Military Embedded System Market By Product Type (Motherboard & Computer-On-Module, OPEN VPX, VME BUS, Compact-PCI, Others), By Component, By Platform, By Application : Global Opportunity Analysis and Industry Forecast, 2021-2031

List of Tables

The global military embedded system market is envisioned to garner $3,259.3 million by 2031, growing from $1,540 million in 2021 at a CAGR of 7.9% from 2022 to 2031.

Military embedded systems play an important role in gathering and analyzing vital information to help military officials make the best decisions possible. Military intelligence agencies can employ embedded systems to spy on their potential enemies' radio, television, and other broadcasting systems in the majority of countries. Radar systems, military traffic systems, and surveillance satellites all employ embedded military technology. In addition, military embedded enhance system reliability, enable remote control operation, and safeguard systems from unauthorized access.

The use of cloud computing and artificial intelligence has broadened and redefined the capabilities of military-embedded systems. Nations are deploying AI-powered weapons, and embedded systems are enabling new forms of combat. However, the price of military embedded systems, complexity in the design and development of embedded systems, and data security are some factors that are anticipated to hamper the military embedded market share during the forecast period.

Embedded vision systems are the latest technology used for military embedded systems. For soldiers, embedded vision systems produce unprecedented visibility and autonomy. The most important embedded vision application is multispectral imaging in surveillance systems used by drones and aircraft. Embedded vision cameras and sensors provide a synthetic vision that provides pilots with relevant information when natural visibility is limited Military vehicles that are autonomous and equipped for combat use embedded vision systems to navigate challenging terrain. Soldiers can use head-up displays with embedded vision systems to access navigation information and the enemy's location in real-time.

The COVID-19 pandemic brought several uncertainties leading to severe economic losses as various businesses across the world were at a standstill. The pandemic had a negative influence on commercial aerospace and general industrial end-market developments. Various government restrictions on personnel movement, lockdowns, and shutdown of non-essential businesses affected chip manufacturing companies during the pandemic, affecting military embedded system production. In addition, import-export restrictions, transportation issues, and labor shortage affected the market. R&D in the embedded system processor manufacturing business has been negatively impacted, due to the travel restrictions implemented by various governments around the world to combat the COVID-19 pandemic. Governments and consumers focused on supplying necessities like food and safety equipment, which impacted the demand for custom or standard hardware systems for embedded systems makers during the COVID-19 pandemic.

The key players profiled in this report include Intel Corporation, Mercury Systems, Inc. Curtiss-Wright Corporation, Advantech Co., Ltd., BAE Systems, SMART Embedded Computing, SDK Embedded Systems Ltd., General Dynamics Corporation, Kontron (S&T), and Xilinx Inc.

Key Benefits For Stakeholders

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the military embedded system market analysis from 2021 to 2031 to identify the prevailing military embedded system market opportunities.
Market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
An in-depth analysis of the military embedded system market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes the analysis of the regional as well as global military embedded system market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Product Type

VME BUS
Compact-PCI (Board Serial)
Others
Motherboard Computer-On-Module (COM)
OPEN VPX

By Component

Hardware
Software

By Platform

Airborne
Land
Naval
Space

By Application

Radar
Command Control
Avionics
Electronic Warfare
Communication Navigation
Weapon Fire Control System
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Spain
- Italy
- Rest Of Europe
Asia-Pacific
- China
- India
- Japan
- South Korea
- Australia
- Rest Of Asia-Pacific
LAMEA
- Brazil
- UAE
- Saudi Arabia
- South Africa
- Rest Of LAMEA
Key Market Players
- Xilinx Inc.
- General Micro Systems
- BAE Systems
- Intel Corporation
- Kontron AG
- Curtiss-Wright Corporation
- Radisys Corporation
- Telephonics Corporation
- Microsemi Corporation
- Abaco Systems

Product Code: A09055

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key market segments
1.3.Key benefits to the stakeholders
1.4.Research Methodology
- 1.4.1.Secondary research
- 1.4.2.Primary research
- 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings of the study
2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key findings
- 3.2.1.Top investment pockets
3.3.Porter's five forces analysis
3.4.Top player positioning
3.5.Market dynamics
- 3.5.1.Drivers
- 3.5.2.Restraints
- 3.5.3.Opportunities
3.6.COVID-19 Impact Analysis on the market
3.7.Value Chain Analysis
3.8.Market Share Analysis
3.9.Key Regulation Analysis
3.10.Patent Landscape
3.11.Regulatory Guidelines

