Power Semiconductor Market By Product (Silicon Carbonate, Gallium Nitride, Others), By Component, By Application : Global Opportunity Analysis and Industry Forecast, 2023-2032

List of Tables

The power semiconductor market was valued at $48.9 billion in 2022 and is projected to reach $79.9 billion by 2032, growing at a CAGR of 4.9% from 2023 to 2032.

The power semiconductor market refers to the global industry involved in the production, distribution, and sale of power semiconductor devices and components. Power semiconductors are electronic devices specifically designed to handle high power levels in electrical circuits. They play a crucial role in various applications, including power electronics, renewable energy systems, electric vehicles, industrial automation, and more. The market for power semiconductors has witnessed significant growth in recent years due to the increasing demand for energy-efficient technologies, the transition towards renewable energy sources, and the rapid adoption of electric vehicles.

The power semiconductor market is segmented on the basis of material, product, industry vertical, and region. On the basis of material, the market is fragmented into silicon carbide (SiC), GaN, and others. On the basis of product, the market is segregated into power MOSFET, IGBT, Thyristor, power diode, and others. By industry vertical, the market is divided into IT & telecom, aerospace & defense, industrial, energy & power, electronics, automotive, and healthcare.

Region-wise, the wireless microphone market trends are analyzed across North America (the U.S., Canada, and Mexico), Europe (UK, Germany, France, and the rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).

The key players profiled in the report include Fujitsu Limited, Infineon Technologies, Maxim Integrated, Microchip Technology, NXP Semiconductors, ON Semiconductor Corporation, Renesas Electronics Corporation, STMicroelectronics, Texas Instruments, and Toshiba Corporation are provided in this report.

Key Benefits For Stakeholders

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the power semiconductor market analysis from 2022 to 2032 to identify the prevailing power semiconductor market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
In-depth analysis of the power semiconductor market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes the analysis of the regional as well as global power semiconductor market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

Quarterly Update and* (only available with a corporate license, on listed price)
5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
Free Upcoming Version on the Purchase of Five and Enterprise User License.
16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
Free data Pack on the Five and Enterprise User License. (Excel version of the report)
Free Updated report if the report is 6-12 months old or older.
24-hour priority response*
Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

Product Benchmarking / Product specification and applications
Supply Chain Analysis & Vendor Margins
New Product Development/ Product Matrix of Key Players
Patient/epidemiology data at country, region, global level
Regulatory Guidelines
Key player details (including location, contact details, supplier/vendor network etc. in excel format)
SWOT Analysis

Key Market Segments

By Application

IT and Telecommunication
Consumer Electronics
Automotive
Aerospace and Defense
Transportation
Medical
Energy and Power
Others

By Product

Silicon Carbonate (SiC)
Gallium Nitride (GaN)
Others

By Component

Discrete
Module
Power Integrated Circuits

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Rest of Europe
Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
LAMEA
- Latin America
- Middle East
- Africa

Key Market Players:

Toshiba Corporation.
Fuji Electric Co Ltd.
Texas Instruments Inc.
Hitachi, Ltd
Infineon Technologies AG
ON Semiconductor Corporation
NXP Semiconductors N.V.
Mitsubishi Electric Corporation
Renesas Electronics
STMicroelectronics N.V.

Product Code: A01277

CHAPTER 1: INTRODUCTION

1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research methodology
- 1.4.1. Primary research
- 1.4.2. Secondary research
- 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

3.1. Market definition and scope
3.2. Key findings
- 3.2.1. Top impacting factors
- 3.2.2. Top investment pockets
3.3. Porter's five forces analysis
- 3.3.1. Moderate threat of substitutes
- 3.3.2. Moderate intensity of rivalry
- 3.3.3. Moderate bargaining power of suppliers
- 3.3.4. Moderate to high threat of new entrants
- 3.3.5. Moderate to high bargaining power of buyers
3.4. Market dynamics
- 3.4.1. Drivers
  - 3.4.1.1. Increase in the use of solar photovoltaic panels to generate electricity
  - 3.4.1.2. Surge in demand for power electronics modules across various industry verticals
  - 3.4.1.3. Growing demand for wireless communication and consumer electronics
- 3.4.2. Restraints
  - 3.4.2.1. Intricacy in the production network and planning cycle of SiC semiconductor innovation
- 3.4.3. Opportunities
  - 3.4.3.1. HVDC and smart grid initiatives by the government
3.5. Regulatory Guidelines

CHAPTER 4: POWER SEMICONDUCTOR MARKET, BY PRODUCT

4.1. Overview
- 4.1.1. Market size and forecast
4.2. Silicon Carbide (SiC)
- 4.2.1. Key market trends, growth factors and opportunities
- 4.2.2. Market size and forecast, by region
- 4.2.3. Market share analysis by country
4.3. Gallium Nitride (GaN)
- 4.3.1. Key market trends, growth factors and opportunities
- 4.3.2. Market size and forecast, by region
- 4.3.3. Market share analysis by country
4.4. Others
- 4.4.1. Key market trends, growth factors and opportunities
- 4.4.2. Market size and forecast, by region
- 4.4.3. Market share analysis by country

