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Semiconductor Manufacturing & Equipment

PUBLISHER: Future Markets, Inc. | PRODUCT CODE: 1826005

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PUBLISHER: Future Markets, Inc. | PRODUCT CODE: 1826005

The Global Market for Glass Substrates for Semiconductors 2026-2036

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PAGES: 337 Pages, 93 Tables, 29 Figures
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Table of Contents

List of Tables

The global market for glass substrates in semiconductor applications is experiencing a critical inflection point as the technology transitions from research and development to commercial production, driven by insatiable demand for advanced packaging solutions in AI, high-performance computing, and next-generation communications. The glass substrate market addresses fundamental limitations of organic substrates while offering cost and scalability advantages over silicon interposers.

Glass substrates replace organic cores in advanced chip packages, providing superior dimensional stability, lower dielectric loss, and larger format capabilities essential for multi-chiplet architectures. The technology enables manufacturers to achieve sub-2micrometer redistribution layer geometries, supporting massive I/O counts (10,000-50,000 per package) while maintaining thermal and electrical performance across extreme temperature ranges (-40degree-C to 150degree-C). Key advantages include 40% performance improvements in signal integrity, 50% power consumption reduction, and exceptional flatness (<20micrometer warpage across 100mm packages) compared to organic alternatives that suffer dimensional instability beyond 55mm.

Through-glass via (TGV) technology represents the critical enabler, with multiple formation approaches competing: laser-induced deep etching (LIDE) combining laser modification with wet etching, direct laser ablation, and photosensitive glass methods. Recent demonstrations show 6micrometer diameter vias with aspect ratios exceeding 15:1, enabling high-density vertical interconnection supporting panel-scale processing from display industry heritage.

The market exhibits sophisticated segmentation across application domains. AI and high-performance computing represent the largest near-term opportunity, with glass substrates enabling 60-80mm packages integrating 8-16 chiplets with HBM memory stacks-architectures impossible with warped organic substrates. Data center switches requiring 51.2-102.4 Tbps aggregate bandwidth increasingly adopt co-packaged optics (CPO) architectures that leverage glass transparency for integrated optical waveguides alongside electrical interconnection.

Telecommunications infrastructure, particularly 5G massive MIMO and emerging 6G systems operating at 100-300 GHz frequencies, represents another compelling segment where organic substrates' electrical losses render them inadequate. Automotive applications, especially 77-81 GHz radar for ADAS and autonomous driving platforms, benefit from glass's phase stability maintaining beam coherence across temperature extremes. Consumer electronics adoption concentrates in premium segments-5G millimeter-wave smartphones, AR/VR headsets, and gaming systems-where performance differentiation justifies cost premiums during early commercialization. Major technology companies including Apple, Tesla, AMD, and Amazon AWS are conducting qualification testing, with Samsung Electronics planning glass substrate interposer adoption by 2028 and operating pilot lines at Sejong facilities.

Intel's strategic pivot from internal production to licensing its extensive patent portfolio (600+ glass substrate patents) could accelerate industry-wide commercialization by enabling latecomers to advance development more rapidly. Samsung Electro-Mechanics targets first prototypes by Q2 2025, while LG Innotek builds Gumi pilot lines aiming for year-end prototype production. Glass material suppliers including AGC, Corning, SCHOTT, and Nippon Electric Glass provide substrate-grade compositions optimized for CTE matching and low dielectric loss.

Despite compelling advantages, glass substrates face significant adoption barriers: current costs run 2-3x organic equivalents, manufacturing yields remain at 75-85% versus organic substrates' 90-95%, and supply chain concentration creates single-source dependencies. Brittleness requires specialized handling automation, while TGV formation and fine-pitch RDL processes demand continued optimization. Customer qualification cycles spanning 18-36 months delay market entry, particularly in conservative industries like automotive and telecommunications.

