • Marvell Launches New SoC Devices, Marvell® 88F6000 Series
  • Ralink to Introduce New PHY and Ethernet Switch Integrated AP/Router SoC
  • NEC Introduces New EMMA SoCs with In-Built Advanced H.264 VCS Support
  • Freescale Semiconductor Launches New Highly Integrated Two-Core SoC Device
  • Novelics Unveils One-Transistor SRAM for SoC Designers
  • Emerson to Roll Out a Single-board Computer with Dual-Core PowerPC
  • ON Semiconductor Expands IP with Several New IP Blocks
  • GE Fanuc Unveils a New SoC-Based Multicomputer
  • Mindspeed Introduces Comcerto 300 Series of Access VoIP Processors
  • Samsung to Deploy PO4010 Image Sensors in Portable Camera Handsets
  • Magnum Semiconductor Releases ZV1050 Multimedia Application Processor
  • Broadcom Unveils Advanced Encoder/Transcoder SoC Solution
  • Broadcom Showcases High Definition Set-Top Box System-on-a-Chip
  • Broadcom Unveils a Single Chip DBS Set-Top-Box Solution
  • GCT Semiconductor Unveils SoC Solution Supporting WiMAX and WiFi Functionality
  • Infineon Releases CAT-iq™ Wireless Engine
  • Broadcom Showcases a Whole New Range of SoC Solutions for Mobile Devices
  • NVIDIA Introduces an Innovative Applications Processor
  • Samsung Introduces Single-Chip Decoder
  • Toshiba Introduces SoC Solution for ATSC LCD HDTVs
  • Broadcom Uncovers Reference Design Platform for HD Optical Disc Players
  • Broadcom Introduces Digital-to-Analog Adapter
  • STMicroelectronics Introduces 'ST21NFCA' - SoC Solution for the NFC Market
  • Broadcom Unveils SoC Solutions for the Mobile TV Market
  • New Series of IC Tuners from Infineon
  • TI Integrates Bluetooth®, FM and GPS Technologies on to a Single Chip
  • STMicroelectronics Releases Bluetooth® and FM-Radio SoC Solution
  • Upgraded Version of 90-Nanometer Reference Flow from SMIC and Synopsys
  • Syntax-Brillian Opts Digital TV SoC Solution from Broadcom
  • Broadcom Showcases BCM7400B SoC
  • Marvell Introduces Bluetooth Single-Chip Solution
  • D2 Technologies Unveils Embedded VoIP Software
  • Broadcom Rolls Out the New BCM4325 Single-Chip
  • Westinghouse Digital Selects BCM3560 SoC Solution
  • Broadcom Releases the BCM7118 Single Chip
  • Infineon Launches 3G ADSL2+ SoC
  • ARC International Launches New VRaptor™ Media Architecture
  • MOSAID Rolls Out Memorize™ and Fractional-N PLL
  • Starport Systems Unleashes SoC Solution for Gen2 UHF RFID Readers
  • Alvand Technologies Unveils SoC Humming-B™ Family of Tuners
  • MagnaChip Releases MC531EA SoC Imaging Solution
  • Genesis Microchip Unveils the Chaplin DTV family of ICs
  • PMC-Sierra Unveils the PAS65311 GPON ONT Reference Design Solution
  • STMicroelectronics Unleashes the SPEAr Head600 and SPEAr Plus600 ICs
  • CAST, Inc. Rolls Out the SOC Kernels
  • ARM and Northwest Logic's PCI-SIG-compliant solution
  • Cypress Releases The PSoC Express 2.1
  • Texas Instruments Unveils Single-Chip NaviLink™ 5.0 Solution
  • Sonics Launches New Version of SonicsMX® SMART Interconnect™ Solution
  • SanDisk to Roll Out 8-Gb & 16Gb MLC NAND Flash Memory Chip

