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PUBLISHER: BCC Research | PRODUCT CODE: 1225599
PUBLISHER: BCC Research | PRODUCT CODE: 1225599
Plastics in Electronics Components: Technologies and Global Markets
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PAGES: 218 Pages
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Highlights:
The global plastics used in electronic components market reached $7.9 billion in 2022 and should reach $10.3 billion by 2027, with a compound annual growth rate (CAGR) of 5.5% during the forecast period of 2022-2027.
Thermoplastic segment of the global plastics used in electronic components market reached $5.6 billion in 2022 and should reach $7.5 billion by 2027, with a CAGR of 6% during the forecast period of 2022-2027.
Thermoset segment of the global plastics used in electronic components market reached $2.2 billion in 2022 and should reach $2.7 billion by 2027, with a CAGR of 4.2% during the forecast period of 2022-2027.
Report Scope:
This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding compression molding, and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures. The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.
Report Includes:
- 61 data tables and 23 additional tables
- An overview of the global markets and technologies for plastics in electronics components
- Analyses of the global market trends, with data for 2022, 2023 and projections of compound annual growth rates (CAGRs) through 2028
- Estimation of the market size and revenue forecast for plastics in electronics components, and market share analysis by type, end-user, and region
- Highlights of the market opportunities, and major issues and trends affecting the plastic industry
- Insight into the recent industry structure, regulations and policies, pipeline products, and the vendor landscape of the market leading participants
- Company profiles of major players within the industry, including BASF, Covestro AG, Henkel AG, Mitsubishi Engineering-Plastics Corp., and SABIC
Product Code: PLS027F
Table of Contents
Chapter 1 Introduction
- 1.1 Study Goals and Objectives
- 1.2 Reasons for Doing This Study
- 1.3 Scope of Report
- 1.4 What's New in This Report?
- 1.5 Information Sources
- 1.6 Methodology
- 1.7 Geographic Breakdown
- 1.8 Analyst's Credentials
- 1.9 BCC Custom Research
- 1.10 Related BCC Research Reports
Chapter 2 Summary and Highlights
Chapter 3 Market and Technology Background
- 3.1 Overview
- 3.2 Snapshot of the Electronic Device Market
- 3.3 Computers
- 3.3.1 Overview
- 3.3.2 Desktops
- 3.4 Electronic Displays
- 3.4.1 Background
- 3.5 Printers
- 3.5.1 Overview
- 3.5.2 Inkjet Printers
- 3.5.3 Monochrome Laser Printers
- 3.5.4 Color Laser Printers
- 3.5.5 Manufacturers
- 3.6 "All-in-One" Machines
- 3.7 Phones
- 3.7.1 Corded
- 3.7.2 Cordless
- 3.8 Fax Machines
- 3.9 Scanners
- 3.10 Mobile Electronics Devices
- 3.10.1 Phones
- 3.10.2 Laptops/Notebooks/Netbooks
- 3.10.3 Tablets
- 3.10.4 E-Readers
- 3.10.5 Portable Music Players
- 3.11 Automotive Market
- 3.11.1 Overview
- 3.11.2 Electric Cars
- 3.11.3 CAFE Issues
- 3.11.4 Overview of Electronic Components in Automotive Products
- 3.11.5 Flexible Circuitry in Automotive Applications
Chapter 4 Market Breakdown by Technology Type
- 4.1 Overview
- 4.2 Types of Polymers
- 4.3 Thermoplastics
- 4.3.1 Standard Nylons
- 4.3.2 Thermoplastic Polymers
- 4.3.3 Polyphenylene Sulfide
- 4.3.4 Polyimides
- 4.3.5 Polycarbonates
- 4.3.6 Polyphthalamides and Other High-Temperature Nylons
- 4.3.7 Liquid Crystal Polymers
