Embedded Subscriber Identity Module Market By Application, By Industry Vertical : Global Opportunity Analysis and Industry Forecast, 2023-2032

Description

List of Tables

According to a new report published by Allied Market Research, titled, "Embedded Subscriber Identity Module (e-SIM) Market," The embedded subscriber identity module (e-sim) market was valued at $3.4 billion in 2022, and is estimated to reach $12.7 billion by 2032, growing at a CAGR of 14.3% from 2023 to 2032.

Embedded Subscriber Identity Module Market - IMG1

Remote device management is a key driver fueling the growth of the embedded subscriber identity module (E-SIM) market. The ability to remotely provision, manage, and update E-SIMs over-the-air offers significant advantages for enterprises. Organizations may streamline the deployment and configuration of devices without the need for physical intervention with remote device management. They may remotely activate and provision E-SIMs, eliminating the logistical challenges of distributing and inserting physical SIM cards. Furthermore, remote management enables efficient updates and maintenance of E-SIMs, including the ability to remotely switch network profiles or update connectivity settings. This reduces operational costs by minimizing manual interventions, improving device uptime, and enabling centralized control over a fleet of devices. Remote device management provided by E-SIM technology enhances the efficiency, scalability, and cost-effectiveness of device deployment and maintenance, making it an attractive solution for enterprises across various industries.

However, regulatory challenges are a big problem for the E-SIM market. Each country has its own rules about security, data privacy, and telecommunications. This makes things confusing and difficult for E-SIM to work smoothly everywhere. Different regulations create a fragmented situation, making it hard for E-SIM to be used easily and for different devices to work together. Companies that make devices, provide services, and run mobile networks have to deal with lots of different rules and meet different requirements. This makes things more expensive, slows down progress, and causes uncertainty. If the regulations were the same everywhere, it may make things easier and encourage more people to use E-SIM technology.

E-SIM technology presents significant market opportunities for wearable devices, including smartwatches and fitness trackers. E-SIM allows for smaller and more compact designs of wearable devices by removing the requirement for physical SIM cards. This is particularly advantageous in the case of wearable devices where space is limited. In addition, E-SIM provides users with greater flexibility as they may connect their wearable devices directly to cellular networks, independent of the connectivity of a smartphone. This means that users may enjoy features such as calls, messages, and data services directly on their wearable devices, enhancing convenience and usability. Wearable devices become more self-sufficient, offering a seamless and standalone connectivity experience for users with E-SIM. This market opportunity enables the development of innovative and user-friendly wearable devices that enhance the overall user experience.

embedded subscriber identity module. The embedded subscriber identity module market is segmented on the basis of application, industry vertical, and region. On the basis of application, the market is divided into connected cars, smartphones & tablets, wearable devices, and others. On the basis of industry vertical, the market is segregated into automotive, consumer electronics, manufacturing, telecommunication, transportation & logistics, and others. On the basis of region, the market is analyzed across North America (the U.S., Canada, and Mexico), Europe (the UK, Germany, France, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and Rest of Asia-Pacific) and LAMEA (Latin America, Middle East, and Africa).

The key players profiled in the embedded subscriber identity module (E-SIM) industry include: STMicroelectronics, Infineon Technologies AG, Thales, Sierra Wireless, Deutsche Telekom AG, Giesecke+Devrient Mobile Security GmbH, Telenor group, Vodafone Group Plc, NTT DOCOMO, Inc., and NXP semiconductors.