CHAPTER 4: MILITARY EMBEDDED SYSTEM MARKET, BY PRODUCT TYPE

4.1 Overview
- 4.1.1 Market size and forecast
4.2 Motherboard & Computer-On-Module (COM)
- 4.2.1 Key market trends, growth factors and opportunities
- 4.2.2 Market size and forecast, by region
- 4.2.3 Market analysis by country
4.3 OPEN VPX
- 4.3.1 Key market trends, growth factors and opportunities
- 4.3.2 Market size and forecast, by region
- 4.3.3 Market analysis by country
4.4 VME BUS
- 4.4.1 Key market trends, growth factors and opportunities
- 4.4.2 Market size and forecast, by region
- 4.4.3 Market analysis by country
4.5 Compact-PCI (Board & Serial)
- 4.5.1 Key market trends, growth factors and opportunities
- 4.5.2 Market size and forecast, by region
- 4.5.3 Market analysis by country
4.6 Others
- 4.6.1 Key market trends, growth factors and opportunities
- 4.6.2 Market size and forecast, by region
- 4.6.3 Market analysis by country

CHAPTER 5: MILITARY EMBEDDED SYSTEM MARKET, BY COMPONENT

5.1 Overview
- 5.1.1 Market size and forecast
5.2 Hardware
- 5.2.1 Key market trends, growth factors and opportunities
- 5.2.2 Market size and forecast, by region
- 5.2.3 Market analysis by country
5.3 Software
- 5.3.1 Key market trends, growth factors and opportunities
- 5.3.2 Market size and forecast, by region
- 5.3.3 Market analysis by country

CHAPTER 6: MILITARY EMBEDDED SYSTEM MARKET, BY PLATFORM

6.1 Overview
- 6.1.1 Market size and forecast
6.2 Airborne
- 6.2.1 Key market trends, growth factors and opportunities
- 6.2.2 Market size and forecast, by region
- 6.2.3 Market analysis by country
6.3 Land
- 6.3.1 Key market trends, growth factors and opportunities
- 6.3.2 Market size and forecast, by region
- 6.3.3 Market analysis by country
6.4 Naval
- 6.4.1 Key market trends, growth factors and opportunities
- 6.4.2 Market size and forecast, by region
- 6.4.3 Market analysis by country
6.5 Space
- 6.5.1 Key market trends, growth factors and opportunities
- 6.5.2 Market size and forecast, by region
- 6.5.3 Market analysis by country

CHAPTER 7: MILITARY EMBEDDED SYSTEM MARKET, BY APPLICATION

7.1 Overview
- 7.1.1 Market size and forecast
7.2 Radar
- 7.2.1 Key market trends, growth factors and opportunities
- 7.2.2 Market size and forecast, by region
- 7.2.3 Market analysis by country
7.3 Command & Control
- 7.3.1 Key market trends, growth factors and opportunities
- 7.3.2 Market size and forecast, by region
- 7.3.3 Market analysis by country
7.4 Avionics
- 7.4.1 Key market trends, growth factors and opportunities
- 7.4.2 Market size and forecast, by region
- 7.4.3 Market analysis by country
7.5 Electronic Warfare
- 7.5.1 Key market trends, growth factors and opportunities
- 7.5.2 Market size and forecast, by region
- 7.5.3 Market analysis by country
7.6 Communication & Navigation
- 7.6.1 Key market trends, growth factors and opportunities
- 7.6.2 Market size and forecast, by region
- 7.6.3 Market analysis by country
7.7 Weapon Fire Control System
- 7.7.1 Key market trends, growth factors and opportunities
- 7.7.2 Market size and forecast, by region
- 7.7.3 Market analysis by country
7.8 Others
- 7.8.1 Key market trends, growth factors and opportunities
- 7.8.2 Market size and forecast, by region
- 7.8.3 Market analysis by country

