Flexible Printed Circuit Board Market by Type, End User

Description

List of Tables

[186 Pages Report] The Flexible Printed Circuit Board Market size was estimated at USD 23.04 billion in 2023 and expected to reach USD 26.19 billion in 2024, at a CAGR 14.50% to reach USD 59.47 billion by 2030.

The flexible printed circuit board (FPCB) market comprises developing, producing, and selling flexible circuits mounted on flexible plastic substrates, including polyimide, PEEK (Polyether ether ketone), or conductive polyester film. Technological advancements in continuous innovation in electronic components miniaturization positively influence market space. The demand for consumer electronics and the popularity of portable and smart devices has increased the market demand. The growing electronic content in vehicles and inclination towards autonomous driving has enhanced the market growth. However, high initial manufacturing costs and complex fabrication processes are limiting the market scope. The fluctuating raw material costs also impact profitability, creating market growth challenges. Moreover, the development of eco-friendly and sustainable materials is constantly creating opportunities in the market. Integrating FPCBs into next-generation IoT devices also creates potential opportunities in the market.

KEY MARKET STATISTICS
Base Year [2023]	USD 23.04 billion
Estimated Year [2024]	USD 26.19 billion
Forecast Year [2030]	USD 59.47 billion
CAGR (%)	14.50%

Type: Growing popularity of rigid-flex circuits due to its structural rigidity and increased reliability

Double-sided flexible circuits consist of two conductive layers on a flexible dielectric film. They are ideal for complex circuit designs where single-sided flex circuits lack sufficient routing space. They allow for cross-over circuits, which can be a crucial design feature. Multilayer flexible circuits have three or more conductive layers with insulating layers in between. They are used for highly complex electronic systems that require dense interconnects and high capacity. Multilayer flexible circuits are chosen for complex and dense electronics that cannot be accommodated by double-sided flex circuits. Rigid-flex circuits are hybrid circuits that combine the flexibility of flexible circuits with the rigidity of hardboard substrates. This allows for a rigid support where components are mounted and flexibility where needed. Sculptured flexible circuits are a variant of flexible circuits where the thickness of the conductive copper varies across the circuit, providing structural integrity in specific areas. Leveraged in applications that require robust connections and variable flexibility within the same circuit. Single-sided flexible circuits have a single conductive layer on a flexible base. They are the simplest and most common type, used in applications with limited complexity.

End User: Rising inclination towards electrification and advanced safety features of automotive industry drives adoption of FPCBs

As the automotive industry's inclination towards electrification and advanced safety features, the demand for FPCBs in automotive electronics has increased dramatically. Manufacturers prefer FPCBs for their flexibility, lightweight, and ability to withstand harsh environments. They are commonly used in applications such as dashboards, ABS systems, and airbag systems. Key players in this segment include Nippon Mektron, Sumitomo Electric, and Flexium Interconnect. Consumer electronics and wearables have become increasingly popular, and FPCBs are integral in enabling the compact form factors of smart devices. They are used in smartphones, tablets, and fitness trackers due to their flexibility and high-density assembly capabilities. In defense and aerospace, high reliability and precision are non-negotiable requirements. FPCBs are used due to their durability and high performance standards in rugged environments. They find applications in satellites, communication systems, and avionics. The healthcare industry utilizes FPCBs for their ability to integrate into compact medical devices and equipment, such as pacemakers, imaging systems, and laboratory instruments. The preference for FPCBs in this segment is compelled by the need for reliability and precision. The lighting industry is progressively adopting FPCBs, particularly in LED applications. The flexibility allows for innovative lighting designs, while the thermal properties of FPCBs make them suitable for heat dissipation in high-intensity lighting products. Similar to defense and aerospace, military applications of FPCBs require high reliability under extreme conditions. FPCBs are used in communication devices, smart uniforms, and weaponry systems. The demand is driven by the need for lightweight and highly adaptable components. The telecommunications sector relies on FPCBs for high-speed data transmission and antenna applications. The need for FPCBs in this industry stems from the drive for miniaturization and better signal integrity.