However, aggressive cost reduction roadmaps project 40-60% declines by 2030 through manufacturing scale, yield improvements, and competitive supply emergence. As processes mature and ecosystem infrastructure develops-design tools, standards, contract manufacturing services-glass substrates are positioned to capture 20-30% of advanced packaging market by 2036, with deployment timelines accelerating as major technology companies validate commercial viability through pilot programs transitioning to volume production in 2027-2030 timeframe.

"The Global Market for Glass Substrates for Semiconductors 2026-2036" delivers comprehensive analysis of this transformative advanced packaging technology poised to revolutionize semiconductor manufacturing. As AI accelerators, 5G/6G infrastructure, and autonomous vehicles demand unprecedented integration density and electrical performance, glass substrates emerge as the critical enabling platform displacing conventional organic substrates and challenging silicon interposers across high-performance applications.

Report Contents include:

  • Comprehensive market overview with global forecasts 2026-2036 (revenue and volume)
  • Glass materials fundamentals and applications across semiconductor packaging
  • Technology drivers: dimensional stability, low dielectric loss, panel-scale processing
  • Supply chain evolution from pilot production to mainstream adoption
  • Application segment analysis: advanced packaging, photonic integration, high-frequency RF
  • Competitive landscape assessment covering 37+ companies
  • Technical challenges and risk mitigation strategies
  • Investment outlook and adoption scenarios
  • Detailed unit shipment and market value forecasts by product category (carriers, core substrates, interposers)
  • Glass Substrates Technology Fundamentals
    • Material properties: borosilicate, quartz, specialty compositions with comparison matrices
    • Manufacturing processes: glass forming, TGV formation methods, metallization, panel-level processing
    • Design considerations: thermal management, mechanical stress analysis, electrical performance optimization
  • Glass in Advanced Packaging and IC Substrates
    • Advanced packaging evolution from 1D through 4D integration architectures
    • Intel's advanced packaging roadmap and heterogeneous integration solutions
    • Glass IC substrates evolution and organic-to-glass transition pathway
    • Through-glass via technology comprehensive analysis with vendor-specific approaches
    • TGV metallization processes and comparison matrices
    • Material properties and I/O density advantages
    • Traditional substrate limitations driving glass adoption
    • Glass substrate manufacturing processes including CHIMES innovations
    • Intel's glass production line capabilities
  • Glass in Photonics
    • Photonic integration overview and optical coupling strategies
    • Co-packaged optics (CPO) comprehensive analysis and architecture options
    • Glass waveguide technologies: ion exchange, fiber coupling, signal routing
    • Corning's 102.4 Tb/s platform and 3D integration demonstrations
  • Glass in High-Frequency Applications
    • High-frequency material requirements and transmission loss analysis
    • Material benchmarking: LTCC versus glass comparisons
    • Glass suppliers and products directory
    • RF applications: filters, IPD, antenna-in-package for 5G/6G
  • Technology Benchmarking and Comparison
    • Glass versus organic substrates: performance, cost, manufacturing, application suitability
    • Glass versus silicon interposers: technical metrics, economics, scalability
    • Hybrid substrates analysis and cost-performance trade-offs
    • Future technology roadmaps: materials, processes, integration complexity, performance projections
