PUBLISHER: Information Network | PRODUCT CODE: 999380
PUBLISHER: Information Network | PRODUCT CODE: 999380
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The package includes 11 reports and a excel database.
Semiconductor manufacturers are accelerating their shrinkage roadmap. The demand for semiconductor equipment is largely driven by the additional tools required to migrate chip designs to leading-edge nodes. With capacity-driven capex slowing down, semiconductor equipment demand may be unaffected if chipmakers are moving more aggressively to the leading-edge nodes.
China will further accelerate its semiconductor roadmap and capacity-building progress: China has been actively expanding its semiconductor-production capacity and manufacturing facilities. There has been no significant disruption to China's semiconductor industry during the COVID-19 outbreak. For example, Wuhan-based Yangtze Memory Technologies (YMTC) continued operations throughout the lockdown. China currently spends about $5bn on wafer-fab equipment and it can help to offset any potential capex cut from the large chipmakers if it believes its current progress justifies additional investment.
The semiconductor equipment industry's revenue is highly sensitive to the type of chips that are driving demand. The level of semiconductor capex spent by chipmakers: Semiconductor equipment players' revenues are highly sensitive to the capex of chipmakers, such as foundry/logic players (Intel, Taiwan Semiconductor Manufacturing Company, Samsung LSI) and memory players (Micron, SK Hynix and Samsung).
General demand and types of chips required: New semiconductor equipment is required more in making leading-edge chips and computationally intense applications, such as application processors, server chips and CPUs.
The demand for semiconductor equipment is largely driven by the additional tools required for chipmakers to migrate to leading-edge nodes. This is especially the case because ALD tools are required more in foundry and logic chip manufacturing processes. Foundry and logic players are, compared with memory manufacturers, more committed to their shrinkage roadmaps and are therefore more likely to invest in advanced tools, such as ALD.
This report describes the semiconductor equipment markets for 27 different sectors and profiles 49 leading equipment suppliers in the U.S., Europe, and Asia. Market shares for each company for each sector are presented.
Not only are these ICs the "hottest" part of the highest growing technology sectors, they are, in fact, interrelated.
Advanced driver-assistance systems (ADAS) are ubiquitous in autonomous vehicles. ADAS uses CMOS Integrated Sensors, memory, processing, and networking to detect road conditions and provide feedback to drivers-and in some cases to drive the vehicle off the road if there are unsafe conditions.
Besides powering ADAS and autonomous vehicles, AI is also a key enabler of voice recognition technologies, smart cities, and the Internet of Things (IoT). AI alongside the development of greater universal connectivity will enable new services that can benefit consumers in many ways.
Real-world fleets of autonomous vehicles are now ready for commercial deployment and many auto companies already provide some level of autonomous vehicle technology in their latest models. It is likely that on the show floor and in conference presentations we will see new uses for these AI-driven vehicles. We'll also see how possible problems are being tackled before the technology moves more into the consumer space.
The growth in mobile and personal devices, and their need for energy-efficient electronics, will lead to new ways to store information for immediate processing as well as long-term storage. The report details storage and memory products including those using traditional (NAND and DRAM) memories and emerging memories, such as phase change memory (PCM), magnetic random access memory (MRAM) or resistive random access memory. With the end of Moore's-law computer-lithography scaling, there is also a move to more specialized processing capability, tied to particular applications.
This report examines in detail Artificial Intelligence (AI), 5G, CMOS Image Sensor, and Memory Chips (DRAM, NAND, NVM). Markets for the ICs and their applications are forecast to 2025, and market shares given in each sector.
Applied Materials has achieved a dominant position in the semiconductor equipment market by focusing on a global presence, a broad and expanding product line, and exacting customer support -- a strategy initiated in the mid-80s. In the '90s, most of its competitors had recognized that to be competitive with Applied Materials, they too must duplicate these tactics.
AMAT competes against Lam Research and Tokyo Electron in deposition and etch, and against ASML and KLA in metrology/inspection. Also, as foundry/logic companies move from DUV, with multiple patterning steps, to EUV, deposition-etch steps are minimized, reducing the need for these process tools from AMAT, KLAC, and Tokyo Electron.