Regional Insights

In the Americas region, the United States and Canada remain at the forefront of FPCB innovation and consumption. The consumer electronics and military sectors in the Americas region drive demand, with purchasers focusing on high-quality and high-performance products. The initiatives in the Americas often focus on research in improving the recyclability and reducing the environmental footprint of electronic components, with government and private sector investments supporting these endeavors. The EMEA market is sophisticated, with a demand for high-tech, environmentally friendly products. EU regulations such as Restriction of Hazardous Substances (RoHS), influence FPCB designs and materials, are pushing innovation in eco-friendly solutions. European industry stakeholders invest in research and development, as well as sustainability initiatives to drive the market growth. The rising consumer electronics industry in the APAC region has fueled product demand in the region. The rising government emphasis on domestic FPCB production is contributing to the market growth in the APAC region.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Flexible Printed Circuit Board Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Flexible Printed Circuit Board Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Flexible Printed Circuit Board Market, highlighting leading vendors and their innovative profiles. These include Abis Circuits Co., Ltd., AirBorn, Inc., Alper S.R.L., Amphenol Corporation, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, BHflex Co., Ltd., ES&S Solutions GmbH, Eurocircuits GmbH, ExPlus Co., Ltd., Fralock Holdings, LLC, Fujikura Ltd., Ichia Technologies Inc., Interplex Holdings Pte. Ltd., Jinghongyi PCB (HK) Co., Limited, Mekoprint A/S, Multek Corporation, Nitto Denko Corporation, NOK Corporation, RayMing, Schweizer Electronic AG, Shenzhen Kinwong Electronic Co., Ltd., Sumitomo Electric Industries Ltd., Tech Etch, Inc., Tianjin Printronics Circuit Corp., TTM Technologies, Inc., Unimicron Technology Corporation by United Microelectronics Corporation, Wurth Elektronik eiSos GmbH & Co. KG, and Zhen Ding Tech. Group Technology Holding Limited.

Market Segmentation & Coverage

This research report categorizes the Flexible Printed Circuit Board Market to forecast the revenues and analyze trends in each of the following sub-markets:

Type
- Double-sided Flexible Circuits
- Multilayer Flexible Circuits
- Rigid-flex Circuits
- Sculptured Flexible Circuits
- Single-sided Flexible Circuits

End User
- Automotive Electronics
- Consumer Electronics & Wearables
- Defense & Aerospace
- Healthcare
- Lighting
- Military
- Telecommunications

Region
- Americas
  - Argentina
  - Brazil
  - Canada
  - Mexico
  - United States
    - California
    - Florida
    - Illinois
    - New York
    - Ohio
    - Pennsylvania
    - Texas
- Asia-Pacific
  - Australia
  - China
  - India
  - Indonesia
  - Japan
  - Malaysia
  - Philippines
  - Singapore
  - South Korea
  - Taiwan
  - Thailand
  - Vietnam

Europe, Middle East & Africa
- Denmark
- Egypt
- Finland
- France
- Germany
- Israel
- Italy
- Netherlands
- Nigeria
- Norway
- Poland
- Qatar
- Russia
- Saudi Arabia
- South Africa
- Spain
- Sweden
- Switzerland
- Turkey
- United Arab Emirates
- United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Flexible Printed Circuit Board Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Flexible Printed Circuit Board Market?