- 4.3.8 Sulfone Polymers
- 4.3.9 Alloys/Blends
- 4.3.10 Fluoropolymers
- 4.3.11 Polyaryletherketones
- 4.3.12 Cyclic Olefin Copolymers
- 4.3.13 Thermoplastic Market Estimates and Forecasts Summary
- 4.4 Thermoset Polymers
- 4.4.1 Overview
- 4.4.2 General Properties
- 4.4.3 Epoxy Resins
- 4.4.4 Polyurethanes
- 4.4.5 Phenolics
- 4.4.6 Unsaturated Polyesters
- 4.4.7 Diallyl Phthalate
- 4.4.8 BT-Epoxy Resins and Cyanate Esters
- 4.4.9 Thermoset Market Estimates and Forecasts Summary
Chapter 5 Overview of Key Components, PCBs and Encapsulants
- 5.1 Introduction
- 5.2 The Focus of This Report
- 5.3 Resin Consumption
- 5.3.1 Background
- 5.3.2 Markets
- 5.3.3 Growth
- 5.3.4 Market Drivers
- 5.4 Printed Circuit Boards
- 5.4.1 Overview
- 5.4.2 Property Requirements for Laminates
- 5.4.3 Physical Composition
- 5.4.4 Assembly Technologies
- 5.4.5 PCB Substrates
- 5.4.6 Specific Polymers Used in Printed Circuit Boards
- 5.4.7 Other Materials Used in Printed Circuit Boards
- 5.4.8 Fiber Reinforcements
- 5.4.9 Production of Circuitry
- 5.4.10 Environmental Issues
- 5.4.11 Flexible Printed Circuit Boards
- 5.4.12 Soldering
- 5.4.13 Production Statistics
- 5.4.14 Industry Trends
- 5.4.15 Electronics Packaging
- 5.4.16 Market Estimates and Forecasts
- 5.5 Encapsulants
- 5.5.1 Definitions and Background
- 5.5.2 Primary Purposes of Encapsulation
- 5.5.3 Encapsulant Materials
- 5.5.4 Epoxy Encapsulation Formulations
- 5.5.5 Encapsulated Electrical and Electronic Components
- 5.5.6 Epoxy Encapsulant Systems
- 5.5.7 Silicone Encapsulants
- 5.5.8 Thermoplastic Encapsulants
- 5.5.9 Selected Major Encapsulant Producers and Their Product Lines
- 5.5.10 Market Estimates and Forecasts
Chapter 6 Molded Electronic Products
- 6.1 Overview
- 6.1.1 Background
- 6.1.2 Polymers Used
- 6.1.3 Market Drivers
- 6.2 Connectors
- 6.2.1 Background
- 6.2.2 Functions and Components of Connectors
- 6.2.3 Trends
- 6.2.4 Applications for Electronic Connectors
- 6.2.5 Material Selection
- 6.2.6 Flame Retardance
- 6.2.7 Standards Relating to Connectors
- 6.2.8 Manufacturers
- 6.2.9 End-Use Markets
- 6.2.10 Market Estimates and Forecasts
- 6.3 Switches
- 6.3.1 Background
- 6.3.2 Market Estimates and Forecasts
- 6.4 Coil Formers
- 6.4.1 Background
- 6.4.2 Manufacturers
- 6.4.3 Market Estimates and Forecasts
- 6.5 Relays
- 6.5.1 Background
- 6.5.2 Market Estimates and Forecasts
- 6.6 Capacitors
- 6.6.1 Background
- 6.6.2 Applications
- 6.6.3 Capacitor Materials
- 6.6.4 Consumption by Market Segment
- 6.6.5 Market Estimates and Forecasts
- 6.7 Other Types of Molded Electronic Components
- 6.7.1 Resistors
- 6.7.2 Market Estimates and Forecasts
- 6.8 Summary of Market Estimates and Forecasts
Chapter 7 New Developments
- 7.1 Background
- 7.2 Importance of Miniaturization
- 7.2.1 High-density Interconnect Technology to Drive Market for PCB
- 7.3 Thin-Walling Electronic Components
- 7.3.1 Background
- 7.3.2 Effects of Thin-Walling on Performance Requirements and Design
- 7.3.3 Application Requirements
- 7.3.4 Material and Process Selection
- 7.3.5 Properties Required
- 7.3.6 Challenges in Downsizing
- 7.3.7 Software that Aids Thin-wall Design
- 7.4 Flexible Electronics
- 7.4.1 Overview
- 7.5 Wearable Electronics
- 7.6 Cloud Computing and Big Data
- 7.7 The Internet of Everything
- 7.8 Changes in Electronics Component Manufacturing That Could Influence Resin Choices
- 7.9 Recent Patents Related to the Industry
Chapter 8 Electronic Component Industry Overview and Plastics Producers
- 8.1 Top Semiconductor Producers and Customers