10. RECENT INDUSTRY ACTIVITY

  • Synopsys to Take Over Magma Design Automation
  • Broadcom Takes Over Provigent
  • IXYS Acquires Zilog
  • HEATCON® Acquires Asset Rights and Technology from EE Solutions
  • Ralink Merges Operations with TrendChip
  • Broadcom Partners with Skyworth-Hitune
  • Broadcom Acquires Teknovus
  • Carbon Design Teams Up with VeriSilicon
  • austriamicrosystems Broadens Use of Cadence Technology
  • SiS Selects Cadence Design Systems
  • Renesas Electronics America Begins Operations as Subsidiary of Renesas Electronics
  • Novatek Chooses Tensilica HiFi Audio Frequency DSP
  • Arrow Electronics Takes Over ETEQ Components
  • MIPS Technologies Joins Forces with Tensilica
  • CoWare and Tensilica Collaborate
  • Marvell and E Ink Announce the Availability of Marvell® ARMADA™, 166E Application Processor
  • Virage Logic Announces Acquisition of NXP's Horizontal CMOS Semiconductor IP Rights and Development Team
  • Virage Logic Announces Purchase of ARC International
  • Sigma Designs to Take Over Coppergate Communications
  • CoWare and ARM Collaborate
  • Cadence Inks Collaboration Agreement with ARM
  • Samsung Electronics and Sigma Designs Collaborate
  • Entropic and ViXS Systems Collaborate to Develop HD NAS Reference Design
  • BroadLight, Jungo Announce Partnership for GPON Residential Gateway Reference Platform
  • Entropic and Intel Digital Home to Announce Collaboration
  • MosChip and IdealBT Sign Technology Partnership
  • UEI Acquires Universal Remote Control Software Technology and Associated Assets from Zilog
  • Synopsys Acquires CHIPit Business Division of ProDesign
  • Mentor Graphics Takes Over LogicVision
  • Fujitsu to Use Atrenta's SpyGlass-CDC Product to Reduce Design Risks

11. STRATEGIC CORPORATE DEVELOPMENTS - A HISTORIC PERSPECTIVE BUILDER

  • ZF Micro and Chip-1 Exchange Signs Distribution Agreement
  • eSilicon Associates with SiCortex for HPC Products
  • Arrow Electronics Takes Over Excel Tech
  • Comtrend Deploys BL2348 GPON RG SoC Solution of BroadLight
  • ARM Inks Technology Licensing Agreement with Toshiba
  • ARC Inks Licensing Agreement with TM Technology
  • Elpida Memory Inks Partnership Agreement with UMC
  • Silvus Technologies Inks Partnership Agreement with Ittiam Systems
  • China Digital TV Inks Collaboration Agreement with Intel
  • NextWave Wireless and Huawei Collaborate
  • Teradyne Acquires Eagle Test
  • Billion Electric Deploys BroadLight BL2348RGSoC Solution
  • Sigma Designs Inks Collaboration Agreement with Microsoft
  • Broadcom Acquires DTV Business of AMD
  • Arkados and STMicro Enters into Agreement to Produce HomePlug AV SoC
  • Airtel Selects Broadcom to Introduce DTH TV Service
  • GainSpan Enters into Strategic Partnership with Ekahau
  • NEC Signs Agreement with IBM
  • Intel Enters into Partnership with Yahoo
  • Mindspeed Technologies Forms Alliance with ARM
  • Gennum Takes Over ASIC Architect
  • DSP Group Licenses VoStoc from SPIRIT DSP
  • Pixelplus Signs Agreement with KC Uppertech
  • Wasion and Teridian Enter into an Alliance
  • ON Semiconductor Acquires AMI Semiconductor
  • Broadcom Takes Over Sunext Design
  • Broadcom Collaborates with Microsoft
  • Broadcom Along with Coship Provides HD Set-Top Box Solution in China
  • Zilog Signs Distribution Agreement with Nu Horizons
  • BroadLight partners with ITRI
  • ARC Extends Collaboration Agreement with Toshiba
  • Samsung Uses Integrated FM Radio and Bluetooth® SoC from Broadcom
  • NEC Opts Wipro to Provide Semiconductor Design Solutions
  • Axiom Invests US$3 Million for New R&D Center in India
  • Matsushita Implements IC Compiler of Synopsys
  • EtherWaves Acquires Sonarics
  • Silicon Image Acquires sci-worx
  • Cortina Systems Acquires ImmenStar
  • Wipro Acquires OTCS
  • Synopsys Acquires MOSAID IP Assets
  • BroadLight Collaborates with OpenCon Systems
  • Mindspeed Partners with Terawave
  • IC Nexus Partners with HDL Design House
  • Global Unichip Allies with Vivante Graphics
  • Jazz and Fujitsu Join Forces
  • Coronis Systems Partners with Essensium N.V.
  • Global Unichip Opts Testing Solution from Synopsys
  • Core Logic to Establish Solution Center in China
  • Newark Signs Franchise Agreement with Cypress
  • Silicon Image Signs an Accord with Sunplus
  • ARC Signs Multiple Agreements
  • Global IP Sound Changes to Global IP Solutions
  • Faraday Forms an Alliance with Palmchip Corporation
  • CAST Enters into a Distribution Agreement with S2C
  • Renesas - ZMD Alliance to Introduce 900-MHz Band ZigBee® Chipset by 2008
  • Renesas Enters into an Agreement with Key Stream Corporation
  • Renesas and Matsushita into their Fifth Stage of Collaboration
  • Renesas Employs Synopsys' VCS Verification Solution and VMM Methodology
  • Renesas Adopts Synopsys' IC Compiler Solution
  • S2C Inc. is Tensilica® Inc.'s New Prototyping Partner in China
  • Sonics Inc.® Enters into an Agreement with Ricoh Company
  • MoSys Adopts SMIC's CMOS Process Technology
  • e2v Opts Tower Semiconductor to Manufacture CMOS Image Sensors
  • Haier Group Adopts Broadcom's Digital TV System-on-Chip Solution