3. What are the technology trends and regulatory frameworks in the Flexible Printed Circuit Board Market?

4. What is the market share of the leading vendors in the Flexible Printed Circuit Board Market?

5. Which modes and strategic moves are suitable for entering the Flexible Printed Circuit Board Market?

Product Code: MRR-4348D129FB67

1. Preface

1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders

2. Research Methodology

2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

5.1. Market Dynamics
- 5.1.1. Drivers
  - 5.1.1.1. Rising Adoption of Consumer Electronics with the Ongoing Shift Towards Miniature Electronic Devices
  - 5.1.1.2. Increasing Popularity of Compact and Flexible Display Technology in Electronic Products
  - 5.1.1.3. Potential Demand Owing to Increased Reliability by Providing Interconnectivity Solutions
- 5.1.2. Restraints
  - 5.1.2.1. Relatively High Cost of flex PCBs Compared to Traditional Rigid PCBs
- 5.1.3. Opportunities
  - 5.1.3.1. Technological Advancements in Printed Circuit Boards
  - 5.1.3.2. Proliferating Application of Flexible Electronic Products from Aerospace, Defense, and Automotive
- 5.1.4. Challenges
  - 5.1.4.1. Inherent Performance Limitations of Flexible Printed Circuit Board
5.2. Market Segmentation Analysis
- 5.2.1. Type: Growing popularity of rigid-flex circuits due to its structural rigidity and increased reliability
- 5.2.2. End User: Rising inclination towards electrification and advanced safety features of automotive industry drives adoption of FPCBs
5.3. Market Trend Analysis
5.4. Cumulative Impact of Russia-Ukraine Conflict
5.5. Cumulative Impact of High Inflation
5.6. Porter's Five Forces Analysis
- 5.6.1. Threat of New Entrants
- 5.6.2. Threat of Substitutes
- 5.6.3. Bargaining Power of Customers
- 5.6.4. Bargaining Power of Suppliers
- 5.6.5. Industry Rivalry
5.7. Value Chain & Critical Path Analysis
5.8. Regulatory Framework Analysis
5.9. Client Customization

6. Flexible Printed Circuit Board Market, by Type

6.1. Introduction
6.2. Double-sided Flexible Circuits
6.3. Multilayer Flexible Circuits
6.4. Rigid-flex Circuits
6.5. Sculptured Flexible Circuits
6.6. Single-sided Flexible Circuits

7. Flexible Printed Circuit Board Market, by End User

7.1. Introduction
7.2. Automotive Electronics
7.3. Consumer Electronics & Wearables
7.4. Defense & Aerospace
7.5. Healthcare
7.6. Lighting
7.7. Military
7.8. Telecommunications

8. Americas Flexible Printed Circuit Board Market

8.1. Introduction
8.2. Argentina
8.3. Brazil
8.4. Canada
8.5. Mexico
8.6. United States

9. Asia-Pacific Flexible Printed Circuit Board Market

9.1. Introduction
9.2. Australia
9.3. China
9.4. India
9.5. Indonesia
9.6. Japan
9.7. Malaysia
9.8. Philippines
9.9. Singapore
9.10. South Korea
9.11. Taiwan
9.12. Thailand
9.13. Vietnam

10. Europe, Middle East & Africa Flexible Printed Circuit Board Market

10.1. Introduction
10.2. Denmark
10.3. Egypt
10.4. Finland
10.5. France
10.6. Germany
10.7. Israel
10.8. Italy
10.9. Netherlands
10.10. Nigeria
10.11. Norway
10.12. Poland
10.13. Qatar
10.14. Russia
10.15. Saudi Arabia
10.16. South Africa
10.17. Spain
10.18. Sweden
10.19. Switzerland
10.20. Turkey
10.21. United Arab Emirates
10.22. United Kingdom

11. Competitive Landscape

11.1. Market Share Analysis, 2023
11.2. FPNV Positioning Matrix, 2023
11.3. Competitive Scenario Analysis
- 11.3.1. Wurth Elektronik launches research project HyPerStripes
- 11.3.2. DuPont Showcases Industry-Leading Innovations in Advanced Circuit Materials and Solutions at TPCA Show 2023 in Taipei
- 11.3.3. New material for 6G flexible printed circuit boards

12. Competitive Portfolio

12.1. Key Company Profiles
12.2. Key Product Portfolio