PUBLISHER: Allied Market Research | PRODUCT CODE: 1193107
PUBLISHER: Allied Market Research | PRODUCT CODE: 1193107
The global wafer processing equipment market was valued at $8,521.0 million in 2021, and is projected to reach $14,416.1 million by 2031, registering a CAGR of 5.3% from 2022 to 2031. The wafer processing includes activities such as formation, texturing, cleaning, dicing and etching. The texturing of wafers is done as per the application of the wafer. The equipment used for performing such a task is known as wafer processing equipment.
The demand for wafer processing equipment is due to multiple utilization of wafers for various electronic units, which is growing with greater pace. In addition, the lower cost of raw materials for manufacturing wafer is leading to lower price of such components which boosts the adoption of wafer processing equipment.
However, because of the warfare between the U.S and China, caused serious impact over the manufacturing of electronic products in North America. On the other side, the evolution of light weighted electronic components for designing lean electronic gadgets is expected to provide a new beginning in the market.
The wafer processing equipment market is segmented on the basis of process, application, end user, and region. By process, the wafer processing equipment market is fragmented into deposition, etch, mass metrology and strip & clean. By application, the market is categorized into dicing, grinding & probing, polishing, edge shaping and cleaning. By end user, the market is divided into computer, communication, consumer, industrial and others. By region, the wafer processing equipment market is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, the UK, France, Italy, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
The major players profiled in the wafer processing equipment market report include Applied Materials, Inc, DISCO , Hitachi Kokusai Linear, KLA Corporation, Lam Research Corporation, Motorola Solutions, Inc. , Nikon Corporation, Plasma-Therm, SPTS technologies Ltd and Tokyo Electron Limited.
Key benefits for stakeholders
The study provides an in-depth analysis of the global wafer processing equipment market along with the current trends and future estimations to elucidate the imminent investment pockets.
A comprehensive analysis of the factors that drive and restrict the market growth is provided in the report.
Comprehensive quantitative analysis of the industry from 2021 to 2031 is provided to enable the stakeholders to capitalize on the prevailing market opportunities.
Key market players and their strategies have been analyzed to understand the competitive outlook of the market.
By Process
By Application
By End User
By Region