LED and OLED Lighting: Market Analysis and Manufacturing Trends

Table of Contents

Chapter 1 Introduction

Chapter 2 Recent Progress in High Brightness LED Technology and Applications

• 2.1 LED: Theory of Operation
• 2.2 Intellectual Property Map
• 2.3 LED Manufacturing Technologies & Costs
• 2.4 LED Market General Illumination

Chapter 3 Processing Equipment

• 3.1 Introduction
• 3.2 Deposition
  • 3.2.1 MOCVD for SSL - Productivity Challenges and Solutions
  • 3.2.2 Low temperature Remote Plasma Chemical Vapor Deposition (RPCVD)
• 3.3 Chemical Mechanical Planarization
• 3.4 Defect Inspection and Testing
• 3.5 Lithography
  • 3.5.1 Steppers

Chapter 4 Materials of Construction

• 4.1 Introduction
• 4.2 GaN-based LED for General Lighting
  • 4.2.1 Methods to Improve White LED Efficiency
  • 4.2.2 Time-to-Market for LED substrates
• 4.3 LED Phosphor Manufacturing Issues
  • 4.3.1 Current LED Phosphor Manufacturing
  • 4.3.2 LED Phosphor Cost

Chapter 5 Packaging and Assembly Issues for High Brightness LEDs

• 5.1 Packaging for HB LEDs
  • 5.1.1 Bonding
  • 5.1.2 Die/Ball Bonding
  • 5.1.3 Scribing
• 5.2 Wafer Level Packaging HB LEDs
• 5.3 Thermal Issues
• 5.4 Test and Inspection

Chapter 6 National Programs As Innovation Drivers

• 6.1 DOE Solid-State Lighting Manufacturing Initiative
• 6.2 DOE Solid-State Lighting Program Mission and Goal
• 6.3 Major National Research Programs Pertaining to LEDs
• 6.4 Challenges Facing SSL Manufacturing

Chapter 7 OLED Lighting

• 7.1 Opportunities for Luminaire Manufacturers
• 7.2 How Does an OLED Work
• 7.3 Differences Between OLED Lighting and OLED Display
• 7.4 Benefits of OLED Lighting Technology
• 7.5 OLED Performance Metrics

Chapter 8 OLED Manufacturing

• 8.1 Deposition Equipment and Processes for OLED Lighting
  • 8.1.1 Vacuum Deposition Or Vacuum Thermal Evaporation (VTE)
  • 8.1.2 Organic Vapor Deposition (OVPD)
  • 8.1.3 Inkjet Printing
  • 8.1.4 Roll-to-Roll (R2R)
• 8.2 General OLED Manufacturing Cost Considerations
• 8.3 Lithography
• 8.4 Substrates and Encapsulation
  • 8.4.1 Substrate and Encapsulation Material Selection
  • 8.4.2 Substrate Coatings
  • 8.4.3 Transparent Electrodes
  • 8.4.4 Encapsulation
• 8.5 Inspection and Quality Control

Chapter 9 Outlook for the Worldwide OLED Market

• 9.1 Introduction
• 9.2 Passive Matrix Capacity and Demand
• 9.3 Active Matrix Capacity and Demand
• 9.4 Cost Challenges for OLED Lighting

Chapter 10 Outlook for the Worldwide High-Brightness LED Market

• 10.1 HB LED Technology
• 10.2 HB LED Market Overview and trends
  • 10.2.1 Market Drivers for SSL
  • 10.2.2 LED Backlights for Notebook PCs
  • 10.2.3 LED Backlights for LCD TVs
  • 10.2.4 LED Backlights for Other Applications
  • 10.2.5 LED Lighting Market
  • 10.2.6 LED Active Outdoor Display Market
  • 10.2.7 LED Signal Market
  • 10.2.8 LED Automotive Market
  • 10.2.9 LED Mobile Market