12. FOCUS ON SELECT PLAYERS

  • Microsemi SoC Products Group (US)
  • Altera Corporation (US)
  • ARM Holdings Plc (UK)
  • Broadcom Corporation (US)
  • Freescale Semiconductor, Inc. (US)
  • GCT Semiconductor Inc. (US)
  • Infineon Technologies AG (Germany)
  • Intel Corporation (US)
  • LSI Corporation (US)
  • Marvell Technology Group Ltd. (US)
  • Panasonic Corporation (Japan)
  • Mentor Graphics Corporation (US)
  • Renesas Electronics Corporation (Japan)
  • NVIDIA Corporation (US)
  • Palmchip Corporation (US)
  • Samsung Electronics Co., Ltd. (South Korea)
  • STMicroelectronics N.V. (Switzerland)
  • Synopsys, Inc. (US)
  • Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
  • Texas Instruments Inc (US)
  • Toshiba America Electronics Components, Inc (US)
  • Xilinx Inc. (US)
  • Zilog Inc. (US)
  • ON Semiconductors Corporation (US)
  • Ziptronix, Inc. (US)

13. GLOBAL MARKET PERSPECTIVE

    • Table 5: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Geographic Region/ Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2009 through 201 (includes corresponding Graph/Chart)
    • Table 6: World Historic Review for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)
    • Table 7: World 15-Year Perspective for System-on-a-Chip (SoC) by Geographic Region/ Country - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets for Years 2003, 2011 and 2017 (includes corresponding Graph/Chart)
  • Global Market for System-on-a-Chip (SoC) by Product Type
    • Table 8: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2009 through 2017(includes corresponding Graph/Chart)
    • Table 9: World Historic Review for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)
    • Table 10: World 15-Year Perspective for System-on- a-Chip (SoC) by Product Type - Percentage Breakdown of Dollar Sales for SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets for Years 2003, 2011 and 2017 (includes corresponding Graph/Chart)
  • Global Market for System-on-a-Chip (SoC) by End-Use Application
    • Table 11: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2009 through 2017 (includes corresponding Graph/Chart)
    • Table 12: World Historic Review for System-on-a- Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)
    • Table 13: World 15-Year Perspective for System-on- a-Chip (SoC) by End-Use Application - Percentage Breakdown of Dollar Sales for Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets for Years 2003, 2011 and 2017 (includes corresponding Graph/Chart)

III. MARKET

1. THE UNITED STATES

  • A. Market Analysis
    • Rise in SoC End-Use Sectors Drives the Growth
    • Technological Innovations Add to Growth
    • The U.S. Companies Follows Outsourcing Strategy to Reduce Costs
    • Semiconductors Market in North America
    • Focus on Select Players
      • Atmel Corporation
      • BroadLight, Inc.
      • Cadence Design Systems, Inc
      • Conexant Systems, Inc
      • CPU Technology, Inc
      • Cypress Semiconductor Corporation
      • Enpirion Inc.
      • Eureka Technology, Inc.
      • Fujitsu Semiconductor America, Inc.
      • IBM Microelectronics
      • Mindspeed Technologies, Inc.
      • MIPS Technologies Inc.
      • National Semiconductor Corporation
      • Renesas Electronics America Inc.
      • NeoMagic Corporation
      • PMC-Sierra Inc.
      • S2C Inc.
      • Sonics, Inc
      • Wipro Technologies
    • Major End-Users
      • RF Micro Devices Inc
  • B. Market Analytics
    • Table 14: US Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2009 through 2017 (includes corresponding Graph/Chart)
    • Table 15: US Historic Review for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)