CHAPTER 5: POWER SEMICONDUCTOR MARKET, BY COMPONENT

5.1. Overview
- 5.1.1. Market size and forecast
5.2. Discrete
- 5.2.1. Key market trends, growth factors and opportunities
- 5.2.2. Market size and forecast, by region
- 5.2.3. Market share analysis by country
5.3. Module
- 5.3.1. Key market trends, growth factors and opportunities
- 5.3.2. Market size and forecast, by region
- 5.3.3. Market share analysis by country
5.4. Power Integrated Circuits
- 5.4.1. Key market trends, growth factors and opportunities
- 5.4.2. Market size and forecast, by region
- 5.4.3. Market share analysis by country

CHAPTER 6: POWER SEMICONDUCTOR MARKET, BY APPLICATION

6.1. Overview
- 6.1.1. Market size and forecast
6.2. IT and Telecommunication
- 6.2.1. Key market trends, growth factors and opportunities
- 6.2.2. Market size and forecast, by region
- 6.2.3. Market share analysis by country
6.3. Consumer Electronics
- 6.3.1. Key market trends, growth factors and opportunities
- 6.3.2. Market size and forecast, by region
- 6.3.3. Market share analysis by country
6.4. Automotive
- 6.4.1. Key market trends, growth factors and opportunities
- 6.4.2. Market size and forecast, by region
- 6.4.3. Market share analysis by country
6.5. Aerospace and Defense
- 6.5.1. Key market trends, growth factors and opportunities
- 6.5.2. Market size and forecast, by region
- 6.5.3. Market share analysis by country
6.6. Transportation
- 6.6.1. Key market trends, growth factors and opportunities
- 6.6.2. Market size and forecast, by region
- 6.6.3. Market share analysis by country
6.7. Medical
- 6.7.1. Key market trends, growth factors and opportunities
- 6.7.2. Market size and forecast, by region
- 6.7.3. Market share analysis by country
6.8. Energy and Power
- 6.8.1. Key market trends, growth factors and opportunities
- 6.8.2. Market size and forecast, by region
- 6.8.3. Market share analysis by country
6.9. Others
- 6.9.1. Key market trends, growth factors and opportunities
- 6.9.2. Market size and forecast, by region
- 6.9.3. Market share analysis by country

CHAPTER 7: POWER SEMICONDUCTOR MARKET, BY REGION

7.1. Overview
- 7.1.1. Market size and forecast By Region
7.2. North America
- 7.2.1. Key market trends, growth factors and opportunities
- 7.2.2. Market size and forecast, by Product
- 7.2.3. Market size and forecast, by Component
- 7.2.4. Market size and forecast, by Application
- 7.2.5. Market size and forecast, by country
  - 7.2.5.1. U.S.
  - 7.2.5.1.1. Market size and forecast, by Product
  - 7.2.5.1.2. Market size and forecast, by Component
  - 7.2.5.1.3. Market size and forecast, by Application
  - 7.2.5.2. Canada
  - 7.2.5.2.1. Market size and forecast, by Product
  - 7.2.5.2.2. Market size and forecast, by Component
  - 7.2.5.2.3. Market size and forecast, by Application
  - 7.2.5.3. Mexico
  - 7.2.5.3.1. Market size and forecast, by Product
  - 7.2.5.3.2. Market size and forecast, by Component
  - 7.2.5.3.3. Market size and forecast, by Application
7.3. Europe
- 7.3.1. Key market trends, growth factors and opportunities
- 7.3.2. Market size and forecast, by Product
- 7.3.3. Market size and forecast, by Component
- 7.3.4. Market size and forecast, by Application
- 7.3.5. Market size and forecast, by country
  - 7.3.5.1. UK
  - 7.3.5.1.1. Market size and forecast, by Product
  - 7.3.5.1.2. Market size and forecast, by Component
  - 7.3.5.1.3. Market size and forecast, by Application
  - 7.3.5.2. Germany
  - 7.3.5.2.1. Market size and forecast, by Product
  - 7.3.5.2.2. Market size and forecast, by Component
  - 7.3.5.2.3. Market size and forecast, by Application
  - 7.3.5.3. France
  - 7.3.5.3.1. Market size and forecast, by Product
  - 7.3.5.3.2. Market size and forecast, by Component
  - 7.3.5.3.3. Market size and forecast, by Application
  - 7.3.5.4. Rest of Europe
  - 7.3.5.4.1. Market size and forecast, by Product
  - 7.3.5.4.2. Market size and forecast, by Component
  - 7.3.5.4.3. Market size and forecast, by Application
7.4. Asia-Pacific
- 7.4.1. Key market trends, growth factors and opportunities
- 7.4.2. Market size and forecast, by Product
- 7.4.3. Market size and forecast, by Component
- 7.4.4. Market size and forecast, by Application
- 7.4.5. Market size and forecast, by country
  - 7.4.5.1. China
  - 7.4.5.1.1. Market size and forecast, by Product
  - 7.4.5.1.2. Market size and forecast, by Component
  - 7.4.5.1.3. Market size and forecast, by Application
  - 7.4.5.2. Japan
  - 7.4.5.2.1. Market size and forecast, by Product
  - 7.4.5.2.2. Market size and forecast, by Component
  - 7.4.5.2.3. Market size and forecast, by Application
  - 7.4.5.3. India
  - 7.4.5.3.1. Market size and forecast, by Product
  - 7.4.5.3.2. Market size and forecast, by Component
  - 7.4.5.3.3. Market size and forecast, by Application
  - 7.4.5.4. South Korea
  - 7.4.5.4.1. Market size and forecast, by Product
  - 7.4.5.4.2. Market size and forecast, by Component
  - 7.4.5.4.3. Market size and forecast, by Application
  - 7.4.5.5. Rest of Asia-Pacific
  - 7.4.5.5.1. Market size and forecast, by Product
  - 7.4.5.5.2. Market size and forecast, by Component
  - 7.4.5.5.3. Market size and forecast, by Application
7.5. LAMEA
- 7.5.1. Key market trends, growth factors and opportunities
- 7.5.2. Market size and forecast, by Product
- 7.5.3. Market size and forecast, by Component
- 7.5.4. Market size and forecast, by Application
- 7.5.5. Market size and forecast, by country
  - 7.5.5.1. Latin America
  - 7.5.5.1.1. Market size and forecast, by Product
  - 7.5.5.1.2. Market size and forecast, by Component
  - 7.5.5.1.3. Market size and forecast, by Application
  - 7.5.5.2. Middle East
  - 7.5.5.2.1. Market size and forecast, by Product
  - 7.5.5.2.2. Market size and forecast, by Component
  - 7.5.5.2.3. Market size and forecast, by Application
  - 7.5.5.3. Africa
  - 7.5.5.3.1. Market size and forecast, by Product
  - 7.5.5.3.2. Market size and forecast, by Component
  - 7.5.5.3.3. Market size and forecast, by Application

