Global Semiconductor Packaging Materials Market 2024

The Semiconductor packaging materials market is poised for remarkable growth, projected to surpass USD 40 billion by 2030, with a compelling CAGR of approximately 7% from a value of USD 25 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for packaging materials.

This report provides a deep-dive into the following points in this detailed assessment of semiconductor packaging materials market:

Product Overview

Defining the functions and the key materials used for major semiconductor packaging components:

• Die-attach
• Encapsulants
• Underfills
• Thermal interface material
• Wafer substrate packaging, etc.

Global Semiconductor Packaging Materials Market overview

Insight on current (2022) and forecasted (2030) global market for Semiconductor Packaging Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Polymers, Metals, Ceramics, Composites, etc.

Key Selection criteria or Performance Parameters for material selection including voice of customer on parameters such as Thermal insulation and flexibility

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 20+ companies including DuPont, Henkel, Kyocera, Heraeus, Panasonic, etc.

Patent overview:

Analyzing about 40 patent families by key assignees in the last 4-5 years. Report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.