Semiconductor equipment players' revenues are highly sensitive to chipmakers' capex. They are exposed to foundry/logic players (Intel, TSMC, Samsung LSI) and the memory names (Micron, SK Hynix and Samsung).
Semiconductor equipment is required more in making leading-edge chips and computationally intense applications such as application processors, server chips and CPUs. The semiconductor equipment industry's revenue will be highly sensitive to a COVID-19 impact on demand for these types of chips.
After nearly 20 years as market leader in the semiconductor equipment front end market, Applied Materials will lose its dominance in 2019 and further to 2020.
This report discusses the current strategies of Applied Materials as it competes for world dominance. Strategies of its competitors are also analyzed. Markets are analyzed and projected, and market shares for Applied Materials and its competitors are detailed.
Chemical mechanical planarization (CMP) is a critical production step during microcircuit manufacturing. The smaller the electronic components the more sophisticated the CMP process. The customer goal is to have flat, smooth, polished wafers.
CMP is an essential technology used for local and global planarization of dielectric interlayers, polishing copper damascene architectures, tungsten vias, low-k dielectric films, and shallow trench isolation. The ever-increasing list of semiconductor devices and scaling demands necessitates a wide range of materials to be polished concurrently or sequentially, which increases the complexity of CMP and presents a continual need to optimize process design and control.
CMP pads and slurry are used in the process of chemically and mechanically planing wafer surfaces, with semiconductor wafers typically having multiple layers deposited one atop another. When layers are put down, they must be polished flat before adding the next layer of circuit elements (since more information can be packed onto a flat chip). This is enabled by the CMP process that utilizes a CMP pad and slurry-pads are made of resin and placed on a rotating platen. CMP slurry refers to a chemical dispensed between pad and wafer in this process.
This report examines and projects the technologies involved in the chemical mechanical planarization of semiconductor layers. This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials is presented.
China has made some progress in developing its domestic fabless industry, though is still dependent on importing the final manufactured product in several cases. It has also reduced its import dependence in some areas by encouraging global producers to set up manufacturing within China to serve both its local demand as well as use China as an export base. Most noticeably in recent years has been the setting up of memory plants by Samsung, Hynix, and Intel in China that has resulted in a strong CAGR of memory exports from China. However, given the continued growth of domestic tech demand as well as Chinese brand's rising share of end tech products in the global market has meant that China's demand for semiconductors has outpaced the growth of its domestic semis production and has increased demand for semi parts that it does not locally produce, resulting in larger net import of semiconductors.
Seventy percent of all tech- related imports by China are of semiconductor products, thus, making it highly dependent on foreign-sourced parts. Several of these imported semiconductors are also meant for powering its technology related exports (handsets, telco equipment, and consumer electronics). China also imports most of its equipment required for semi and display manufacturing and currently has limited capability to manufacture any of these equipment companies locally. Thus, not surprisingly, the focus of Chinese authorities, in the past decade or more, has been to develop a local semiconductor industry.
China's rising investment in the semiconductor industry is growing TAM for local equipment makers. Based on the projects we track, we expect investments in new fabs or capacity expansion will exceed US$160bn in China over the coming 5-7 years; we expect this will drive an increase in China's equipment spending to more $40 billion in 2025, with sixty percent of the investments going to memory fabs. We believe the expansion of product offerings by local equipment companies will result in significant growth opportunities over the coming five years.
While the focus on developing a domestic semiconductor industry has borne some fruit - local semis production has been growing at a 20% CAGR in recent years (including semi production by global players out of their China-based facilities) - China, as discussed in the previous section, remains a large importer of semiconductors, and hence, the need to continue to focus on developing the local industry. Geopolitical developments in recent years, particularly the inclusion of several Chinese entities (notably Huawei, Hikvision amongst others) by the US on its restricted Entity List, further adds urgency to China's initiatives to localize the tech industry and reduce its import dependence.