  • End-User Market Analysis
    • AI and high-performance computing: market sizing, requirements, key players, development trends
    • Data centers and cloud computing: infrastructure demands, adoption patterns, opportunity assessment
    • Telecommunications and 5G/6G: network evolution, RF requirements, integration challenges
    • Automotive electronics: ADAS, electric vehicles, autonomous platforms, reliability requirements
    • Consumer electronics: mobile devices, wearables, gaming systems
  • Challenges and Opportunities
    • Technical challenges: manufacturing maturity, yield issues, design complexity, standardization
    • Economic challenges: cost competitiveness, investment requirements, customer adoption barriers
    • Strategic opportunities: performance differentiation, new applications, technology convergence
  • Future Outlook
    • Technology evolution projections: next-generation materials, advanced manufacturing, integration advances
    • Performance enhancement roadmap through 2036
    • Market development scenarios: optimistic, conservative, and disruptive technology impacts
  • 37 detailed company profiles spanning entire value chain with technology positioning, products, capabilities, and strategy including Absolics (SKC subsidiary), Intel Corporation, Samsung Electro-Mechanics (Semco), LG Innotek, AGC Inc., Corning Incorporated, SCHOTT AG, Nippon Electric Glass (NEG), LPKF Laser & Electronics, Applied Materials, Onto Innovation, AMD, NVIDIA, TSMC, Ibiden, Shinko, Unimicron Technology Corporation, AT&S Austria Technologie & Systemtechnik AG, Toppan, Advanced Semiconductor Engineering (ASE), Plan Optik AG, JNTC Co. Ltd., KCC Corporation, RENA Technologies GmbH, Philoptics, Samtec Inc., BOE, Chengdu ECHINT, Guangdong Fozhixin Microelectronics, Sky Semiconductor, WG Tech, Ajinomoto Co. Inc., DNP (Dai Nippon Printing), Alliance Material, 3D CHIPS, 3D Glass Solutions (3DGS), and Sumitomo Electric Industries Ltd. Each profile examines corporate strategy, technology positioning, product offerings, manufacturing capabilities, and competitive advantages within the rapidly evolving glass substrate ecosystem.
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TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. Glass Materials Overview
  • 1.2. Applications of Glass in Semiconductors
  • 1.3. Glass for Advanced Packaging
  • 1.4. Technological Drivers and Material Advantages
  • 1.5. Supply Chain Evolution and Manufacturing Readiness
  • 1.6. Application Segments and Market Dynamics
    • 1.6.1. Advanced Packaging and IC Substrates
    • 1.6.2. Photonic Integration
    • 1.6.3. High-Frequency Applications
  • 1.7. Competitive Landscape and Strategic Positioning
  • 1.8. Technical Challenges and Risk Factors
  • 1.9. Investment and Adoption Outlook
  • 1.10. Glass Used in Various Semiconductor Applications
  • 1.11. Opportunities with Glass Packaging
  • 1.12. Advantages of Glass Substrates
  • 1.13. Challenges in Adopting Glass Substrates
  • 1.14. Future Market Trends
    • 1.14.1. Advanced Processing Technologies
    • 1.14.2. Integrated Packaging Solutions & Sustainable Manufacturing Initiatives
  • 1.15. Value Chain of Glass Substrate
    • 1.15.1. Organic to Glass Core Substrate
  • 1.16. Future Outlook
  • 1.17. Material Innovations
  • 1.18. Global Market Forecasts 2025-2036
    • 1.18.1. Unit Shipment Forecast 2025-2036
      • 1.18.1.1. Glass Carrier Shipments
      • 1.18.1.2. Glass Core Substrate Shipments
      • 1.18.1.3. Glass Interposer Shipments
    • 1.18.2. Market Value Forecast 2025-2036
      • 1.18.2.1. Glass Carrier Market Value
      • 1.18.2.2. Glass Core Substrate Market Value
      • 1.18.2.3. Glass Interposer Market Value

