Dram Market By Type (SDRAM, DDR SDRAM, DDR5 SDRAM, LPDDR, Others), By Application (Smartphones and Tablets, PC and Laptop, Data Center, Others): Global Opportunity Analysis and Industry Forecast, 2023-2032

Description

List of Tables

According to a new report published by Allied Market Research, titled, "Dram Market," The dram market was valued at $6.2 billion in 2022, and is estimated to reach $10.2 billion by 2032, growing at a CAGR of 5.4% from 2023 to 2032.

Random-access memory that stores data in bit form on a separate capacitor is called DRAM. When data is stored in static RAM (SRAM), input to the memory chip keeps the data unchanged as it is stored in a static manner. As a result, compared to an SRAM chip of the same size, a DRAM retains or stores more data. Because DRAM uses fewer chips than statically stored data to store the same amount of information, it stores data more effectively. There are several types of DRAMS, including synchronous DRAM (SDRAM), burst extended data output (BEDO), external data output (EDO), fast page mode (FPM), and asynchronous DRAM.

When compared to SRAM, DRAM is more efficient in storing data because it requires fewer transistors a type of component to store each bit. DRAM can efficiently store more information with fewer chips thanks to this design's increased storage density. Various types of DRAMs have been created to fulfil distinct demands for performance. While Burst Extended Data Output (BEDO), External Data Output (EDO), Fast Page Mode (FPM), and Asynchronous DRAM address various needs and application circumstances, Synchronous DRAM (SDRAM) synchronizes data transfers with the system clock for improved performance. The needs of the system and financial concerns determine which type of DRAM is used.

The DRAM market is segmented into type, application, and region. By type, the market is classified into SDRAM, DDR SDRAM, DDR5 SDRAM, LPDDR, and others. In 2022, the SDRAM segment dominated the market, and it is expected to acquire a major market share by 2032. By application, it is bifurcated into smartphones and tablets, PC and laptop, data centers, and others. Region wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

Region wise, the DRAM market trends are analyzed across North America (the U.S., Canada, and Mexico), Europe (the UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).

On the basis of region, the DRAM market trends are analyzed across North America (the U.S., Canada, and Mexico), Europe (the UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

Competitive analysis and profiles of the major global DRAM market players that have been provided in the report include Samsung Electronics, Micron Technology Inc., SK HYNIX INC., Nanya Technology Corporation, Winbond Electronics Corporation, Powerchip Technology Corporation, Transcend Information, Kingston Technology, Integrated Silicon Solutions, and Intel Corporation. The key strategies adopted by the major players of the DRAM market are product launch.

Key Benefits For Stakeholders

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the dram market analysis from 2022 to 2032 to identify the prevailing dram market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
In-depth analysis of the dram market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes the analysis of the regional as well as global dram market trends, key players, market segments, application areas, and market growth strategies.

Additional benefits you will get with this purchase are:

Quarterly Update and* (only available with a corporate license, on listed price)
5 additional Company Profile of client Choice pre- or Post-purchase, as a free update.
Free Upcoming Version on the Purchase of Five and Enterprise User License.
16 analyst hours of support* (post-purchase, if you find additional data requirements upon review of the report, you may receive support amounting to 16 analyst hours to solve questions, and post-sale queries)
15% Free Customization* (in case the scope or segment of the report does not match your requirements, 15% is equivalent to 3 working days of free work, applicable once)
Free data Pack on the Five and Enterprise User License. (Excel version of the report)
Free Updated report if the report is 6-12 months old or older.
24-hour priority response*
Free Industry updates and white papers.

Possible Customization with this report (with additional cost and timeline, please talk to the sales executive to know more)

Manufacturing Capacity
Product Benchmarking / Product specification and applications
Market share analysis of players by products/segments
Regulatory Guidelines
Import Export Analysis/Data

Key Market Segments

By Type

SDRAM
DDR SDRAM
DDR5 SDRAM
LPDDR
Others

By Application

Smartphones and Tablets
PC and Laptop
Data Center
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Rest of Europe
Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
LAMEA
- Latin America
- Middle East
- Africa

Key Market Players:

Winbond
Transcend Information
Kingston Technology
Samsung Electronics
Micron Technology Inc.
Nanya Technology Corporation
SK HYNIX INC.
Intel Corporation
Integrated Silicon Solution Inc.
Powerchip Semiconductor Manufacturing Corporation

Product Code: A06300

CHAPTER 1: INTRODUCTION

1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research methodology
- 1.4.1. Primary research
- 1.4.2. Secondary research
- 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