CHAPTER 8: COMPETITIVE LANDSCAPE

8.1. Introduction
8.2. Top winning strategies
8.3. Product mapping of top 10 player
8.4. Competitive dashboard
8.5. Competitive heatmap
8.6. Top player positioning, 2022

CHAPTER 9: COMPANY PROFILES

9.1. ON Semiconductor Corporation
- 9.1.1. Company overview
- 9.1.2. Key executives
- 9.1.3. Company snapshot
- 9.1.4. Operating business segments
- 9.1.5. Product portfolio
- 9.1.6. Business performance
- 9.1.7. Key strategic moves and developments
9.2. Renesas Electronics
- 9.2.1. Company overview
- 9.2.2. Key executives
- 9.2.3. Company snapshot
- 9.2.4. Operating business segments
- 9.2.5. Product portfolio
- 9.2.6. Business performance
- 9.2.7. Key strategic moves and developments
9.3. Toshiba Corporation.
- 9.3.1. Company overview
- 9.3.2. Key executives
- 9.3.3. Company snapshot
- 9.3.4. Operating business segments
- 9.3.5. Product portfolio
- 9.3.6. Business performance
- 9.3.7. Key strategic moves and developments
9.4. NXP Semiconductors N.V.
- 9.4.1. Company overview
- 9.4.2. Key executives
- 9.4.3. Company snapshot
- 9.4.4. Operating business segments
- 9.4.5. Product portfolio
- 9.4.6. Business performance
- 9.4.7. Key strategic moves and developments
9.5. Fuji Electric Co Ltd.
- 9.5.1. Company overview
- 9.5.2. Key executives
- 9.5.3. Company snapshot
- 9.5.4. Operating business segments
- 9.5.5. Product portfolio
- 9.5.6. Business performance
- 9.5.7. Key strategic moves and developments
9.6. Infineon Technologies AG
- 9.6.1. Company overview
- 9.6.2. Key executives
- 9.6.3. Company snapshot
- 9.6.4. Operating business segments
- 9.6.5. Product portfolio
- 9.6.6. Business performance
- 9.6.7. Key strategic moves and developments
9.7. Texas Instruments Inc.
- 9.7.1. Company overview
- 9.7.2. Key executives
- 9.7.3. Company snapshot
- 9.7.4. Operating business segments
- 9.7.5. Product portfolio
- 9.7.6. Business performance
- 9.7.7. Key strategic moves and developments
9.8. STMicroelectronics N.V.
- 9.8.1. Company overview
- 9.8.2. Key executives
- 9.8.3. Company snapshot
- 9.8.4. Operating business segments
- 9.8.5. Product portfolio
- 9.8.6. Business performance
- 9.8.7. Key strategic moves and developments
9.9. Mitsubishi Electric Corporation
- 9.9.1. Company overview
- 9.9.2. Key executives
- 9.9.3. Company snapshot
- 9.9.4. Operating business segments
- 9.9.5. Product portfolio
- 9.9.6. Business performance
- 9.9.7. Key strategic moves and developments
9.10. Hitachi, Ltd
- 9.10.1. Company overview
- 9.10.2. Key executives
- 9.10.3. Company snapshot
- 9.10.4. Operating business segments
- 9.10.5. Product portfolio
- 9.10.6. Business performance
- 9.10.7. Key strategic moves and developments