This 300+-page report analyzes Mainland China's semiconductor and equipment industries, examining the technical, economic, and political issues that are shaping this nascent industry
Chipmakers remain committed to their capex and shrinkage plans for now: Chipmakers are, according to our research, holding on to their existing orders. There are no indications, for now, that they plan to make cancellations. In addition, we believe KLA's tool is required for foundry and logic chips, rather than memory chips, for which demand is more volatile. We therefore do not expect significant order cancellations for KLA's tools.
The demand for semiconductor equipment is largely driven by the additional tools required for chipmakers to migrate to leading-edge nodes. For KLA, this is especially the case because its tool is required in foundry and logic chip manufacturing processes. Foundry and logic players are, compared to memory chip manufacturers, more committed to shrinkage. In addition, its tool is crucial for developing new processes. With capacity-driven capex slowing down, semiconductor equipment demand may prove resilient if chipmakers migrate more aggressively to the leading edge nodes.
China has been actively expanding its semiconductor capacity and manufacturing facilities. Its foundry and logic chip vendors are at least a few generations behind the leaders in the market. However, China remains committed to making progress on its semiconductor roadmap. In our view, KLA's tool will be used more intensively when the chipmakers are at R&D stages compared to the manufacturing phase. China currently spends about $5 billion on wafer fab equipment so it could help to offset a potential capex cut from large chip manufacturers.
This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.
Etching equipment (or etcher) has high technology barriers due to the complexity and strict requirement of uniformity in the etching process, and etch is a key process in making critical dimensions within a chip. This area is primarily dominated by LAM Research, Tokyo Electron, and Applied Materials. These global leaders offer full etch equipment portfolio ranging from silicon etch (trench, gate, TSV), dielectric etch (Via, Contact, Side wall) and metal etch.
The etching process shapes thin films into certain patterns desired by wafer fabs by using chemicals, reaction gases or ion chemical reaction. In non-EUV, multi-patterning increases lithography and etch/cleaning steps. 14nm requires double-patterning, with KrF 193nm immersion DUV lithography tool, and 7nm requires quadruple-patterning. We see a rising number of etch steps as the process node moves to more advanced nodes, which could drive up etch demand. However, the use of EUV lithography tool in 7nm+ and 5nm could reduce the need for multi-patterning and thus reduce etching steps.
Advanced pulsing technology provides the extremely high materials selectivity, depth control and profile control needed by customers to create densely packed, high-aspect-ratio structures in 3D NAND, DRAM and logic, including FinFETs and emerging gate-all-around architectures.
This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry. Markets for dry etching and stripping are analyzed and projected, and market share presented by each sector.
Lithography tools are essential if chipmakers are to follow their shrinkage roadmap. Intel, Samsung and TSMC have all set out shrinkage roadmaps for 5nm nodes and below, aiming to deliver chips with superior performance at a lower cost.
ASML is the dominant leader in the semiconductor lithography sector, with Nikon and Canon its chief competitors, and the only manufacturer of EUV lithography.
Chipmakers remain committed to their leading-edge roadmap: ASML's main business drivers are chipmakers' leading-edge roadmaps, which detail the timeline for the development of smaller and more complex semiconductors. We believe chipmakers will increasingly use ASML's extreme ultraviolet lithography (EUV) tool in their manufacturing processes. Our research has found that the main buyers of EUV this year and next year will be TSMC, Samsung and, potentially, Intel: all three are still committed to their roadmaps.
Foundry / logic some customers are leveraging EUV to reduce the number of steps for specific layer; however other layers continue to add additional steps. For DRAM, our conversation highlighted that more complex patterning schemes (vs. foundry / logic) should result in EUV adoption targeted at very specific layers that can provide cost reductions. We note that this will be more vendor dependent and based on design schemes.
CVD (Chemical Vapor Deposition) is used to deposit materials in various forms, including monocrystalline, polycrystalline, amorphous, and epitaxial. By subtypes, there are mainly LPCVD (low pressure), PECVD (plasma enhanced), and ALD. PVD deposition techniques include sputtering and eBeam and thermal evaporation.