Key Benefits For Stakeholders

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the embedded subscriber identity module (e-sim) market analysis from 2022 to 2032 to identify the prevailing embedded subscriber identity module (e-sim) market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
In-depth analysis of the embedded subscriber identity module (e-sim) market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes the analysis of the regional as well as global embedded subscriber identity module (e-sim) market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Application

Connected Car
Smartphone and Tablet
Wearable Device
Others

By Industry Vertical

Automotive
Consumer Electronics
Manufacturing
Telecommunication
Transportation and Logistics
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Italy
- Rest of Europe
Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
LAMEA
- Latin America
- Middle East
- Africa

Key Market Players:

Deutsche Telekom AG
Giesecke+Devrient Mobile Security GmbH
Infineon Technologies AG
NTT DOCOMO, Inc.
NXP semiconductors
Sierra Wireless
STMicroelectronics
Telenor group
Thales
Vodafone Group Plc

Product Code: A04715

CHAPTER 1: INTRODUCTION

1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research Methodology
- 1.4.1. Primary research
- 1.4.2. Secondary research
- 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

3.1. Market definition and scope
3.2. Key findings
- 3.2.1. Top impacting factors
- 3.2.2. Top investment pockets
3.3. Porter's five forces analysis
- 3.3.1. Moderate-to-high bargaining power of suppliers
- 3.3.2. Moderate-to-high threat of new entrants
- 3.3.3. Moderate threat of substitutes
- 3.3.4. High-to-moderate intensity of rivalry
- 3.3.5. High-to-moderate bargaining power of buyers
3.4. Market dynamics
- 3.4.1. Drivers
  - 3.4.1.1. Increase in adoption of IoT technology
  - 3.4.1.2. Increase in adoption of connected devices

3.4.2. Restraints
- 3.4.2.1. Device compatibility

3.4.3. Opportunities
- 3.4.3.1. Enterprise solutions

3.5. COVID-19 Impact Analysis on the market

CHAPTER 4: EMBEDDED SUBSCRIBER IDENTITY MODULE (E-SIM) MARKET, BY APPLICATION

4.1. Overview
- 4.1.1. Market size and forecast
4.2. Connected Car
- 4.2.1. Key market trends, growth factors and opportunities
- 4.2.2. Market size and forecast, by region
- 4.2.3. Market share analysis by country
4.3. Smartphone and Tablet
- 4.3.1. Key market trends, growth factors and opportunities
- 4.3.2. Market size and forecast, by region
- 4.3.3. Market share analysis by country
4.4. Wearable Device
- 4.4.1. Key market trends, growth factors and opportunities
- 4.4.2. Market size and forecast, by region
- 4.4.3. Market share analysis by country
4.5. Others
- 4.5.1. Key market trends, growth factors and opportunities
- 4.5.2. Market size and forecast, by region
- 4.5.3. Market share analysis by country

CHAPTER 5: EMBEDDED SUBSCRIBER IDENTITY MODULE (E-SIM) MARKET, BY INDUSTRY VERTICAL

5.1. Overview
- 5.1.1. Market size and forecast
5.2. Automotive
- 5.2.1. Key market trends, growth factors and opportunities
- 5.2.2. Market size and forecast, by region
- 5.2.3. Market share analysis by country
5.3. Consumer Electronics
- 5.3.1. Key market trends, growth factors and opportunities
- 5.3.2. Market size and forecast, by region
- 5.3.3. Market share analysis by country
5.4. Manufacturing
- 5.4.1. Key market trends, growth factors and opportunities
- 5.4.2. Market size and forecast, by region
- 5.4.3. Market share analysis by country
5.5. Telecommunication
- 5.5.1. Key market trends, growth factors and opportunities
- 5.5.2. Market size and forecast, by region
- 5.5.3. Market share analysis by country
5.6. Transportation and Logistics
- 5.6.1. Key market trends, growth factors and opportunities
- 5.6.2. Market size and forecast, by region
- 5.6.3. Market share analysis by country
5.7. Others
- 5.7.1. Key market trends, growth factors and opportunities
- 5.7.2. Market size and forecast, by region
- 5.7.3. Market share analysis by country

