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PUBLISHER: TrendForce | PRODUCT CODE: 2062492

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PUBLISHER: TrendForce | PRODUCT CODE: 2062492

SiPh/CPO & AI Interconnect Insights

PUBLISHED: 10 issues / year
PAGES:
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Annual Subscription: PDF (Corporate License - 5 Users)
USD 8000

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KeyFocusTopics

Topic

  • How Google leverages Ironwood, 3D Torus, and OCS to establish a rack-centric high-speed interconnect architecture.
  • InPLserCapacity Constraints: NVIDIA's supply chain lock-in triggers shifts in the optical communications landscape.
  • AI Interconnect Outlook:NVIDIA Leads the Transition to CPO and Silicon Photonics Architectures
  • Optical Interconnect Supply Chain Restructuring and Opportunities in Response to Expanded US Export Controls

SiPh/CPO & AI Interconnect Insights delivers monthly intelligence on rapidly evolving AI data center interconnect technologies. The report provides timely analysis of technology trends, deployment strategies, and supply chain developments across SiPh/CPO, optical communications, and networking fabrics, helping readers stay ahead of technology and supply chain shifts.

Release a minimum of ten in-depth research reports each year covering major market themes, industry developments, and emerging technology trends.

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Jeroen Van Heghe

Manager - EMEA

+32-2-535-7543

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Christine Sirois

Manager - Americas

+1-860-674-8796

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