2. CANADA

  • Market Analytics
    • Table 16: Canadian Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2009 through 2017(includes corresponding Graph/Chart)
    • Table 17: Canadian Historic Review for System-on-a- Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)

3. JAPAN

  • A. Market Analysis
    • An Overview of Japanese Semiconductor Market
      • Consumer Profile
      • Foreign Players Tie-Up with Local Fabricators and Vendors
      • Local Companies Expand Customer Base
      • Growth in IC Sector
    • Hitachi, Ltd. - A Select Player
  • B. Market Analytics
    • Table 18: Japanese Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2009 through 2017(includes corresponding Graph/Chart)
    • Table 19: Japanese Historic Review for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)

4. EUROPE

  • A. Market Analysis
    • Market Trends
      • SoC Deployment Rises for the Automotive and the Communications Sector
      • Demand for Pre-Configured Functional IP Blocks Rising
      • Subcontracting Increases for Final SoC Products Assembly to Low-Cost European Countries
    • Semiconductors Market Overview
    • Focus On Select Players
      • Essensium NV (Belgium)
      • Renesas Electronics Europe GmbH (Germany)
      • Nordic Semiconductor (Norway)
  • B. Market Analytics
    • Table 20: European Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2009 through 2017(includes corresponding Graph/Chart)
    • Table 21: European Historic Review for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)

5. ASIA-PACIFIC

  • A. Market Analysis
    • Asia Emerges as a Major Market for SoC Deployment in Wireless Devices
    • China
    • India
      • Overview on Semiconductor Industry
      • SoC Market
      • From Just Design to Complete Solutions
      • Challenges Faced
    • South Korea
      • Korean SoC Market on a Rise
      • Integrated Circuits (ICs) Market
    • Focus On Select Players
      • 5V Technologies Taiwan, Ltd (Taiwan)
      • Dongbu HiTek Company Ltd. (South Korea)
      • EE Solutions, Inc (Taiwan)
      • Faraday Technology Corporation (Taiwan)
      • Global Unichip Corporation (Taiwan)
      • IC Nexus Co., Ltd (Taiwan)
      • Silicon Motion Technology Corp. (Taiwan)
      • United Microelectronics Corp. (Taiwan)
  • B. Market Analytics
    • Table 22: Asia-Pacific Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2009 through 2017(includes corresponding Graph/Chart)
    • Table 23: Asia-Pacific Historic Review for System- on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)

6. REST OF WORLD

  • Market Analytics
    • Table 24: Rest of World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2009 through 201 (includes corresponding Graph/Chart)
    • Table 25: Rest of World Historic Review for System- on-a-Chip (SoC) Market with Annual Sales Figures in US$ Million for Years 2003 through 2008 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