List of Tables

• 2.1 Color, Wavelength Material Of LED
• 2.2 Light Source Comparison
• 2.3 Comparison of LED, HB-LED, UHB-LED Characteristics
• 3.1 Epitaxy Metrics from Initial Solid-State Lighting Manufacturing R&D Roadmap
• 3.2 Process Control Metrics
• 4.1 Production Method for Various LEDs
• 4.2 LED Cost Model: Impact of Substrate Choice
• 4.3 Comparison of $/klm for LED Made on Various 2" Substrates
• 5.1 Properties of Die Bonding Processes
• 7.1 Efficiency of Emitter Materials
• 7.2 Status of Technology Towards Lighting Targets
• 7.3 Cost Targets for Panels
• 7.4 Cost Comparison OLED Display vs Lighting
• 8.1 Cost Targets for Panels Produced by Traditional Methods
• 10.1 Forecast of LED Backlights for Notebook PCs
• 10.2 Forecast of LED Backlights for LCD TVs
• 10.3 Forecast of LED Backlights for Other Application
• 10.4 Forecast of LED Lighting Market
• 10.5 Forecast of LED Active Outdoor Display Market
• 10.6 Forecast of LED Signal Market
• 10.7 Forecast of LED Automotive Market
• 10.8 Forecast of LED Mobile Market
• 10.9 Top 10 LED Vendors

List of Figures

• 2.1 Operation of LED
• 2.2 Key Intellectual Property Relationships
• 2.3 DOE Roadmap
• 2.4 Relative Manufacturing Costs
• 2.5 Pareto Analysis Of SSL Manufacturing Costs
• 2.6 Market drivers for LED Biz and Applications
• 2.7 SSL vs. Classical Technologies
• 2.8 LED Performance vs. Traditional Light Sources
• 2.9 Energy Production and Use Comparison
• 2.10 Worldwide LED Market Forecast
• 3.1 SSL - LED manufacturing with MOCVD: productivity and Cost Analysis
• 3.2 Larger Wafer Size: GaN LEDs
• 3.3 Global Shipments of MOCVD Tools By Vendor
• 3.4 Global Shipments of MOCVD Tools By Region
• 3.5 Diagram of RPCVD Reactor
• 3.6 Comparison between MOCVD and RPCVD
• 3.7 CMP Process
• 3.8 Nanoimprint Lithography System
• 3.9 The Phlatlight Chip
• 4.1 Regular LED (white) Front-End Steps
• 4.2 Current Blocking Layer
• 4.3 Regular LED (white) Production Costs for 100k wafers/year
• 4.4 HB LED (white) Production Costs for 100k wafers/year
• 4.5 Main Manufacturing Steps for GaN-based LED
• 4.6 Regular LED (white) Back-End
• 4.7 Methods to Improve White LED Efficiency
• 4.8 Phosphor Coating - Four Approaches
• 5.1 Hybrid Integration Approach to HD-LED Package
• 5.2 Chain Wire Bond
• 5.3 HB-LED with Silicon Carrier Submount
• 5.4 Silicon interposer for MEMS / LED Applications
• 5.5 High Brightness LED
• 5.6 SMD Package Cost Structure
• 5.7 Packaging Changes Result in Optical Improvements
• 5.8 Substrate Solutions for HB/HP LEDs
• 6.1 DOE Solid-State Lighting Program Strategy
• 6.2 DOE Efficacy Targets
• 6.3 Congressional Appropriations
• 6.4 SSL R&D Project Funding
• 6.5 Price Targets
• 7.1 OLED Lighting Stack
• 8.1 Schematic of VTE Deposition System
• 8.2 Schematic of OVPD Deposition System
• 8.3 Comparison Between VTE and OVPD Technology
• 8.4 Schematic of Inkjet Deposition System
• 8.5 Schematic of R2R Deposition System
• 8.6 Illustration of Planarization Layer on OLED
• 9.1 Schematic of PMOLED
• 9.2 PMOLED Stack/Driving Architecture
• 9.3 Schematic of AMOLED
• 9.4 Passive Matrix OLED Capacity and Demand
• 9.5 Active Matrix OLED Capacity and Demand
• 10.1 LED Market by Sector
• 10.2 Worldwide LED Market Forecast