CHAPTER 6: EMBEDDED SUBSCRIBER IDENTITY MODULE (E-SIM) MARKET, BY REGION

6.1. Overview
- 6.1.1. Market size and forecast By Region
6.2. North America
- 6.2.1. Key trends and opportunities
- 6.2.2. Market size and forecast, by Application
- 6.2.3. Market size and forecast, by Industry Vertical
- 6.2.4. Market size and forecast, by country
  - 6.2.4.1. U.S.
  - 6.2.4.1.1. Key market trends, growth factors and opportunities
  - 6.2.4.1.2. Market size and forecast, by Application
  - 6.2.4.1.3. Market size and forecast, by Industry Vertical
  - 6.2.4.2. Canada
  - 6.2.4.2.1. Key market trends, growth factors and opportunities
  - 6.2.4.2.2. Market size and forecast, by Application
  - 6.2.4.2.3. Market size and forecast, by Industry Vertical
  - 6.2.4.3. Mexico
  - 6.2.4.3.1. Key market trends, growth factors and opportunities
  - 6.2.4.3.2. Market size and forecast, by Application
  - 6.2.4.3.3. Market size and forecast, by Industry Vertical
6.3. Europe
- 6.3.1. Key trends and opportunities
- 6.3.2. Market size and forecast, by Application
- 6.3.3. Market size and forecast, by Industry Vertical
- 6.3.4. Market size and forecast, by country
  - 6.3.4.1. UK
  - 6.3.4.1.1. Key market trends, growth factors and opportunities
  - 6.3.4.1.2. Market size and forecast, by Application
  - 6.3.4.1.3. Market size and forecast, by Industry Vertical
  - 6.3.4.2. Germany
  - 6.3.4.2.1. Key market trends, growth factors and opportunities
  - 6.3.4.2.2. Market size and forecast, by Application
  - 6.3.4.2.3. Market size and forecast, by Industry Vertical
  - 6.3.4.3. France
  - 6.3.4.3.1. Key market trends, growth factors and opportunities
  - 6.3.4.3.2. Market size and forecast, by Application
  - 6.3.4.3.3. Market size and forecast, by Industry Vertical
  - 6.3.4.4. Italy
  - 6.3.4.4.1. Key market trends, growth factors and opportunities
  - 6.3.4.4.2. Market size and forecast, by Application
  - 6.3.4.4.3. Market size and forecast, by Industry Vertical
  - 6.3.4.5. Rest of Europe
  - 6.3.4.5.1. Key market trends, growth factors and opportunities
  - 6.3.4.5.2. Market size and forecast, by Application
  - 6.3.4.5.3. Market size and forecast, by Industry Vertical
6.4. Asia-Pacific
- 6.4.1. Key trends and opportunities
- 6.4.2. Market size and forecast, by Application
- 6.4.3. Market size and forecast, by Industry Vertical
- 6.4.4. Market size and forecast, by country
  - 6.4.4.1. China
  - 6.4.4.1.1. Key market trends, growth factors and opportunities
  - 6.4.4.1.2. Market size and forecast, by Application
  - 6.4.4.1.3. Market size and forecast, by Industry Vertical
  - 6.4.4.2. Japan
  - 6.4.4.2.1. Key market trends, growth factors and opportunities
  - 6.4.4.2.2. Market size and forecast, by Application
  - 6.4.4.2.3. Market size and forecast, by Industry Vertical
  - 6.4.4.3. India
  - 6.4.4.3.1. Key market trends, growth factors and opportunities
  - 6.4.4.3.2. Market size and forecast, by Application
  - 6.4.4.3.3. Market size and forecast, by Industry Vertical
  - 6.4.4.4. South Korea
  - 6.4.4.4.1. Key market trends, growth factors and opportunities
  - 6.4.4.4.2. Market size and forecast, by Application
  - 6.4.4.4.3. Market size and forecast, by Industry Vertical
  - 6.4.4.5. Rest of Asia-Pacific
  - 6.4.4.5.1. Key market trends, growth factors and opportunities
  - 6.4.4.5.2. Market size and forecast, by Application
  - 6.4.4.5.3. Market size and forecast, by Industry Vertical
6.5. LAMEA
- 6.5.1. Key trends and opportunities
- 6.5.2. Market size and forecast, by Application
- 6.5.3. Market size and forecast, by Industry Vertical
- 6.5.4. Market size and forecast, by country
  - 6.5.4.1. Latin America
  - 6.5.4.1.1. Key market trends, growth factors and opportunities
  - 6.5.4.1.2. Market size and forecast, by Application
  - 6.5.4.1.3. Market size and forecast, by Industry Vertical
  - 6.5.4.2. Middle East
  - 6.5.4.2.1. Key market trends, growth factors and opportunities
  - 6.5.4.2.2. Market size and forecast, by Application
  - 6.5.4.2.3. Market size and forecast, by Industry Vertical
  - 6.5.4.3. Africa
  - 6.5.4.3.1. Key market trends, growth factors and opportunities
  - 6.5.4.3.2. Market size and forecast, by Application
  - 6.5.4.3.3. Market size and forecast, by Industry Vertical