The CVD process involves mixing the source material with one or more volatile precursors using a plasma to chemically interact and breakdown the source material. The processes use heat with higher pressures leading to a more reproducible film where the film thicknesses could be managed by time/power. These films are more stoichiometric, they are denser and are capable of growing higher quality insulator films. The PVD processing uses a solid precursor metal that is gasified through some electrical energy. The gasified atoms are then transferred to the substrate. These processes manages thicknesses using a quartz crystal rate monitor to control rate and thickness of the film.
ALD films are very conformal approaching 2000:1 aspect ratios, thus providing excellent step coverage over features. The process is repeatable and can grow thinner layers under 10nm thickness predictably. Films include Alumina oxide (AL2O3), Hafnium oxide (HfO2) and Titanium oxide (TiO2). Its use in the semiconductor industry has advanced ALD rapidly in recent years to develop thin, high-K gate dielectric layers.
The PECVD process offers good step coverage over features. Films include Silicon Dioxide (SiO2), Silicon Nitride (Si3N4) and lower stress Oxynitride (SiON) films. The PECVD films offer more flexibility than ALD with higher deposition rates leading to higher throughputs.
This report discusses the technology trends, products, applications, and suppliers of deposition materials and equipment. It also gives insights to suppliers for future user needs and should assist them in long range planning, new product development and product improvement. Market shares and a market forecast for each sector of thin film deposition tools is presented.
A power semiconductor device is used as a switch (controlling power on or off) or rectifier (converting AC to DC) in power electronics, for example, in frequency conversion home appliance, EVs, EV chargers, welding inverter, industrial robots, etc. As of 2019, Power semiconductors was a US$41bn global market, or c.10% of global semiconductor market size.
Power semiconductors could be divided into two parts: (1) Power discrete and (2) Power IC, with each parts roughly contributing 50% of the power semiconductors market size by revenue. When a power semiconductor device is in the form of integrated circuit, it is called Power IC, otherwise referred to as a power discrete.
Power semiconductors is a US$41bn market globally, and within this market, we are positive on IGBTs and MOSFETs, given the growing market driven by (1) rising energy efficiency requirement in multiple applications such as EV, industrial control, and home appliances, and (2) the rising demand for Chinese suppliers driven by a large domestic market and multiple Chinese brands in home appliances, automobiles and industrial look to diversify their supply chains amid growing trade tensions.
The global IGBT leaders usually cover a full range of applications from consumer electronics, automotive, and industrial controls, to power generation, infrastructure, and railway. Each of these sectors is analyzed in the report.
The global MOSFET leaders usually cover the full range of applications from consumer electronics, automotive, computing, motor driver, power supply, telecom network, EV charging, LED lighting, to medical. Each of these sectors is analyzed in the report.
The rapid growth of the power semiconductor market in recent years has been driven by the proliferation of computer and consumer electronics, such as desktop computers, notebooks, netbooks, smartphones, flat panel displays and portable media players that require sophisticated power management to improve power efficiency and extend battery life.
This report analyzes and forecasts the worldwide markets of power semiconductors by type, geographic region and application. The market by substrate type also focuses on new SiC and GaN materials and fabrication.
Advanced wafer-level packaging technologies hold the key to meeting future technology needs, from mobile devices to automotive applications, to those required for enabling the IoT. Flip chip technology is slowly replacing wire bonding for many high-performance chips. Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the method of electrically connecting the die to the package carrier whereby the interconnection between the die and carrier is made through a conductive "bump" or copper pillar that is placed directly on the die surface. The bumped die is then "flipped over" and placed face down, with the bumps connecting to the carrier directly.
This technology can be applied on application processor, baseband, PMIC, memory devices, etc. products. For mobile communications, flip chip development is driven by increased device performance and package miniaturization trends, particularly for the CPU or so called applications processor that powers smart phones and media tablets.
To meet the needs of thinner mobile devices, Wafer Level Packages (WLPs) have been developed. They differ from flip-chip packages primarily in that the die is mounted directly on the PCB. The reduced form factor provided by mounting the die directly on the PCB has vaulted WLP to the leading position for smartphones and other products where space is at a premium.
This report analyzes the technology for flip chip technology and WLPs, presenting forecasts for packages by type and application.