3.1. Market definition and scope
3.2. Key findings
- 3.2.1. Top impacting factors
- 3.2.2. Top investment pockets
3.3. Porter's five forces analysis
- 3.3.1. High bargaining power of suppliers
- 3.3.2. Moderate to high threat of new entrants
- 3.3.3. Low to moderate threat of substitutes
- 3.3.4. Low intensity of rivalry
- 3.3.5. High bargaining power of buyers
3.4. Market dynamics
- 3.4.1. Drivers
  - 3.4.1.1. Surge in demand for smartphones
  - 3.4.1.2. Increasing number of data center installation
- 3.4.2. Restraints
  - 3.4.2.1. Manufacturing process of DRAM is complex which may hamper the market growth
- 3.4.3. Opportunities
  - 3.4.3.1. Rise in bitcoin mining and demanding gaming consoles are driving up the market demand.

CHAPTER 4: DRAM MARKET, BY TYPE

4.1. Overview
- 4.1.1. Market size and forecast
4.2. SDRAM
- 4.2.1. Key market trends, growth factors and opportunities
- 4.2.2. Market size and forecast, by region
- 4.2.3. Market share analysis by country
4.3. DDR SDRAM
- 4.3.1. Key market trends, growth factors and opportunities
- 4.3.2. Market size and forecast, by region
- 4.3.3. Market share analysis by country
4.4. DDR5 SDRAM
- 4.4.1. Key market trends, growth factors and opportunities
- 4.4.2. Market size and forecast, by region
- 4.4.3. Market share analysis by country
4.5. LPDDR
- 4.5.1. Key market trends, growth factors and opportunities
- 4.5.2. Market size and forecast, by region
- 4.5.3. Market share analysis by country
4.6. Others
- 4.6.1. Key market trends, growth factors and opportunities
- 4.6.2. Market size and forecast, by region
- 4.6.3. Market share analysis by country

CHAPTER 5: DRAM MARKET, BY APPLICATION

5.1. Overview
- 5.1.1. Market size and forecast
5.2. Smartphones and Tablets
- 5.2.1. Key market trends, growth factors and opportunities
- 5.2.2. Market size and forecast, by region
- 5.2.3. Market share analysis by country
5.3. PC and Laptop
- 5.3.1. Key market trends, growth factors and opportunities
- 5.3.2. Market size and forecast, by region
- 5.3.3. Market share analysis by country
5.4. Data Center
- 5.4.1. Key market trends, growth factors and opportunities
- 5.4.2. Market size and forecast, by region
- 5.4.3. Market share analysis by country
5.5. Others
- 5.5.1. Key market trends, growth factors and opportunities
- 5.5.2. Market size and forecast, by region
- 5.5.3. Market share analysis by country

CHAPTER 6: DRAM MARKET, BY REGION

6.1. Overview
- 6.1.1. Market size and forecast By Region
6.2. North America
- 6.2.1. Key market trends, growth factors and opportunities
- 6.2.2. Market size and forecast, by Type
- 6.2.3. Market size and forecast, by Application
- 6.2.4. Market size and forecast, by country
  - 6.2.4.1. U.S.
  - 6.2.4.1.1. Market size and forecast, by Type
  - 6.2.4.1.2. Market size and forecast, by Application
  - 6.2.4.2. Canada
  - 6.2.4.2.1. Market size and forecast, by Type
  - 6.2.4.2.2. Market size and forecast, by Application
  - 6.2.4.3. Mexico
  - 6.2.4.3.1. Market size and forecast, by Type
  - 6.2.4.3.2. Market size and forecast, by Application
6.3. Europe
- 6.3.1. Key market trends, growth factors and opportunities
- 6.3.2. Market size and forecast, by Type
- 6.3.3. Market size and forecast, by Application
- 6.3.4. Market size and forecast, by country
  - 6.3.4.1. UK
  - 6.3.4.1.1. Market size and forecast, by Type
  - 6.3.4.1.2. Market size and forecast, by Application
  - 6.3.4.2. Germany
  - 6.3.4.2.1. Market size and forecast, by Type
  - 6.3.4.2.2. Market size and forecast, by Application
  - 6.3.4.3. France
  - 6.3.4.3.1. Market size and forecast, by Type
  - 6.3.4.3.2. Market size and forecast, by Application
  - 6.3.4.4. Rest of Europe
  - 6.3.4.4.1. Market size and forecast, by Type
  - 6.3.4.4.2. Market size and forecast, by Application
6.4. Asia-Pacific
- 6.4.1. Key market trends, growth factors and opportunities
- 6.4.2. Market size and forecast, by Type
- 6.4.3. Market size and forecast, by Application
- 6.4.4. Market size and forecast, by country
  - 6.4.4.1. China
  - 6.4.4.1.1. Market size and forecast, by Type
  - 6.4.4.1.2. Market size and forecast, by Application
  - 6.4.4.2. Japan
  - 6.4.4.2.1. Market size and forecast, by Type
  - 6.4.4.2.2. Market size and forecast, by Application
  - 6.4.4.3. India
  - 6.4.4.3.1. Market size and forecast, by Type
  - 6.4.4.3.2. Market size and forecast, by Application
  - 6.4.4.4. South Korea
  - 6.4.4.4.1. Market size and forecast, by Type
  - 6.4.4.4.2. Market size and forecast, by Application
  - 6.4.4.5. Rest of Asia-Pacific
  - 6.4.4.5.1. Market size and forecast, by Type
  - 6.4.4.5.2. Market size and forecast, by Application
6.5. LAMEA
- 6.5.1. Key market trends, growth factors and opportunities
- 6.5.2. Market size and forecast, by Type
- 6.5.3. Market size and forecast, by Application
- 6.5.4. Market size and forecast, by country
  - 6.5.4.1. Latin America
  - 6.5.4.1.1. Market size and forecast, by Type
  - 6.5.4.1.2. Market size and forecast, by Application
  - 6.5.4.2. Middle East
  - 6.5.4.2.1. Market size and forecast, by Type
  - 6.5.4.2.2. Market size and forecast, by Application
  - 6.5.4.3. Africa
  - 6.5.4.3.1. Market size and forecast, by Type
  - 6.5.4.3.2. Market size and forecast, by Application

