AI Infra Bulletin

Biweekly AI Infra Bulletin provides timely analysis of technology trends, deployment strategies, and supply chain developments across power, thermal, and connectivity domains, helping readers stay ahead of AI infrastructure.

Please see the information below for more detailed content regarding the report.

1. Power Infrastructure

• PSUs, BBUs, HDVC power racks
• Data center power architectures and capacity expansion
• Supplier landscape and technology roadmaps

2. Thermal & Cooling

• Cold plates, manifolds, CDUs
• Liquid cooling adoption trends
• Competitive dynamics and system designs

3. Connectivity & AI Networking

• AI cluster network architectures at major CSPs (Scale-up / scale-out topologies by accelerator type)
• Optical components, transceivers, and switch market dynamics
• Outlook on 800G / 1.6T optics, CPO and LPO