PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1070391
PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1070391
The Flip chip Technology market is estimated to be worth US$ 30,600.8 million in 2020. Flip chip Technology market is expected to expand at an 8.2% CAGR during the forecast period.
Market Introduction
Flip-chip improves the appearance of electrical devices that operate at higher frequencies, making them more useful in ultrasonic and microwave applications. In comparison to its competitors, the technology has a high overall system efficiency and low inductance while taking up less area. Flip chips are used in electronic equipment because of their explicit characteristics. Flip chips are commonly found in high-volume consumer items, including computer peripherals, cell phones, and cameras. Flip chips offer a wide range of advantages, including strong electrical performance, high speed, and dependability, and thus perform better than wire-bond packaging.
Market Dynamics
The growing demand for miniaturization and high performance in electronic devices, as well as the strong penetration of advanced packaging technology in the consumer electronics sector, are driving the growth of the flip-chip technology market. With the introduction of flip-chip packaging technology, the size of the die has been significantly reduced, resulting in a significant reduction in silicon cost. Using flip-chip technology, the total package size can also be reduced. Other advantages of flip-chip technology include lower signal inductance, lower power inductance, and higher signal density. Because of the long-term lockdown caused by the Covid-19 pandemic, all production industries and bases are affected globally, hampering the growth of the flip-chip technology business. Furthermore, the market players continue to expand their processing capacity for high-end packaging technologies, which will result in significant growth opportunities for the flip-chip technology market during the forecast period.
Segmentation Analysis
The flip-chip technology market is segmented by product, wafer bumping process, packaging technology, end-user, regional distribution, and competitive landscape. Based on end-user, the consumer electronics segment holds the largest share of ~35% of the global market. In recent years, there has been a surge in demand for electronic products that utilize flip-chip technology. The internet, digital cameras, laptop computers, digital cameras, cell phones, and other electronics consumer products are all advancing flip-chip technology. As the market is witnessing an expansion, variables such as product functionality, volume production, and speed to market became increasingly important. Because of the widespread usage of flip-chip technology in some of these goods, there is a demand for the next generation, which involves integration and innovation, resulting in an expansion of applications across a wide range of industries. As a result, the market's growth is fueled by the ease with which electronic gadgets can be integrated.
Competitive Landscape
The key market players in the market are adopting various strategies such as new product launches, mergers, acquisitions, and partnerships to strengthen their presence in the market. For instance, in March 2021, Samsung Electronics and Marvell (jointly introduced a new System-on-a-Chip to enhance 5G network performance, which will be used in Samsung Electronic's Massive MIMO and other advanced radios. In addition to this, companies are also focusing on expansion. For instance, in 2020, leading players such as Taiwan Semiconductor Manufacturing Company, Chang Chun Petrochemical Co. Ltd, and Mirle Automation Corporation announced the establishment of new facilities in Arizona to strengthen their global position.
Key features of the study:
This proposed research study on Flip chip Technology market provides market size (US$ million), compound annual growth rate (CAGR %) and forecast estimation (2021-2027), considering 2020 as the base year
The research report elucidates potential growth opportunities across different segments/countries and explains attractive investment proposition matrix for Flip chip Technology market.
The overall report identifies new investment opportunities, challenges faced by established players, and growth factors to sustain in the Flip chip Technology market.
Impact of COVID-19 on Flip chip Technology market size, forecast, CAGR, and market dynamics are discussed in detail under the research scope. Detailed insight on Flip chip Technology market post-COVID will also be covered.
In order to give the users of this report a comprehensive view on the Flip chip Technology market, we have also included competitive landscape and key innovator analysis for the Flip chip Technology market
The study encompasses a growth prospect mapping analysis, wherein all the industry segments are benchmarked based on their market size, growth rate and attractiveness.
The report offers detailed company profiling featuring major market participants which will help users to understand their financial information and strategic initiatives of players operating in the Flip chip Technology market.
In addition, the report also unveil the important acquisitions & mergers, collaborations & joint ventures, new launch, research & development, regional expansion of major participants involved in the market on global as well as regional level.
The Flip chip Technology market report primarily caters to various stakeholders in this industry including suppliers, investors, new entrants, distributors, and financial analysts
SCOPE OF THE REPORT
The scope of this report covers the market by its major segments, which include as follows:
Flip chip Technology Market Key Players
Taiwan Semiconductor Manufacturing Company Limited (TSMC Ltd.)
Samsung Electronics Co., Ltd.
Intel Corp.
United Microelectronics Corp.
ASE Group
Amkor Technology
Siliconware Precision Industries Co., Ltd.
Powertech Technology, Inc.
Stats Chippac Ltd.
Jiangsu Changjiang Electronics Technology Co., Ltd
Flip chip Technology Market by Product
Memory
LED
CMOS Image sensor
RF, analog, mixed signal, and power IC
CPU
SoC
GPU
Flip chip Technology Market by Wafer Bumping Process
Copper (Cu) pillar
Lead-free
Tin/lead eutectic solder
Gold stud+ plated solder
Flip chip Technology Market by Packaging Type
FC BGA
FC PGA
FC LGA
FC QFN
FC SiP
FC CSP
Flip chip Technology Market by Packaging Technology
2D IC
2.5D IC
3D IC
Flip chip Technology Market by End User
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace
Flip chip Technology Market by Region
North America
United States
Canada
Mexico
Europe
Germany
United Kingdom
France
Italy
Spain
Rest of Europe
Asia-Pacific
China
Japan
India
Australia
South Korea
Rest of Asia-Pacific
Latin America
Brazil
Argentina
Rest of Latin America
Middle-East and Africa
GCC
South Africa
Rest of Middle-East and Africa