CHAPTER 8: MILITARY EMBEDDED SYSTEM MARKET, BY REGION

8.1 Overview
- 8.1.1 Market size and forecast
8.2 North America
- 8.2.1 Key trends and opportunities
- 8.2.2 North America Market size and forecast, by Product Type
- 8.2.3 North America Market size and forecast, by Component
- 8.2.4 North America Market size and forecast, by Platform
- 8.2.5 North America Market size and forecast, by Application
- 8.2.6 North America Market size and forecast, by country
  - 8.2.6.1 U.S.
  - 8.2.6.1.1 Market size and forecast, by Product Type
  - 8.2.6.1.2 Market size and forecast, by Component
  - 8.2.6.1.3 Market size and forecast, by Platform
  - 8.2.6.1.4 Market size and forecast, by Application
  - 8.2.6.2 Canada
  - 8.2.6.2.1 Market size and forecast, by Product Type
  - 8.2.6.2.2 Market size and forecast, by Component
  - 8.2.6.2.3 Market size and forecast, by Platform
  - 8.2.6.2.4 Market size and forecast, by Application
  - 8.2.6.3 Mexico
  - 8.2.6.3.1 Market size and forecast, by Product Type
  - 8.2.6.3.2 Market size and forecast, by Component
  - 8.2.6.3.3 Market size and forecast, by Platform
  - 8.2.6.3.4 Market size and forecast, by Application
8.3 Europe
- 8.3.1 Key trends and opportunities
- 8.3.2 Europe Market size and forecast, by Product Type
- 8.3.3 Europe Market size and forecast, by Component
- 8.3.4 Europe Market size and forecast, by Platform
- 8.3.5 Europe Market size and forecast, by Application
- 8.3.6 Europe Market size and forecast, by country
  - 8.3.6.1 UK
  - 8.3.6.1.1 Market size and forecast, by Product Type
  - 8.3.6.1.2 Market size and forecast, by Component
  - 8.3.6.1.3 Market size and forecast, by Platform
  - 8.3.6.1.4 Market size and forecast, by Application
  - 8.3.6.2 Germany
  - 8.3.6.2.1 Market size and forecast, by Product Type
  - 8.3.6.2.2 Market size and forecast, by Component
  - 8.3.6.2.3 Market size and forecast, by Platform
  - 8.3.6.2.4 Market size and forecast, by Application
  - 8.3.6.3 France
  - 8.3.6.3.1 Market size and forecast, by Product Type
  - 8.3.6.3.2 Market size and forecast, by Component
  - 8.3.6.3.3 Market size and forecast, by Platform
  - 8.3.6.3.4 Market size and forecast, by Application
  - 8.3.6.4 Spain
  - 8.3.6.4.1 Market size and forecast, by Product Type
  - 8.3.6.4.2 Market size and forecast, by Component
  - 8.3.6.4.3 Market size and forecast, by Platform
  - 8.3.6.4.4 Market size and forecast, by Application
  - 8.3.6.5 Italy
  - 8.3.6.5.1 Market size and forecast, by Product Type
  - 8.3.6.5.2 Market size and forecast, by Component
  - 8.3.6.5.3 Market size and forecast, by Platform
  - 8.3.6.5.4 Market size and forecast, by Application
  - 8.3.6.6 Rest of Europe
  - 8.3.6.6.1 Market size and forecast, by Product Type
  - 8.3.6.6.2 Market size and forecast, by Component
  - 8.3.6.6.3 Market size and forecast, by Platform
  - 8.3.6.6.4 Market size and forecast, by Application
8.4 Asia-Pacific
- 8.4.1 Key trends and opportunities
- 8.4.2 Asia-Pacific Market size and forecast, by Product Type
- 8.4.3 Asia-Pacific Market size and forecast, by Component
- 8.4.4 Asia-Pacific Market size and forecast, by Platform
- 8.4.5 Asia-Pacific Market size and forecast, by Application
- 8.4.6 Asia-Pacific Market size and forecast, by country
  - 8.4.6.1 China
  - 8.4.6.1.1 Market size and forecast, by Product Type
  - 8.4.6.1.2 Market size and forecast, by Component
  - 8.4.6.1.3 Market size and forecast, by Platform
  - 8.4.6.1.4 Market size and forecast, by Application
  - 8.4.6.2 India
  - 8.4.6.2.1 Market size and forecast, by Product Type
  - 8.4.6.2.2 Market size and forecast, by Component
  - 8.4.6.2.3 Market size and forecast, by Platform
  - 8.4.6.2.4 Market size and forecast, by Application
  - 8.4.6.3 Japan
  - 8.4.6.3.1 Market size and forecast, by Product Type
  - 8.4.6.3.2 Market size and forecast, by Component
  - 8.4.6.3.3 Market size and forecast, by Platform
  - 8.4.6.3.4 Market size and forecast, by Application
  - 8.4.6.4 South Korea
  - 8.4.6.4.1 Market size and forecast, by Product Type
  - 8.4.6.4.2 Market size and forecast, by Component
  - 8.4.6.4.3 Market size and forecast, by Platform
  - 8.4.6.4.4 Market size and forecast, by Application
  - 8.4.6.5 Australia
  - 8.4.6.5.1 Market size and forecast, by Product Type
  - 8.4.6.5.2 Market size and forecast, by Component
  - 8.4.6.5.3 Market size and forecast, by Platform
  - 8.4.6.5.4 Market size and forecast, by Application
  - 8.4.6.6 Rest of Asia-Pacific
  - 8.4.6.6.1 Market size and forecast, by Product Type
  - 8.4.6.6.2 Market size and forecast, by Component
  - 8.4.6.6.3 Market size and forecast, by Platform
  - 8.4.6.6.4 Market size and forecast, by Application
8.5 LAMEA
- 8.5.1 Key trends and opportunities
- 8.5.2 LAMEA Market size and forecast, by Product Type
- 8.5.3 LAMEA Market size and forecast, by Component
- 8.5.4 LAMEA Market size and forecast, by Platform
- 8.5.5 LAMEA Market size and forecast, by Application
- 8.5.6 LAMEA Market size and forecast, by country
  - 8.5.6.1 Brazil
  - 8.5.6.1.1 Market size and forecast, by Product Type
  - 8.5.6.1.2 Market size and forecast, by Component
  - 8.5.6.1.3 Market size and forecast, by Platform
  - 8.5.6.1.4 Market size and forecast, by Application
  - 8.5.6.2 UAE
  - 8.5.6.2.1 Market size and forecast, by Product Type
  - 8.5.6.2.2 Market size and forecast, by Component
  - 8.5.6.2.3 Market size and forecast, by Platform
  - 8.5.6.2.4 Market size and forecast, by Application
  - 8.5.6.3 Saudi Arabia
  - 8.5.6.3.1 Market size and forecast, by Product Type
  - 8.5.6.3.2 Market size and forecast, by Component
  - 8.5.6.3.3 Market size and forecast, by Platform
  - 8.5.6.3.4 Market size and forecast, by Application
  - 8.5.6.4 South Africa
  - 8.5.6.4.1 Market size and forecast, by Product Type
  - 8.5.6.4.2 Market size and forecast, by Component
  - 8.5.6.4.3 Market size and forecast, by Platform
  - 8.5.6.4.4 Market size and forecast, by Application
  - 8.5.6.5 Rest of LAMEA
  - 8.5.6.5.1 Market size and forecast, by Product Type
  - 8.5.6.5.2 Market size and forecast, by Component
  - 8.5.6.5.3 Market size and forecast, by Platform
  - 8.5.6.5.4 Market size and forecast, by Application