- 8.2 Manufacturing and Marketing Aspects
- 8.2.1 Globalization
- 8.2.2 What Component Suppliers Are Doing
- 8.3 Plastics Producers
- 8.3.1 Overview
- 8.4 Polymer Producers According to Material Type
- 8.4.1 Thermosets
- 8.4.2 Thermoplastics
Chapter 9 Environmental Issues
- 9.1 Overview
- 9.2 Printed Circuit Board Disposal
- 9.3 Bromine-Free Printed Circuit Boards
- 9.4 Halogen-Free Flame Retardants for Thermoplastics
- 9.5 Recycling
- 9.6 Electronics Industry Interface
- 9.6.1 Overview
- 9.6.2 Reasons for Increased Environmental Regulations for Electronics Equipment
- 9.6.3 The European Union RoHS Directive
- 9.6.4 The European Union WEEE Directive
- 9.6.5 EPEAT
Chapter 10 Performance Requirements Related to Electronic Components
- 10.1 Overview
- 10.2 Flammability Standards
- 10.2.1 Definitions
- 10.3 Flammability Tests
- 10.3.1 Overview
- 10.3.2 UL 94
- 10.3.3 Glow-Wire Flammability Index - IEC 60695
- 10.3.4 UL 1694
- 10.3.5 UL 746C
- 10.4 Other Standards
- 10.4.1 UL 1446
- 10.4.2 UL 1950
Chapter 11 Competitive Landscape
- 11.1 Overview
- 11.2 Big Brands Engineer the Potential of Thermoplastics
- 11.3 Key Developments
- 11.3.1 Important News Pertaining to the Market for Plastics in Electronic Components
Chapter 12 Company Profiles
- ASAHI KASEI CORP.
- ASHLAND INC.
- BASF
- CELANESE
- COVESTRO AG
- CYTEC INDUSTRIES INC.
- DSM
- DUPONT DE NEMOURS AND CO.
- EMS GRIVORY
- EPIC RESINS
- HENKEL AG
- HUNTSMAN INTERNATIONAL LLC
- INTERPLASTIC CORP.
- KINGFA SCIENCE AND TECHNOLOGY CO. LTD.
- LANXESS AG
- MITSUBISHI ENGINEERING-PLASTICS CORP.
- POLYPLASTICS
- SABIC INNOVATIVE PLASTICS
- SOLVAY SPECIALTY POLYMERS
- SUMITOMO BAKELITE
- TORAY PLASTICS
- VICTREX PLC
Chapter 13 Appendix: Acronyms
Product Code: PLS027F
List of Tables
- Summary Table : Global Market for Plastics Used in Electronic Components, by Type of Polymer, Through 2027
- Table 1 : Examples of Standard Nylons Used to Mold Electronic Components, by Trade Name
- Table 2 : Global Market for Standard Nylon Electronic Components, by Application, Through 2027
- Table 3 : Examples of Polybutylene Terephthalates Used to Mold Electronic Components, by Trade Name
- Table 4 : Global Market for PBT Electronic Components, by Application, Through 2027
- Table 5 : Global Market for PET/PCT Electronic Components, by Application, Through 2027
- Table 6 : Examples of Polyphenylene Sulfide and Polyphenylene Sulfide Blends Used to Mold Electronic Components, by Trade Name
- Table 7 : Global Market for Polyphenylene Sulfide Electronic Components, by Application, Through 2027
- Table 8 : Global Market for Polyimide* Electronic Components, by Application, Through 2027
- Table 9 : Examples of Polycarbonates Used to Mold Electronic Components, by Trade Name
- Table 10 : Global Market for Polycarbonate Electronic Components, by Application, Through 2027
- Table 11 : Examples of Polyphthalamide Polymers used to Mold Electronic Components, by Trade Name
- Table 12 : Global Market for Polyphthalamides and High-Temperature Nylon Electronic Components, by Application, Through 2027
- Table 13 : Examples of Liquid Crystal Polymers Used to Mold Electronic Components, by Trade Name
- Table 14 : Global Market for Liquid Crystal Polymer Electronic Components, by Application, Through 2027
- Table 15 : Global Market for Sulfone Polymer Electronic Components, by Application, Through 2027
- Table 16 : Global Market for Polymer Alloy/Blend Electronic Components, by Application, Through 2027
- Table 17 : Global Market for Fluoropolymer Electronic Components, by Application, Through 2027
