PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1748601
PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1748601
CMP Equipment Market size was valued at US$ 5,860.32 Million in 2024, expanding at a CAGR of 5.90% from 2025 to 2032.
CMP (Chemical Mechanical Planarization) equipment is a critical tool in semiconductor fabrication used to flatten and smooth the surface of semiconductor wafers. The CMP process combines both chemical and mechanical actions to remove excess material from the wafer surface, ensuring uniformity and preparing it for the deposition of additional layers. CMP equipment typically consists of a rotating polishing pad, a slurry dispenser that applies chemical slurry, and a wafer holder that applies pressure. The slurry, containing abrasive particles, helps break down the material on the wafer while the polishing pad smooths the surface. CMP equipment is essential for producing high-quality semiconductor devices with precise layer thickness and surface integrity.
CMP Equipment Market- Market Dynamics
Surging demand for consumer electronics and rapid technological advancements to propel market demand
The global CMP (Chemical Mechanical Planarization) equipment market is experiencing robust growth, primarily driven by the surging demand for consumer electronics and rapid technological advancements. As smartphones, laptops, tablets, and wearable devices become more compact and functionally sophisticated, the need for high-performance semiconductor components such as ICs, memory chips, and sensors increases. These components require precise surface planarization to meet the stringent design and performance specifications of modern electronics-an essential role fulfilled by CMP equipment. Furthermore, the ongoing trend toward miniaturization in electronics amplifies the demand for CMP tools capable of achieving uniform surface finishes at nanoscale dimensions. In addition, technological innovation is significantly enhancing the capabilities of CMP equipment. Advances in polishing pad materials-such as nanostructured and composite pads-are improving process efficiency, uniformity, and defect reduction. Sophisticated endpoint detection technologies using optical, acoustic, and electrical measurement methods ensure precise material removal, reducing the risk of over- or under-polishing. These advancements are not only improving performance but are also expanding the range of CMP applications. Together, rising consumer electronics production and continual equipment innovation are propelling the global CMP equipment market forward.
CMP Equipment Market- Key Insights
As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 5.90% over the forecast period (2025-2032)
Based on product type segmentation, 300mm was predicted to show maximum market share in the year 2024
Based on application segmentation, IDM was the leading application in 2024
Based on End user segmentation, Consumer Electronics was the leading End user in 2024
On the basis of region, Asia Pacific was the leading revenue generator in 2024
The Global CMP Equipment Market is segmented on the basis of Product Type, Application, End user, Technology, and Region.
The market is divided into three categories based on product type: 150MM, 200MM and 300MM. The 300mm CMP equipment segment dominates the market due to its higher throughput, cost-efficiency, and widespread adoption in advanced semiconductor manufacturing. As chipmakers push for increased yield and reduced production costs, the transition from 200mm and 150mm to 300mm wafers offers significant advantages in economies of scale and processing efficiency. Major semiconductor manufacturers have scaled up 300mm wafer production to meet the growing global demand for consumer electronics, automotive chips, and data centre applications. This shift has driven the demand for CMP equipment specifically designed for 300mm wafer processing, reinforcing its leading position in the market.
The market is divided into two categories based on application: Pureplay Foundries and IDMs. The IDM segment holds a dominant share in the CMP equipment market, primarily due to its end-to-end control of the semiconductor manufacturing process, from design to fabrication. IDMs typically invest heavily in advanced CMP tools to support in-house manufacturing of high-performance and specialized chips used in various applications including consumer electronics, automotive, and industrial automation. Their need for precision, yield improvement, and consistent quality drives continuous investment in state-of-the-art CMP solutions. Additionally, the trend toward developing next-generation technologies like AI chips and high-bandwidth memory further boosts CMP adoption among IDMs, solidifying their leading role in the market.
CMP Equipment Market- Geographical Insights
Asia Pacific holds the largest share of the global CMP equipment market, driven by the strong presence of leading semiconductor manufacturers in countries such as Taiwan, South Korea, China, and Japan. Taiwan's TSMC, South Korea's Samsung and SK Hynix, and China's expanding domestic semiconductor ecosystem are major consumers of advanced CMP tools. The region's high concentration of fabrication facilities (fabs), ongoing capacity expansion, and government-backed semiconductor initiatives significantly contribute to regional growth.
Companies in the Chemical Mechanical Planarization equipment market are increasingly focusing on technological advancements and strategic partnerships to strengthen their competitive edge and address the growing complexity of semiconductor manufacturing. Key players are investing in the development of next-generation CMP systems that offer improved process control, reduced defectivity, and compatibility with advanced nodes such as 5nm and below. Innovations include enhanced wafer uniformity, real-time endpoint detection, and integration with artificial intelligence for predictive maintenance and process optimization. In parallel, companies are forming strategic alliances with semiconductor foundries, material suppliers, and research institutions to accelerate product development and ensure alignment with evolving customer needs. These collaborations enable access to emerging markets, facilitate faster innovation cycles, and support the co-development of tailored CMP solutions for new applications, such as 3d ICS and advanced packaging.
In June 2022, Entegris Inc. completed its acquisition of CMC Materials, a strategic decision that strengthens Entegris' product portfolio and operational capabilities, particularly within semiconductor applications. This acquisition is anticipated to boost the company's revenue from unit-driven sales, increasing the share from 70% to approximately 80%, ultimately enhancing customer productivity and driving cost efficiencies.