  • 3DSP Corporation (USA)
  • 5V Technologies Ltd. (Taiwan)
  • 8X8, Inc. (USA)
    • Netergy Microelectronics, Inc. (USA)
  • Actel Corporation (USA)
  • Actions Semiconductor Co., Ltd. (China)
  • Advanced Micro Devices, Inc. (USA)
    • ATI Technologies, Inc. (Canada)
  • Advantest Corporation (Japan)
    • Advantest America, Inc. (USA)
  • Adventiq Ltd. (UK)
  • Agilent Technologies, Inc. (USA)
  • Alcatel-Lucent (France)
  • Altera Corporation (USA)
  • Alvand Technologies, Inc. (USA)
  • AMI Semiconductor (USA)
  • Analog Devices, Inc. (USA)
  • Ansoft Corporation (USA)
  • Applied Materials, Inc. (USA)
  • Arc International (USA)
  • ARM Holdings PLC (UK)
    • ARM, Inc. (USA)
  • ASAT Holdings Ltd. (USA)
  • ASML Netherlands BV (The Netherlands)
  • Atheros Communications, Inc. (USA)
  • Atmel Corporation (USA)
  • Atrenta, Inc. (USA)
  • Aura Communications Technology, Inc. (USA)
  • Austriamicrosystems AG (Austria)
  • Axiom Design Automation (USA)
  • Barcelona Design, Inc. (USA)
  • Bay Microsystems, Inc. (USA)
  • Broadcom Corporation (USA)
  • Broadlight, Inc. (USA)
  • Cadence Design Systems, Inc. (USA)
  • California Micro Devices Corporation (USA)
  • Canon, Inc. (Japan)
  • Celoxica Ltd. (UK)
  • Centillium Communications, Inc. (USA)
  • CEVA, Inc. (USA)
  • Chartered Semiconductor Manufacturing Ltd. (Singapore)
  • Check Point Software Technologies Ltd. (Israel)
  • Chipcon AS (Norway)
  • ChipIdea Microelectronica SA (Portugal)
  • ChipMD, Inc. (USA)
  • ChipX (USA)
  • Cirrus Logic, Inc. (USA)
  • Cisco Systems, Inc. (USA)
  • Conexant Systems, Inc. (USA)
  • Core Logic (South Korea)
  • Cortina Systems, Inc. (USA)
  • CowareR, Inc. (USA)
  • CPU Technology, Inc. (USA)
  • Cradle Technologies, Inc. (USA)
  • CSMC Technologies Corporation (China)
  • Cypress Semiconductor Corporation (USA)
  • Denali Software, Inc. (USA)
  • Dongbu Hitek Co., Ltd. (South Korea)
  • DSP Group, Inc. (USA)
  • EE Solutions, Inc. (Taiwan)
  • Elan Microelectronics Corporation (Taiwan)
  • Emulation and Verification Engineering (EVE-USA, Inc.)
  • (USA)
  • Enpirion, Inc. (USA)
  • Essensium (Belgium)
  • Eureka Technology, Inc. (USA)
  • EVE Corporation (USA)
  • Fairchild Semiconductor Corporation (USA)
  • Faraday Technology Corporation (Taiwan)
  • Flextronics International Ltd. (Singapore)
  • Forte Design Systems (USA)
  • Freescale Semiconductor, Inc. (USA)
  • Fujitsu Ltd. (Japan)
    • Fujitsu Microelectronic America, Inc. (USA)
  • GCT Semiconductor, Inc. (USA)
  • GenesisR Microchip, Inc. (USA)
  • Global IP Solutions, Inc. (USA)
  • Global Unichip Corporation (Taiwan)
  • HCL Technologies (India)
  • Hewlett-Packard Company (USA)
  • Hitachi Ltd. (Japan)
  • Hynix Semiconductor, Inc. (Korea)
  • International Business Machines Corporation (IBM) (USA)
    • IBM Microelectronics (USA)
  • ICNexus Co., Ltd. (Taiwan)
  • Ignios Ltd. (UK)
  • Imagination Technologies Ltd. (UK)
  • Improv Systems, Inc. (USA)
  • Infineon Technologies AG (Germany)
  • Insilica, Inc. (USA)
  • Insyte Corporation (USA)
  • Integrated Circuit Solution, Inc. (Taiwan)
  • Integrated Device Technology, Inc. (USA)
  • Intel Corporation (USA)
  • Jazz Semiconductor, Inc. (USA)
  • Kawasaki Microelectronics America, Inc. (USA)
  • Key ASIC, Inc. (USA)
  • KLA-Tencor Corporation (USA)
  • Lattice Semiconductor Corporation (USA)
  • LSI Corporation (USA)
    • C-CubeMicrosystems (USA)
  • Macronix International Co., Ltd. (Taiwan)
  • Magma Design Automation, Inc. (USA)
  • MagnaChip Semiconductor Ltd. (Korea)
  • Marvell Technology Group Ltd. (USA)
    • Marvell Semiconductor, Inc. (USA)
  • Mediatek, Inc. (Taiwan)
  • Mentor Graphics Corporation (USA)