CHAPTER 9: COMPANY LANDSCAPE

9.1. Introduction
9.2. Top winning strategies
9.3. Product Mapping of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
9.6. Key developments

CHAPTER 10: COMPANY PROFILES

10.1 Xilinx Inc.
- 10.1.1 Company overview
- 10.1.2 Company snapshot
- 10.1.3 Operating business segments
- 10.1.4 Product portfolio
- 10.1.5 Business performance
- 10.1.6 Key strategic moves and developments
10.2 General Micro Systems
- 10.2.1 Company overview
- 10.2.2 Company snapshot
- 10.2.3 Operating business segments
- 10.2.4 Product portfolio
- 10.2.5 Business performance
- 10.2.6 Key strategic moves and developments
10.3 BAE Systems
- 10.3.1 Company overview
- 10.3.2 Company snapshot
- 10.3.3 Operating business segments
- 10.3.4 Product portfolio
- 10.3.5 Business performance
- 10.3.6 Key strategic moves and developments
10.4 Intel Corporation
- 10.4.1 Company overview
- 10.4.2 Company snapshot
- 10.4.3 Operating business segments
- 10.4.4 Product portfolio
- 10.4.5 Business performance
- 10.4.6 Key strategic moves and developments
10.5 Kontron AG
- 10.5.1 Company overview
- 10.5.2 Company snapshot
- 10.5.3 Operating business segments
- 10.5.4 Product portfolio
- 10.5.5 Business performance
- 10.5.6 Key strategic moves and developments
10.6 Curtiss-Wright Corporation
- 10.6.1 Company overview
- 10.6.2 Company snapshot
- 10.6.3 Operating business segments
- 10.6.4 Product portfolio
- 10.6.5 Business performance
- 10.6.6 Key strategic moves and developments
10.7 Radisys Corporation
- 10.7.1 Company overview
- 10.7.2 Company snapshot
- 10.7.3 Operating business segments
- 10.7.4 Product portfolio
- 10.7.5 Business performance
- 10.7.6 Key strategic moves and developments
10.8 Telephonics Corporation
- 10.8.1 Company overview
- 10.8.2 Company snapshot
- 10.8.3 Operating business segments
- 10.8.4 Product portfolio
- 10.8.5 Business performance
- 10.8.6 Key strategic moves and developments
10.9 Microsemi Corporation
- 10.9.1 Company overview
- 10.9.2 Company snapshot
- 10.9.3 Operating business segments
- 10.9.4 Product portfolio
- 10.9.5 Business performance
- 10.9.6 Key strategic moves and developments
10.10 Abaco Systems
- 10.10.1 Company overview
- 10.10.2 Company snapshot
- 10.10.3 Operating business segments
- 10.10.4 Product portfolio
- 10.10.5 Business performance
- 10.10.6 Key strategic moves and developments