PUBLISHER: Lucintel | PRODUCT CODE: 1418046
PUBLISHER: Lucintel | PRODUCT CODE: 1418046
Advanced Semiconductor Packaging Trends and Forecast
The future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets. The global advanced semiconductor packaging market is expected to reach an estimated $47.4 billion by 2030 with a CAGR of 7.6% from 2024 to 2030. The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.
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Advanced Semiconductor Packaging by Segment
The study includes a forecast for the global advanced semiconductor packaging by type, application, and region.
List of Advanced Semiconductor Packaging Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies advanced semiconductor packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the advanced semiconductor packaging companies profiled in this report include-
Advanced Semiconductor Packaging Market Insights
Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior electrical performance, high connector density, and small form factor.
APAC will remain the largest segment over the forecast period due to region's increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.
Features of the Global Advanced Semiconductor Packaging Market
Market Size Estimates: Advanced semiconductor packaging market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Advanced semiconductor packaging market size by type, application, and region in terms of value ($B).
Regional Analysis: Advanced semiconductor packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the advanced semiconductor packaging market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the advanced semiconductor packaging market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the advanced semiconductor packaging market size?
Answer: The global advanced semiconductor packaging market is expected to reach an estimated $47.4 billion by 2030.
Q2. What is the growth forecast for advanced semiconductor packaging market?
Answer: The global advanced semiconductor packaging market is expected to grow with a CAGR of 7.6% from 2024 to 2030.
Q3. What are the major drivers influencing the growth of the advanced semiconductor packaging market?
Answer: The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.
Q4. What are the major segments for advanced semiconductor packaging market?
Answer: The future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets.
Q5. Who are the key advanced semiconductor packaging market companies?
Answer: Some of the key advanced semiconductor packaging companies are as follows.
Q6. Which advanced semiconductor packaging market segment will be the largest in future?
Answer: Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior electrical performance, high connector density, and small form factor.
Q7. In advanced semiconductor packaging market, which region is expected to be the largest in next 5 years?
Answer: APAC will remain the largest segment over the forecast period due to region's increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.