- Table 18 : Examples of PAEK Used to Mold Electronic Components, by Trade Name
- Table 19 : Global Market for Polyaryletherketone Electronic Components, by Application, Through 2027
- Table 20 : Global Market for Thermoplastic Electronic Components, by Type, Through 2027
- Table 21 : Thermoset Properties and Manufacturing Processes
- Table 22 : Examples of Epoxy Resins Used for Electronic Components, by Trade Name
- Table 23 : Global Market for Epoxy Resin Electronic Components, by Application, Through 2027
- Table 24 : Examples of Polyurethane Systems Used for Electronic Components, by Trade Name
- Table 25 : Global Market for Polyurethane Electronic Components, by Application, Through 2027
- Table 26 : Examples of Phenolics Used for Electronic Components, by Trade Name
- Table 27 : Global Market for Phenolic Electronic Components, by Application, Through 2027
- Table 28 : Examples of Unsaturated Polyester and Vinyl Ester and Compounds Used for Electronic Components, by Trade Name
- Table 29 : Global Market for Unsaturated Polyester Electronic Components, by Application, Through 2027
- Table 30 : Global Market for Diallyl Phthalate Electronic Components, by Application, Through 2027
- Table 31 : Global Market for Thermoset Electronic Components, by Type, Through 2027
- Table 32 : Important Technical Factors to Consider When Selecting Printed Circuit Board Substrate Materials
- Table 33 : Comparison between Rigid and Flexible Circuit Boards
- Table 34 : Major Producers of Rigid and Flexible Circuit Boards
- Table 35 : Polymers Suitable for Production of 3D-MIDs Using LDS Technology
- Table 36 : Advantages and Disadvantages of LDS and Two-component Molding for 3D-MIDs
- Table 37 : Global Market for PCB, by Polymer Type, Through 2027
- Table 38 : Global Market for PCB*, by Thermoplastic Type, Through 2027
- Table 39 : Global Market for PCB, by Thermoset Type, Through 2027
- Table 40 : Types of Encapsulant Materials-Advantages and Disadvantages
- Table 41 : Epoxy Encapsulant Formulations
- Table 42 : Global Market for Encapsulants, by Polymer Type, Through 2027
- Table 43 : Global Market for Encapsulants, by Thermoplastic Type, Through 2027
- Table 44 : Global Market for Encapsulants, by Thermoset Type, Through 2027
- Table 45 : Major Manufacturers of Electronic Connectors
- Table 46 : Global Market for Electronic Connectors, by Polymer Type, Through 2027
- Table 47 : Global Market for Electronic Connectors, by Thermoplastic Type, Through 2027
- Table 48 : Global Market for Electronic Connectors, by Thermoset Type, Through 2027
- Table 49 : Global Market for Electronic Switches, by Polymer Type, Through 2027
- Table 50 : Global Market for Electronic Switches, by Thermoplastic Type, Through 2027
- Table 51 : Global Market for Electronic Switches, by Thermoset Type, Through 2027
- Table 52 : Selected Manufacturers Molding Coil Formers for Electronics Applications
- Table 53 : Global Market for Electronic Coil Formers, by Polymer Type, Through 2027
- Table 54 : Global Market for Electronic Coil Formers, by Thermoplastic Type, Through 2027
- Table 55 : Global Market for Electronic Coil Formers, by Thermoset Type, Through 2027
- Table 56 : Global Market for Electronic Relays, by Polymer Type, Through 2027
- Table 57 : Global Market for Electronic Relays, by Thermoplastic Type, Through 2027
- Table 58 : Global Market for Electronic Relays, by Thermoset Type, Through 2027
- Table 59 : Global Market for Electronic Capacitors, by Thermoplastic Type, Through 2027
