PUBLISHER: Allied Market Research | PRODUCT CODE: 1239438
PUBLISHER: Allied Market Research | PRODUCT CODE: 1239438
The embedded die packaging technology market was valued at $69.18 million in 2021 and is estimated to reach $370.69 million by 2031, exhibiting a CAGR of 18.3% from 2022 to 2031. Embedded die packaging is an enhanced technology designed to be used directly onto a printed circuit board (PCB) laminated substrate and facilitates size reduction, power saving, & improves the overall efficiency of the system on a large scale.
The scope of the report discusses the potential opportunities for the key players to enter the embedded die packaging technology market. Furthermore, it provides an in-depth analysis of the market, outlining current trends, key driving factors, and key areas of investment. The report includes Porter's five forces analysis to understand the competitive scenario of the industry and role of each stakeholder in the value chain. Moreover, it features the strategies adopted by key market players to maintain their foothold in the market.
The embedded die packaging technology market is segmented on the basis of platform, industry vertical, and region. By platform, the market is divided into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board. On the basis of industry vertical, the market is segmented into consumer electronics, IT and telecommunication, automotive, healthcare, and others. By region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The growth of global embedded die packaging technology is majorly driven by the surge in demand for consumer electronics and 5G network technology coupled with the impending need for circuit miniaturization in microelectronic devices. Moreover, the advantages over other packaging technologies are expected to drive market growth. However, high initial cost acts as prime restraint of the global embedded die packaging technology market. On the contrary, the rise in trends related to Internet of Things (IoT) solution is anticipated to provide lucrative opportunities for the embedded die packaging technology industry during the forecast period.
The key players operating in the embedded die packaging technology market are: Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer. These key players adopt several strategies such as new product launch, acquisition, partnership, collaboration and joint venture to increase their market share in the global embedded die packaging technology market during the forecast period.