2. GLASS SUBSTRATES TECHNOLOGY FUNDAMENTALS

  • 2.1. Glass Materials Properties
    • 2.1.1. Borosilicate Glass Characteristics
    • 2.1.2. Quartz Glass Properties
    • 2.1.3. Specialty Glass Compositions
  • 2.2. Manufacturing Processes
    • 2.2.1. Glass Melting and Forming
    • 2.2.2. Through Glass Via (TGV) Formation
    • 2.2.3. Metallization and Build-up Processes
    • 2.2.4. Panel-Level Processing Technologies
  • 2.3. Design and Process Considerations
    • 2.3.1. Thermal Management
    • 2.3.2. Mechanical Stress Analysis
    • 2.3.3. Electrical Performance Optimization

3. GLASS IN ADVANCED PACKAGING AND IC SUBSTRATES

  • 3.1. Advanced Packaging Evolution
    • 3.1.1. Dimensionality of Advanced Packaging
    • 3.1.2. From 1D Semiconductor Packaging
    • 3.1.3. Advanced Packaging 2D & 2D+
    • 3.1.4. Advanced Packaging 2.5D & 3D
    • 3.1.5. Advanced Packaging 3.5D & 4D
    • 3.1.6. Technology Development Trend for 2.5D and 3D Packaging
  • 3.2. Packaging Architecture and Integration
    • 3.2.1. Intel's Advanced Packaging Roadmap
    • 3.2.2. Heterogeneous Integration Solutions
    • 3.2.3. Overview of System on Chip (SOC)
    • 3.2.4. Overview of Multi-Chip Module (MCM)
    • 3.2.5. System in Package (SiP)
  • 3.3. Glass IC Substrates Evolution
    • 3.3.1. Glass IC Substrates
    • 3.3.2. From Organic to Glass Core Substrate
    • 3.3.3. Evolution of Packaging Substrates in Semiconductors
    • 3.3.4. Organic Core Substrate vs. Glass Core Substrate
  • 3.4. Through Glass Via Technology
    • 3.4.1. TSV vs. TGV
    • 3.4.2. Through Glass Via Formation
    • 3.4.3. Comparison of Through Glass Via Formation Processes
    • 3.4.4. TGV Process and Via Formation Methods
    • 3.4.5. Mechanical and High-Power Laser Drilling
    • 3.4.6. Laser-Induced Deep Etching
    • 3.4.7. LMCE from BSP
    • 3.4.8. Philoptics' TGV Technology
    • 3.4.9. Laser-Induced Modification and Advanced Wet Etching
    • 3.4.10. Photosensitive Glass and Wet Etching
    • 3.4.11. Samtec's TGV Technology
    • 3.4.12. TGV of High Aspect Ratio
  • 3.5. TGV Metallization and Processing
    • 3.5.1. TGV Metallization
    • 3.5.2. Two-Step Process
    • 3.5.3. Seed Layer Deposition in TGV Metallization
  • 3.6. Material Properties and Performance
    • 3.6.1. Material Property Comparison for Advanced Packaging
    • 3.6.2. Key Mechanical and Reliability Benefits of Glass
    • 3.6.3. I/O Density
    • 3.6.4. Key Factors Enabling Fine Circuit Patterns on Glass Substrates
    • 3.6.5. Fine Circuit Patterning Reduces DoF
    • 3.6.6. FC-BGA Substrates Lead to Larger Distortions
  • 3.7. Traditional Substrate Limitations
    • 3.7.1. Limitations of Via Formation
    • 3.7.2. SAP Method Limitations
    • 3.7.3. PCB Stack-ups
    • 3.7.4. Traditional Multilayer vs. Build-up PCBs
    • 3.7.5. Build-up Material: ABF
    • 3.7.6. Flip Chip Ball Grid Array (FC-BGA) Substrate
  • 3.8. Glass Core Substrate Technologies
  • 3.9. Glass Substrate Manufacturing
    • 3.9.1. Glass Substrate Manufacturing
    • 3.9.2. Core Layer Fabrication
    • 3.9.3. Build-up Layer Fabrication
    • 3.9.4. Manufacturing Process of Glass Substrate (CHIMES)
    • 3.9.5. Achieving 2/2 micrometer L/S on Glass Substrate
  • 3.10. Advanced Manufacturing Processes
    • 3.10.1. Intel's Glass Line
  • 3.11. Industry Implementation and Innovation
    • 3.11.1. Features of Glass-based Advanced Packaging and IC Substrates
    • 3.11.2. Advanced Thermal Management for Glass Packages
    • 3.11.3. Glass Innovation