- Table 60 : Global Market for Other Types of Electronic Components, by Polymer Type, Through 2027
- Table 61 : Global Market for Other Types of Electronic Components, by Thermoplastic Type, Through 2027
- Table 62 : Global Market for Other Types of Electronic Components, by Thermoset Type, Through 2027
- Table 63 : Global Market for Electronic Components, by Application, Through 2027
- Table 64 : Global Market for Thermoplastic Electronic Components, by Application, Through 2027
- Table 65 : Global Market for Thermoset Electronic Components, by Application, Through 2027
- Table 66 : Top Global Semiconductor Producer Companies, 2020
- Table 67 : Trade Names of Selected Plastics Used in Electronic Components
- Table 68 : Developments in the Market for Plastics in Electronic Components, 2020-2022
- Table 69 : Asahi Kasei Corp.: Financials, 2020 and 2021
- Table 70 : BASF: Financials, 2020 and 2021
- Table 71 : Celanese: Financials, 2020 and 2021
- Table 72 : Covestro AG: Financials, 2020 and 2021
- Table 73 : DSM: Financials, 2020 and 2021
- Table 74 : DuPont: Financials, 2020 and 2021
- Table 75 : EMS Group: Financials, 2020 and 2021
- Table 76 : Henkel AG: Financials, 2020 and 2021
- Table 77 : Huntsman International LLC.: Financials, 2020 and 2021
- Table 78 : Lanxess AG: Financials, 2020 and 2021
- Table 79 : Mitsubishi Engineering-Plastics Corp.: Financials, 2021 and 2022
- Table 80 : SABIC: Financials, 2020 and 2021
- Table 81 : Solvay: Financials, 2020 and 2021
- Table 82 : Toray Plastics: Financials, 2020 and 2021
- Table 83 : Victrex plc: Financials, 2020 and 2021
List of Figures
- Summary Figure : Global Market for Plastics Used in Electronic Components, by Type of Polymer, 2021-2027
- Figure 1 : Key Developments
- Figure 2 : Asahi Kasei Corp.: Global Sales Share, by Segment, 2021
- Figure 3 : Asahi Kasei Corp.: Global Sales Share, by Country/Region, 2021
- Figure 4 : BASF: Global Sales Share, by Segment, 2021
- Figure 5 : BASF: Global Sales Share, by Region, 2021
- Figure 6 : Celanese: Global Sales Share, by Segment, 2021
- Figure 7 : Celanese: Global Sales Share, by Country/Region, 2021
- Figure 8 : Covestro AG: Global Sales Share, by Segment, 2021
- Figure 9 : Covestro AG: Global Sales Share, by Country/Region, 2021
- Figure 10 : DuPont: Global Sales Share, by Segment, 2021
- Figure 11 : DuPont: Global Sales Share, by Country/Region, 2021
- Figure 12 : EMS Group: Global Sales Share, by Segment, 2021
- Figure 13 : EMS Group: Global Sales Share, by Region, 2021
- Figure 14 : Henkel AG: Global Sales Share, by Segment, 2021
- Figure 15 : Henkel AG: Global Sales Share, by Region, 2021
- Figure 16 : Huntsman International LLC.: Global Sales Share, by Segment, 2021
- Figure 17 : Huntsman International LLC.: Global Sales Share, by Region, 2021
- Figure 18 : Lanxess AG: Global Sales Share, by Segment, 2021
- Figure 19 : Lanxess AG: Global Sales Share, by Country/Region, 2021
- Figure 20 : Mitsubishi Engineering-Plastics Corp.: Global Sales Share, by Country/Region, 2022
- Figure 21 : SABIC: Global Sales Share, by Segment, 2021
- Figure 22 : SABIC: Global Sales Share, by Country/Region, 2021
- Figure 23 : Solvay: Global Sales Share, by Segment, 2021
- Figure 24 : Solvay: Global Sales Share, by Region, 2021
- Figure 25 : Toray Plastics: Global Sales Share, by Segment, 2021
- Figure 26 : Victrex plc: Global Sales Share, by Segment, 2021
- Figure 27 : Victrex plc: Global Sales Share, by Region, 2021
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