CHAPTER 7: COMPETITIVE LANDSCAPE

7.1. Introduction
7.2. Top winning strategies
7.3. Product Mapping of Top 10 Player
7.4. Competitive Dashboard
7.5. Competitive Heatmap
7.6. Top player positioning, 2022

CHAPTER 8: COMPANY PROFILES

8.1. STMicroelectronics
- 8.1.1. Company overview
- 8.1.2. Key Executives
- 8.1.3. Company snapshot
- 8.1.4. Operating business segments
- 8.1.5. Product portfolio
- 8.1.6. Business performance
- 8.1.7. Key strategic moves and developments
8.2. Infineon Technologies AG
- 8.2.1. Company overview
- 8.2.2. Key Executives
- 8.2.3. Company snapshot
- 8.2.4. Operating business segments
- 8.2.5. Product portfolio
- 8.2.6. Business performance
8.3. NXP semiconductors
- 8.3.1. Company overview
- 8.3.2. Key Executives
- 8.3.3. Company snapshot
- 8.3.4. Operating business segments
- 8.3.5. Product portfolio
- 8.3.6. Business performance
- 8.3.7. Key strategic moves and developments
8.4. Sierra Wireless
- 8.4.1. Company overview
- 8.4.2. Key Executives
- 8.4.3. Company snapshot
- 8.4.4. Operating business segments
- 8.4.5. Product portfolio
- 8.4.6. Business performance
- 8.4.7. Key strategic moves and developments
8.5. Thales
- 8.5.1. Company overview
- 8.5.2. Key Executives
- 8.5.3. Company snapshot
- 8.5.4. Operating business segments
- 8.5.5. Product portfolio
- 8.5.6. Business performance
- 8.5.7. Key strategic moves and developments
8.6. NTT DOCOMO, Inc.
- 8.6.1. Company overview
- 8.6.2. Key Executives
- 8.6.3. Company snapshot
- 8.6.4. Operating business segments
- 8.6.5. Product portfolio
- 8.6.6. Business performance
8.7. Vodafone Group Plc
- 8.7.1. Company overview
- 8.7.2. Key Executives
- 8.7.3. Company snapshot
- 8.7.4. Operating business segments
- 8.7.5. Product portfolio
- 8.7.6. Business performance
8.8. Telenor group
- 8.8.1. Company overview
- 8.8.2. Key Executives
- 8.8.3. Company snapshot
- 8.8.4. Operating business segments
- 8.8.5. Product portfolio
- 8.8.6. Business performance
- 8.8.7. Key strategic moves and developments
8.9. Deutsche Telekom AG
- 8.9.1. Company overview
- 8.9.2. Key Executives
- 8.9.3. Company snapshot
- 8.9.4. Operating business segments
- 8.9.5. Product portfolio
- 8.9.6. Business performance
- 8.9.7. Key strategic moves and developments
8.10. Giesecke+Devrient Mobile Security GmbH
- 8.10.1. Company overview
- 8.10.2. Key Executives
- 8.10.3. Company snapshot
- 8.10.4. Operating business segments
- 8.10.5. Product portfolio
- 8.10.6. Business performance