4. GLASS IN PHOTONICS

  • 4.1. Photonic Integration
    • 4.1.1. Overview
    • 4.1.2. Optical Coupling - I/O
    • 4.1.3. EIC/PIC Integration
  • 4.2. Co-Packaged Optics
    • 4.2.1. Co-Packaged Optics
    • 4.2.2. Key Trend of Optical Transceiver
    • 4.2.3. Glass-Based CPO Integration
  • 4.3. Glass Waveguide Technologies
    • 4.3.1. Ion Exchange Waveguide Formation Technology
    • 4.3.2. Adiabatic Glass-to-Silicon Waveguide Coupling for CPO Integration
    • 4.3.3. Glass-Based Fiber Connector Assembly for CPO Applications
  • 4.4. Manufacturing and Integration Processes
    • 4.4.1. Glass Interposer Manufacturing Process and Laser Separation Technology
    • 4.4.2. Corning's High-Density 102.4 Tb/s Glass Integration Platform
    • 4.4.3. 3D Integration of EIC/PIC with a Glass Interposer
    • 4.4.4. 3D Integration of EIC, PIC, ASIC on a Co-Packaged Glass Substrate
    • 4.4.5. Fabrication Process of the 3D Integration of ASIC, EIC, PIC on a Co-Packaged Substrate
    • 4.4.6. Advancements in Glass Integration for Photonics

5. GLASS IN HIGH-FREQUENCY APPLICATIONS

  • 5.1. High-Frequency Material Requirements
    • 5.1.1. Applications of Low-Loss Materials in Semiconductor and Electronics Packaging
    • 5.1.2. Transmission Loss in High-Frequency PCB Design
    • 5.1.3. Glass as a Low-Loss Material
  • 5.2. Material Benchmarking and Performance
    • 5.2.1. Benchmark of LTCC and Glass Materials
    • 5.2.2. Dielectric Constant: Stability vs Frequency for Different Inorganic Substrates (LTCC, Glass)
    • 5.2.3. Benchmarking of Commercial Low-Loss Materials for 5G PCBs/Components
  • 5.3. Glass Suppliers and Products
  • 5.4. RF Applications and Implementations
    • 5.4.1. Glass as a Filter Substrate
    • 5.4.2. Glass Integrated Passive Devices (IPD) Filter for 5G by Advanced Semiconductor Engineering
    • 5.4.3. Glass Substrate AiP for 5G
    • 5.4.4. Glass for 6G
    • 5.4.5. Glass Interposers for 6G

6. TECHNOLOGY BENCHMARKING AND COMPARISON

  • 6.1. Glass vs Organic Substrates
    • 6.1.1. Performance Comparison
    • 6.1.2. Cost Analysis
    • 6.1.3. Manufacturing Considerations
    • 6.1.4. Application Suitability
  • 6.2. Glass vs Silicon Interposers
    • 6.2.1. Technical Performance Metrics
    • 6.2.2. Economic Comparison
    • 6.2.3. Scalability Assessment
  • 6.3. Hybrid Substrates
    • 6.3.1. Glass-Organic Hybrid Designs
    • 6.3.2. Multi-Material Integration
    • 6.3.3. Performance Optimization
    • 6.3.4. Cost-Performance Trade-offs
  • 6.4. Future Technology Roadmaps
    • 6.4.1. Material Innovation Trends
    • 6.4.2. Process Technology Evolution
    • 6.4.3. Integration Complexity Growth
    • 6.4.4. Performance Projection Models

7. END-USER MARKET ANALYSIS

  • 7.1. AI and High-Performance Computing
    • 7.1.1. Market Size and Growth Drivers
    • 7.1.2. Technology Requirements
    • 7.1.3. Key Players and Products
    • 7.1.4. Future Development Trends
  • 7.2. Data Centers and Cloud Computing
    • 7.2.1. Infrastructure Scaling Demands
    • 7.2.2. Performance and Efficiency Requirements
    • 7.2.3. Technology Adoption Patterns
    • 7.2.4. Market Opportunity Assessment
  • 7.3. Telecommunications and 5G/6G
    • 7.3.1. Network Infrastructure Evolution
    • 7.3.2. RF Component Requirements
    • 7.3.3. Technology Integration Challenges
  • 7.4. Automotive Electronics
    • 7.4.1. Advanced Driver Assistance Systems
    • 7.4.2. Electric Vehicle Electronics
    • 7.4.3. Autonomous Driving Platforms
    • 7.4.4. Reliability and Safety Requirements
  • 7.5. Consumer Electronics
    • 7.5.1. Mobile Device Applications
    • 7.5.2. Wearable Technology Integration
    • 7.5.3. Gaming and Entertainment Systems

