PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1836263
PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1836263
Flexible Printed Circuits in the Telecommunications Market size was valued at US$ 6,867.43 Million in 2024, expanding at a CAGR of 5.5% from 2025 to 2032.
The Flexible Printed Circuits (FPC) in the Telecommunications Market, valued for its role in enabling lightweight, compact, and high-performance electronic connections, is projected to grow steadily between 2025 and 2035. Flexible printed circuits are thin, bendable circuit boards that provide reliable interconnections in telecom equipment such as smartphones, base stations, antennas, and 5G infrastructure. Market growth is driven by the rising adoption of 5G networks, miniaturization of telecom devices, and increasing demand for high-speed data transmission, with companies like Nippon Mektron and Sumitomo Electric advancing FPC technologies for next-gen communication systems. However, high manufacturing costs, complex design requirements, and challenges in repairability act as restraints, slowing large-scale adoption. Opportunities lie in the integration of FPCs in IoT-enabled telecom devices, foldable smartphones, and cloud data centers, where flexibility, space efficiency, and durability are critical for future connectivity demands.
Flexible Printed Circuits in Telecommunications Market- Market Dynamics
Rising 5G Deployment and Device Miniaturization Driving Growth of Flexible Printed Circuits in Telecommunications Market
As India has rapidly expanded its 5G infrastructure with coverage reaching approximately 99.8 percent of districts by June 30, 2025, and around 486,000 5G base transceiver stations (BTSs) installed nationwide, telecom equipment makers are pressured to shrink device footprints while boosting performance. This tight integration between slim-line antenna modules, compact baseband units, and flexible internal interconnects has driven widespread adoption of flexible printed circuits (FPCs), particularly in base station equipment and handheld devices. For example, the government's push under the National Broadband Mission to streamline right-of-way processes and accelerate digital infrastructure deployment has made modular, space-efficient hardware more attractive. Meanwhile, the surge in wireless broadband subscribers totaling over 935 million as of May 2025 has spurred telecom operators to densify their networks with smaller, lighter components where FPCs offer both form-factor flexibility and durability. These converging trends, widespread 5G rollout, miniaturization demands, and soaring subscriber growth create fertile ground for FPC technologies to enhance telecom hardware efficiency and flexibility.
Flexible Printed Circuits in Telecommunications Market- Key Insights
As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 5.5% over the forecast period (2025-2032)
Based on Material segmentation, Polyimide (PI) was predicted to show maximum market share in the year 2024
Based on Layer Count segmentation, the 4-layer was the leading Layer Count in 2024
On the basis of region, Asia-Pacific was the leading revenue generator in 2024
The Global Flexible Printed Circuits in Telecommunications Market is segmented on the basis of Material, Layer Count, Application, and Region.
The market is divided into two categories based on Material: Polyimide (PI), Polyester (PET), and Others. Polyimide (PI) leads due to its heat resistance and durability, making it ideal for 5G and smartphones. Polyester (PET) follows, valued for cost-effectiveness in consumer electronics, while other materials serve niche applications.
The market is divided into five categories based on Layer Count: 2-layer, 4-layer, 6-layer, 8-layer, and More than 8 layers. 4-layer circuits hold the highest priority for balancing performance and cost in telecom devices. 6-layer and 8-layer follow, supporting complex 5G modules, while 2-layer dominates simpler devices. More than 8 layers cater to advanced, high-density applications.
Flexible Printed Circuits in Telecommunications Market- Geographical Insights
Asia-Pacific commands a commanding lead, generating around 77 percent of flexible printed circuit (FPC) revenues in 2023, driven by its dense electronics manufacturing hubs in China, Japan, South Korea, and Taiwan. In response to this dominance, Fujikura Ltd of Japan unveiled a high-performance FPC tailored for 5G and IoT in August 2024, reinforcing its regional technological leadership. Meanwhile, TTM Technologies has strategically broadened its reach through acquisitions: notably, Anaren in 2018, boosting its telecom and high-frequency PCB capabilities, and earlier moves into Asia via Meadville in 2010. North America also shows robust momentum, with rising demand from aerospace, healthcare, EV, and telecom sectors fueling accelerated FPC adoption. Europe is gradually emerging as a steady contributor, supported by increasing investments in 5G rollout and collaborations between telecom operators and electronics firms. Additionally, government-backed initiatives in India and Southeast Asia are accelerating local FPC manufacturing, strengthening the Asia-Pacific's leadership in global supply chains.
The competitive landscape of flexible printed circuits (FPCs) in telecom is shaped by seasoned global firms and dynamic newcomers, each leveraging innovation and partnerships to strengthen their positions. Fujikura Ltd. unveiled a miniaturized, high-performance FPC tailored for 5G and IoT in August 2024, demonstrating strategic product advancement. DuPont and Chi Mei Group's joint venture, Zhen Ding Technology, signed a strategic cooperation in October 2024 to develop cutting-edge printed circuit technology, enhancing high-end manufacturing capacity. Meanwhile, All Flex Solutions expanded its production in February 2024 by investing in a new facility, reflecting increased scale to meet rising demand. Key market players like Nippon Mektron, Sumitomo Electric, Zhen Ding, and FLEXium Interconnect compete fiercely through R&D excellence, customized high-density and rigid-flex FPCs, and global expansion. This blend of product innovation, capacity investment, and collaborations defines a varied, rapidly evolving competitive dynamic.
In July 2025, OKI Circuit Technology introduced new rigid-flex PCBs embedded with copper "coins" to enhance heat dissipation for space applications, specifically tailored for rockets and satellite equipment. Sales are scheduled to begin in August 2025, with a target of ¥20 million in annual FY2026 revenue.
In April 2025, Mektec Corporation, part of the NOK Group, showcased its growing role in flexible printed circuit (FPC) manufacturing, highlighting global expansion and proprietary material development, especially in adhesives, for improved durability and miniaturization across electronics and automotive applications.