  • Micron Technology, Inc. (USA)
  • Micronas Semiconductor Holding AG (Switzerland)
  • Microsemi SoC Division (USA)
  • Mindspeed Technologies, Inc. (USA)
  • MIPS Technologies, Inc. (USA)
    • First Silicon Solutions, Inc. (USA)
  • Mistletoe Technologies (USA)
  • Mitsubishi Electric Corporation (Japan)
  • Mobileye NV (The Netherlands)
  • Mosaid Technologies, Inc. (Canada)
  • Motorola, Inc. (USA)
    • Motorola TTPcom Product Group (UK)
  • Myson Century, Inc. (USA)
  • National Semiconductor Corporation (USA)
  • Nazomi Communications, Inc. (USA)
  • NEC Corporation (Japan)
    • NEC Electronics Corporation (Japan)
    • NEC Electronics America, Inc. (USA)
    • NEC Electronics (Europe) GmbH (Germany)
  • NeoMagic Corporation (USA)
  • Newport Media, Inc. (USA)
  • Nordic Semiconductor ASA (Norway)
  • Nortel Networks Corporation (Canada)
  • Novellus Systems, Inc. (USA)
  • NVIDIA Corporation (USA)
  • OKI Electric Industry Co., Ltd. (Japan)
    • OKI Semiconductor Company (USA)
  • Olympus Corporation (Japan)
  • ON Semiconductor Corporation (USA)
  • Palmchip Corporation (USA)
  • Panasonic Corporation (Japan)
    • Panasonic Semiconductor (USA)
  • Patni Computer Systems Ltd. (India)
  • Pentax Imaging Company (USA)
  • Philips Semiconductors (The Netherlands)
  • Picochip Designs Ltd. (UK)
  • Pixel Plus Co., Ltd. (Korea)
  • Pixelworks, Inc. (USA)
    • Equator Technologies (USA)
  • PMC-Sierra, Inc. (USA)
  • Provigent, Inc. (USA)
  • QinetiQ RTES (USA)
  • Qualcomm, Inc. (USA)
  • Quicklogic Corporation (USA)
  • Rambus, Inc. (USA)
  • Renesas Electronics Corporation (Japan)
  • RF Micro Devices (USA)
  • S2C, Inc. (USA)
  • Sagantec Israel Ltd. (Israel)
    • Sagantec (USA)
  • Samsung Electronics Co., Ltd. (South Korea)
    • Samsung Semiconductor, Inc. (USA)
  • SanDisk Corporation (USA)
  • Seagate Technology LLC (USA)
  • Seiko Epson Corporation (Japan)
  • Semiconductor Manufacturing International Corporation
  • (China)
  • Semtech Corporation (USA)
  • Sequans Communications (France)
  • Sequence Design, Inc. (USA)
  • Sharp Microelectronics of The Americas (USA)
  • Sigmatel, Inc. (USA)
  • Silicon Image, Inc. (USA)
  • Silicon Motion Technology (Taiwan)
  • Silterra Malaysia Sdn. Bhd. (Malaysia)
  • SkyPilot Networks, Inc. (USA)
  • Sonics, Inc. (USA)
  • Sony Corporation (Japan)
  • Starport Systems, Inc. (USA)
  • STMicroelectronics NV (Switzerland)
  • Sunplus Technology Co., Ltd. (Taiwan)
  • Synopsys, Inc. (USA)
  • Synplicity, Inc. (USA)
  • Taiwan Semiconductor Manufacturing Co., Ltd.
  • (Taiwan)
  • TAK Imaging, Inc. (USA)
  • Teknovus, Inc. (USA)
  • Telairity Semiconductor, Inc. (USA)
  • TelASIC Communications (USA)
  • Telecis Wireless, Inc. (USA)
  • Tensilica, Inc. (USA)
  • Terawave Communications (USA)
  • Texas Instruments, Inc. (USA)
  • The Linley Group, Inc. (USA)
  • Theseus Logic, Inc. (USA)
  • Tokyo Electron Ltd. (Japan)
  • Toshiba Corporation (Japan)
    • Toshiba America Electronic Components, Inc. (USA)
    • Toshiba Semiconductor Company (Japan)
  • Tower Semiconductor Ltd. (Israel)
  • Triad Semiconductor (USA)
  • Trident Microsystems, Inc. (USA)
  • United Microelectronics Corporation (Taiwan)
  • Virage Logic Corporation (USA)
  • Vitesse Semiconductor Corporation (USA)
  • Wavesat, Inc. (Canada)
  • White Electronic Designs Corporation (USA)
  • Wi-LAN, Inc. (Canada)
  • Winbond Electronics Corporation (Taiwan)
  • Wipro Ltd. (India)
    • Wipro Technologies (USA)
  • X-Fab Sarawak Sdn. Bhd. (Malaysia)
  • Xilinx, Inc. (USA)
  • Zarlink Semiconductor, Inc. (USA)
  • ZiLOG, Inc. (USA)
  • Ziptronix, Inc. (USA)
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