8. CHALLENGES AND OPPORTUNITIES

  • 8.1. Technical Challenges
    • 8.1.1. Manufacturing Process Maturity
    • 8.1.2. Yield and Reliability Issues
    • 8.1.3. Design and Integration Complexity
    • 8.1.4. Standardization Requirements
  • 8.2. Economic and Market Challenges
    • 8.2.1. Cost Competitiveness
    • 8.2.2. Investment Requirements
    • 8.2.3. Customer Adoption Barriers
  • 8.3. Strategic Opportunities
    • 8.3.1. Performance Differentiation
    • 8.3.2. New Application Development
    • 8.3.3. Technology Convergence Benefits

9. FUTURE OUTLOOK

  • 9.1. Technology Evolution Projections
    • 9.1.1. Next-Generation Material Developments
    • 9.1.2. Advanced Manufacturing Processes
    • 9.1.3. Integration Technology Advances
    • 9.1.4. Performance Enhancement Roadmap
  • 9.2. Market Development Scenarios
    • 9.2.1. Optimistic Growth Scenario
    • 9.2.2. Conservative Growth Scenario
    • 9.2.3. Disruptive Technology Impact

10. COMPANY PROFILES

  • 10.1. 3D CHIPS
  • 10.2. 3D Glass Solutions (3DGS)
  • 10.3. Absolics (SKC)
  • 10.4. Advanced Semiconductor Engineering (ASE)
  • 10.5. AGC Inc. (formerly Asahi Glass)
  • 10.6. Ajinomoto Co., Inc.
  • 10.7. Alliance Material
  • 10.8. AMD (Advanced Micro Devices)
  • 10.9. Applied Materials, Inc.
  • 10.10. AT&S Austria Technologie & Systemtechnik AG
  • 10.11. BOE
  • 10.12. Chengdu ECHINT (Echoing Electronics)
  • 10.13. Corning Incorporated
  • 10.14. DNP (Dai Nippon Printing Co., Ltd.)
  • 10.15. Guangdong Fozhixin Microelectronics
  • 10.16. Ibiden
  • 10.17. Intel Corporation
  • 10.18. JNTC Co., Ltd.
  • 10.19. KCC Corporation
  • 10.20. LG Innotek
  • 10.21. LPKF Laser & Electronics
  • 10.22. Nippon Electric Glass (NEG)
  • 10.23. NVIDIA Corporation
  • 10.24. Onto Innovation
  • 10.25. Philoptics
  • 10.26. Plan Optik AG
  • 10.27. RENA Technologies GmbH
  • 10.28. Samsung Electro-Mechanics (Semco)
  • 10.29. Samtec Inc.
  • 10.30. SCHOTT AG
  • 10.31. Shinko
  • 10.32. Sky Semiconductor
  • 10.33. Sumitomo Electric Industries, Ltd.
  • 10.34. Toppan
  • 10.35. TSMC (Taiwan Semiconductor Manufacturing Company)
  • 10.36. Unimicron Technology Corporation
  • 10.37. WG Tech (Wuxi Gaojing Technology)

11. APPENDICES

  • 11.1. Technical Glossary and Definitions
  • 11.2. Technology Evolution Timeline
  • 11.3. Research Approach and Framework
    • 11.3.1. Research Objectives
    • 11.3.2. Research Methodology Overview
      • 11.3.2.1. Primary Research Methods
      • 11.3.2.2. Secondary Research Methods