CHAPTER 7: COMPETITIVE LANDSCAPE

7.1. Introduction
7.2. Top winning strategies
7.3. Product mapping of top 10 player
7.4. Competitive dashboard
7.5. Competitive heatmap
7.6. Top player positioning, 2022

CHAPTER 8: COMPANY PROFILES

8.1. Samsung Electronics
- 8.1.1. Company overview
- 8.1.2. Key executives
- 8.1.3. Company snapshot
- 8.1.4. Operating business segments
- 8.1.5. Product portfolio
- 8.1.6. Business performance
- 8.1.7. Key strategic moves and developments
8.2. Micron Technology Inc.
- 8.2.1. Company overview
- 8.2.2. Key executives
- 8.2.3. Company snapshot
- 8.2.4. Operating business segments
- 8.2.5. Product portfolio
- 8.2.6. Business performance
8.3. SK HYNIX INC.
- 8.3.1. Company overview
- 8.3.2. Key executives
- 8.3.3. Company snapshot
- 8.3.4. Operating business segments
- 8.3.5. Product portfolio
- 8.3.6. Business performance
- 8.3.7. Key strategic moves and developments
8.4. Nanya Technology Corporation
- 8.4.1. Company overview
- 8.4.2. Key executives
- 8.4.3. Company snapshot
- 8.4.4. Operating business segments
- 8.4.5. Product portfolio
- 8.4.6. Business performance
8.5. Winbond
- 8.5.1. Company overview
- 8.5.2. Key executives
- 8.5.3. Company snapshot
- 8.5.4. Operating business segments
- 8.5.5. Product portfolio
- 8.5.6. Business performance
8.6. Powerchip Semiconductor Manufacturing Corporation
- 8.6.1. Company overview
- 8.6.2. Key executives
- 8.6.3. Company snapshot
- 8.6.4. Operating business segments
- 8.6.5. Product portfolio
- 8.6.6. Business performance
- 8.6.7. Key strategic moves and developments
8.7. Transcend Information
- 8.7.1. Company overview
- 8.7.2. Key executives
- 8.7.3. Company snapshot
- 8.7.4. Operating business segments
- 8.7.5. Product portfolio
- 8.7.6. Business performance
- 8.7.7. Key strategic moves and developments
8.8. Kingston Technology
- 8.8.1. Company overview
- 8.8.2. Key executives
- 8.8.3. Company snapshot
- 8.8.4. Operating business segments
- 8.8.5. Product portfolio
- 8.8.6. Business performance
8.9. Integrated Silicon Solution Inc.
- 8.9.1. Company overview
- 8.9.2. Key executives
- 8.9.3. Company snapshot
- 8.9.4. Operating business segments
- 8.9.5. Product portfolio
8.10. Intel Corporation
- 8.10.1. Company overview
- 8.10.2. Key executives
- 8.10.3. Company snapshot
- 8.10.4. Operating business segments
- 8.10.5. Product portfolio
- 8.10.6. Business performance