Thin Film Deposition: Trends, Key Issues, Market Analysis published by The Information Network in January, 2011. This report consists of 160 PAGES and the price starts from US $ 2495.
Abstract
Thin film deposition processes play a critical role in the production of
high-density, high-performance microelectronic products. Considerable progress
has been achieved in the development of deposition processes -- and in the
development of the reactor systems in which they are carried out. This report
discusses relevant mechanisms; processing, system, and materials aspects,
potential advances, and considerations regarding extendibility to a wafer
diameter of 300 mm.
With the introduction of new thin-film materials to consistently shrinking
microelectronic devices and circuits, and as the aperture ratio of an
integrated-circuit structure increases, conformal step coverage becomes
increasingly difficult to achieve. This report compares some of the issues
impacting users of different deposition tools, including: APCVD (SACVD),
LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD.
In addition, as device geometries shrink, semiconductor manufacturing has
become increasingly complex and precise, requiring a better understanding of
the specific processes involved. These issues are described in the report.
The core focus of this report will be to quantify and analyze the impact of
these technology trends, and to discuss their consequences. It will be vital
reading for firms in the display business seeking to broaden their product
range into new areas of large area electronics and for other electronics firms
who need to understand how the budding area of large area electronics will
produce new revenues for them.
This comprehensive study provides information on the various digital signal
processors by capability and vendor. Identifies various types of end
applications, determines their current market status, defines trends, and
presents forecasts of growth over the next five years. It discusses
technological issues, including the latest process developments
This report also gives insights to suppliers for future user needs and should
assist them in long range planning, new product development and product
improvement. A market forecast for DSP chips and end applications is presented.
Table of Contents
Chapter 1 - Introduction
Chapter 2 - Executive Summary
Chapter 3 - Physical Vapor Deposition
- 3.1 Introduction
- 3.2 Sputtering Technology
- 3.3 Plasma Technology
- 3.4 Reactor Designs
- 3.4.1 Long-Throw Deposition
- 3.4.2 Collimated Sputter Deposition
- 3.4.3 Showerhead Deposition
- 3.4.4 Ionized PVD
- 3.5 Semiconductor Processing
- 3.5.1 Feature Patterning
- 3.5.2 Gap Fill
- 3.6 Targets
Chapter 4 - Chemical Vapor Deposition
- 4.1 Introduction
- 4.2 Chemical Vapor Deposition (CVD) Techniques
- 4.2.1 APCVD
- 4.2.2 LPCVD
- 4.2.3 PECVD
- 4.2.4 HDPCVD
- 4.2.5 ALD
Chapter 5 - Electrochemical Deposition
- 5.1 Introduction
- 5.2 Reactor Design
- 5.3 Challenges
- 5.4 Additives
- 5.5 Processing
- 5.5.1 Superfilling
- 5.5.2 Aspect Ratios
- 5.6 Copper Cathodes
- 5.7 Wet Copper Seed-Layer
Chapter 6 - Film Deposition And Film Properties
- 6.1 Introduction
- 6.2 Dielectric Deposition
- 6.2.1 Silicon Dioxide
- 6.2.1.1 Thermal CVD
- 6.2.1.2 PECVD
- 6.2.1.3 HDPCVD
- 6.2.2 Silicon Nitride
- 6.2.2.1 Thermal CVD
- 6.2.2.2 PECVD
- 6.2.2.3 HDPCVD
- 6.2.3 High-K Dielectrics
- 6.2.4 Low-K Dielectrics
- 6.3 Metal Deposition
- 6.3.1 Aluminum
- 6.3.2 Tungsten/Tungsten Silicide
- 6.3.3 Titanium Nitride
Chapter 7 - Vendor Issues
- 7.1 Introduction
- 7.2 300mm Processing
- 7.3 Integrated Processing
- 7.4 Copper
- 7.5 Metrology
- 7.6 ESD
- 7.7 Parametric Test
Chapter 8 - Market Forecast
- 8.1 Introduction
- 8.2 Key Issues
- 8.3 Market Forecast Assumptions
- 8.4 Market Forecast
- 8.4.1 Chemical Vapor Deposition
- 8.4.2 Physical Vapor Deposition
- 8.4.3 Copper Electroplating Market
- 8.4.4 Atomic Layer Deposition Market
FIGURES
- 3.1 Schematic Of Sputtering System
- 3.2 Magnetron Sputtering Design
- 3.3 Showerhead Reactor Design
- 3.4 Ionized PVD
- 4.1 APCVD Reactor
- 4.2 Tube CVD Reactor
- 4.3 HDPCVD Reactor
- 4.4 ALD Versus PVD Copper Barrier
- 5.1 Copper Electroplating System
- 8.1 Worldwide MCVD Market Shares - 2009
- 8.2 Worldwide DCVD Market Shares - 2009
- 8.3 Worldwide DCVD Market By Sectors - 2009
- 8.4 Worldwide HDHCVD Market Shares - 2009
- 8.5 Worldwide PECVD Market Shares - 2009
- 8.6 Worldwide SACVD Market Shares - 2009
- 8.7 Worldwide LPCVD Market Shares - 2009
- 8.8 Worldwide PVD Market Shares - 2009
- 8.9 Worldwide ECD Market Shares - 2009
- 8.10 ALD Applications a Share of Market - 2009
- 8.11 Worldwide ALD Market Shares - 2009
TABLES
- 8.1 Worldwide CVD Market Forecast
- 8.2 Worldwide MCVD Market Shares 1994-2009
- 8.3 Worldwide DCVD Market Shares - 1994-2009
- 8.4 Worldwide HDPCVD Market Shares - 1999-2009
- 8.5 Worldwide PECVD Market Shares - 1999-2009
- 8.6 Worldwide SACVD Market Shares - 1999-2009
- 8.7 Worldwide LPCVD Market Shares - 1997-2009
- 8.8 Worldwide PVD Market Forecast
- 8.9 Worldwide PVD Market Shares 1994-2009
- 8.10 Worldwide ECD Market Forecast
- 8.11 Worldwide ALD Market Forecast