12. REFERENCES

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List of Tables

  • Table 1. Global Glass Substrates Market Size 2026-2036 (Revenue & Volume)
  • Table 2. Applications of Glass in Semiconductors
  • Table 3. Technology readiness levels (TRLs) glass semiconductor applications
  • Table 4. Opportunities with Glass Packaging
  • Table 5. Key Advantages of Glass Substrates
  • Table 6. Challenges in Adopting Glass Substrates
  • Table 7. Future Market Trends
  • Table 8. Advanced Processing Technologies
  • Table 9. Material Innovations
  • Table 10. Glass Carrier Unit Shipment Forecast 2025-2036
  • Table 11. Glass Core Substrate Unit Shipment Forecast 2025-2036
  • Table 12. Glass Interposer Unit Shipment Forecast 2025-2036
  • Table 13. Glass Carrier Market Value Forecast 2025-2036
  • Table 14. Glass Core Substrate Market Value Forecast 2025-2036
  • Table 15. Glass Interposer Market Value Forecast 2025-2036
  • Table 16. Glass Materials Properties
  • Table 17. Borosilicate Glass Characteristics
  • Table 18. Quartz Glass Properties
  • Table 19. Specialty Glass Compositions
  • Table 20. Glass Material Property Comparison Matrix
  • Table 21. Metallization and Build-up Processes
  • Table 22. Panel-Level Processing Technologies
  • Table 23. Comparative Analysis: Panel vs Wafer-Level Processing
  • Table 24. Organic Core Substrate vs. Glass Core Substrate
  • Table 25. TSV vs. TGV Comparison
  • Table 26. Comparison of Through Glass Via Formation Processes
  • Table 27. TGV Process and Via Formation Methods
  • Table 28. Comparison Among the TGV Processes
  • Table 29. TGV Metallization Processes
  • Table 30. Factors for Alternative TGV Metallization Process
  • Table 31. Comparison of TGV Metallization Processes
  • Table 32. Material Property Comparison for Advanced Packaging
  • Table 33. Key Mechanical and Reliability Benefits of Glass
  • Table 34. Key Factors Enabling Fine Circuit Patterns on Glass Substrates
  • Table 35. SAP Method Limitations
  • Table 36. Traditional Multilayer vs. Build-up PCBs
  • Table 37. Glass Core Substrate Technologies
  • Table 38. Glass Interposer vs. Silicon Interposer
  • Table 39. Organic Core Substrate vs. Glass Core Substrate
  • Table 40. Advanced Manufacturing Process Capabilities
  • Table 41. Advanced Thermal Management for Glass Packages
  • Table 42. Advanced Packaging Technology Comparison
  • Table 43. Dual-Mode Glass Waveguide Performance Characteristics
  • Table 44. Advancements in Glass Integration for Photonics
  • Table 45. Applications of Low-Loss Materials in Semiconductor and Electronics Packaging
  • Table 46. Categories of RF Applications Enabled by Glass in Semiconductor Technology
  • Table 47. Benchmark of LTCC and Glass Materials
  • Table 48. Dielectric Constant Stability vs Frequency for Different Inorganic Substrates
  • Table 49. Benchmarking of Commercial Low-Loss Materials for 5G PCBs/Components
  • Table 50. Glass Suppliers and Products
  • Table 51. Technical Performance Metrics - Glass vs Silicon Interposers
  • Table 52. Economic Comparison - Glass vs Silicon Interposers
  • Table 53. Scalability Assessment - Glass vs Silicon Interposers
  • Table 54. Performance Projection Models (2025-2036)
  • Table 55. Technology Requirements - AI/HPC Glass Substrate Packages
  • Table 56. Key Players and Products - AI/HPC Glass Substrates
  • Table 57. Future Development Trends - AI/HPC Glass Substrates
  • Table 58. Infrastructure Scaling Demands - Data Center Glass Substrates
  • Table 59. Performance and Efficiency Requirements - Data Center Glass Substrates
  • Table 60. Technology Adoption Patterns - Data Center Glass Substrates
  • Table 61. Market Opportunity Assessment - Data Center Glass Substrates
  • Table 62. Network Infrastructure Evolution - Telecom Glass Substrates
  • Table 63. RF Component Requirements - 5G/6G Glass Substrates
  • Table 64. Technology Integration Challenges - Telecom Glass Substrates
  • Table 65. Advanced Driver Assistance Systems - Glass Substrate Requirements
  • Table 66. Electric Vehicle Electronics - Glass Substrate Applications
  • Table 67. Performance Metrics
  • Table 68. Autonomous Driving Platforms - Glass Substrate Requirements
  • Table 69. Autonomous Driving Platforms - Glass Substrate Requirements
  • Table 70. Reliability and Safety Requirements - Automotive Glass Substrates
  • Table 71. Mobile Device Applications - Glass Substrate Opportunities
  • Table 72. Wearable Technology Integration - Glass Substrate Applications
  • Table 73. Development Status
  • Table 74. Technology Requirements by Application
  • Table 75. Gaming and Entertainment Systems - Glass Substrate Applications
  • Table 76. Performance Metrics
  • Table 77. Yield and Reliability Issues - Glass Substrates
  • Table 78. Standardization Requirements - Glass Substrates
  • Table 79. Cost Competitiveness - Glass vs Organic Substrates
  • Table 80. Cost Trajectory by Substrate Size
  • Table 81. Customer Adoption Barriers - Glass Substrates
  • Table 82. Performance Differentiation Opportunities - Glass Substrates
  • Table 83. Competitive Positioning by Market Segment:
  • Table 84. New Application Development - Glass Substrate Enabled Markets
  • Table 85. Total Addressable Market Expansion
  • Table 86. Technology Convergence Benefits - Glass Substrate Integration
  • Table 87. Next-Generation Material Developments - Glass Substrates
  • Table 88. Advanced Manufacturing Processes - Glass Substrates
  • Table 89. Integration Technology Advances - Glass Substrates
  • Table 90. Performance Enhancement Roadmap - Glass Substrates
  • Table 91. Technical Glossary and Definitions
  • Table 92. Technology Evolution Timeline - Glass Substrates for Semiconductors
  • Table 93. Key Technology Readiness Level (TRL) Progression

List of Figures

  • Figure 1. Intel's semiconductor glass substrate
  • Figure 2. SKC glass substrate prototype
  • Figure 3. Example of RF IPD balun on Glass Substrate
  • Figure 4. Value Chain of Glass Substrate for Semiconductors
  • Figure 5. Comparison of organic and glass core substrates
  • Figure 6. Cross-sectional diagram of glass substrate with through glass vias
  • Figure 7. ASE's fan-out chip on substrate module features tall copper pillars (10micrometer diameter, 120micrometer tall), tight die-die spacing, and clean underfill
  • Figure 8. Manufacturing process for glass interposers
  • Figure 9. 2D chip packaging
  • Figure 10. Typical structure of 2.5D IC package utilizing interposer
  • Figure 11. 3D Glass Panel Embedding (GPE) package
  • Figure 12. The industry roadmap for the transition of substrates from organic (top) to glass (bottom) and the path to 1micrometer L/S
  • Figure 13. System-in-Package (SiP) architecture
  • Figure 14. X-ray image of TGV in the glass core substrate
  • Figure 15. Silver printing on alumina & Copper coated on glass
  • Figure 16. Stacked glass architecture uses uncured ABF dielectric as adhesive, laser via drilling, and copper electroless seed/electroplated fill
  • Figure 17. Flip Chip Ball Grid Array (FCBGA)
  • Figure 18. High-End Performance Packaging vom Wafer bis zum System
  • Figure 19. Photonic Integrated Circuit (PIC)
  • Figure 20. Co-Packaged Optics concept
  • Figure 21. Process steps for co-packaged fabrication and assembly
  • Figure 22. Simplified flow for N=2, N=3 and N=4 collective die-to-wafer transfer
  • Figure 23. JNTC 510x515mm through silicon via (TGV) glass substrate
  • Figure 24. Material Innovation Trends Roadmap
  • Figure 25. Process Technology Evolution Roadmap
  • Figure 26. Technology Roadmap in Automotive Electronics
  • Figure 27. Absolics' glass substrate
  • Figure 28. Glass substrate test units at Intel's Assembly and Test Technology Development factory
  • Figure 29. JNTC Next-Generation Glass Substrate for Semiconductors
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