The Global Thermal Interface Materials Market 2027-2037

Table of Contents

1 EXECUTIVE SUMMARY

• 1.1 Scope of this edition
• 1.2 Market size and growth
• 1.3 Key findings
• 1.4 Technology outlook to
• 1.5 What has changed in this edition

2 INTRODUCTION

• 2.1 Thermal Management-active and passive
• 2.2 What are Thermal Interface Materials (TIMs)?
  • 2.2.1 Types of TIMs
  • 2.2.2 Thermal conductivity
• 2.3 Comparative properties of TIMs
• 2.4 Thermal Pads and Thermal Grease
• 2.5 Advantages and Disadvantages of TIMs, by type
• 2.6 Performance
• 2.7 Prices
• 2.8 Emerging Technologies in TIMs
• 2.9 Supply Chain for TIMs
• 2.10 Raw Material Analysis and Pricing
• 2.11 Environmental Regulations and Sustainability
• 2.12 System Level Performance
• 2.13 Thermal Conductivity vs Thermal Resistance
• 2.14 TIM Chemistry

3 MATERIALS

• 3.1 Advanced and Multi-Functional TIMs
  • 3.1.1 Carbon-based TIMs
    • 3.1.1.1 Overview
  • 3.1.2 Thermal Conductivity By Filler Type
  • 3.1.3 Thermal Conductivity By Matrix
• 3.2 TIM fillers
  • 3.2.1 Trends
  • 3.2.2 Pros and Cons
  • 3.2.3 Thermal Conductivity
  • 3.2.4 Spherical Alumina
  • 3.2.5 Alumina Fillers
  • 3.2.6 Boron nitride (BN)
    • 3.2.6.1 Overview
    • 3.2.6.2 Suppliers
    • 3.2.6.3 Nano Boron Nitride
  • 3.2.7 Filler and polymer TIMs
  • 3.2.8 Diamond
  • 3.2.9 Filler Sizes
• 3.3 Thermal Greases and Pastes
  • 3.3.1 Overview and properties
  • 3.3.2 SWOT analysis
• 3.4 Thermal Gap Pads
  • 3.4.1 Overview and properties
  • 3.4.2 Application in EV Batteries
  • 3.4.3 Transitioning to Gap fillers from Pads
  • 3.4.4 SWOT analysis
• 3.5 Thermal Gap Fillers
  • 3.5.1 Overview and properties
  • 3.5.2 Products
  • 3.5.3 SWOT analysis
• 3.6 Potting Compounds/Encapsulants
  • 3.6.1 Overview and properties
  • 3.6.2 SWOT analysis
• 3.7 Adhesive Tapes
  • 3.7.1 Overview and properties
  • 3.7.2 Application in EV Batteries
  • 3.7.3 TCA Requirements
  • 3.7.4 SWOT analysis
• 3.8 Phase Change Materials
  • 3.8.1 Overview
  • 3.8.2 Products
  • 3.8.3 Properties
  • 3.8.4 Types
    • 3.8.4.1 Organic/biobased phase change materials
      • 3.8.4.1.1 Advantages and disadvantages
      • 3.8.4.1.2 Paraffin wax
      • 3.8.4.1.3 Non-Paraffins/Bio-based
    • 3.8.4.2 Inorganic phase change materials
      • 3.8.4.2.1 Salt hydrates
        • 3.8.4.2.1.1 Advantages and disadvantages
      • 3.8.4.2.2 Metal and metal alloy PCMs (High-temperature)
    • 3.8.4.3 Eutectic mixtures
    • 3.8.4.4 Encapsulation of PCMs
      • 3.8.4.4.1 Macroencapsulation
      • 3.8.4.4.2 Micro/nanoencapsulation
    • 3.8.4.5 Nanomaterial phase change materials
  • 3.8.5 Thermal energy storage (TES)
    • 3.8.5.1 Sensible heat storage
    • 3.8.5.2 Latent heat storage
  • 3.8.6 Application in TIMs
    • 3.8.6.1 Thermal pads
    • 3.8.6.2 Low Melting Alloys (LMAs)
    • 3.8.6.3 Thermal storage units
    • 3.8.6.4 Thermal energy storage panels
    • 3.8.6.5 Space systems
  • 3.8.7 SWOT analysis
• 3.9 Metal-based TIMs
  • 3.9.1 Overview
    • 3.9.1.1 Metal-Based TIM1 and TIM2
    • 3.9.1.2 Metal Filled Polymer TIMs
  • 3.9.2 Solders and low melting temperature alloy TIMs
    • 3.9.2.1 Solder TIM1
    • 3.9.2.2 Sintering
  • 3.9.3 Liquid metals
    • 3.9.3.1 Liquid metal for high-performance GPU
    • 3.9.3.2 Challenges
  • 3.9.4 Solid liquid hybrid (SLH) metals
    • 3.9.4.1 Hybrid liquid metal pastes
    • 3.9.4.2 SLH created during chip assembly (m2TIMs)
    • 3.9.4.3 Die-attach materials
      • 3.9.4.3.1 Solder Alloys and Conductive Adhesives
      • 3.9.4.3.2 Silver-Sintered Paste
      • 3.9.4.3.3 Copper (Cu) sintered TIMs
        • 3.9.4.3.3.1 TIM1 - Sintered Copper
        • 3.9.4.3.3.2 Cu Sinter Materials
        • 3.9.4.3.3.3 Copper Sintering Challenges
        • 3.9.4.3.3.4 Commercial Use
      • 3.9.4.3.4 Sintered Copper Die-Bonding Paste
        • 3.9.4.3.4.1 Commercial activity
      • 3.9.4.3.5 Graphene Enhanced Sintered Copper TIMs
    • 3.9.4.4 Laminar Metal Form With High Softness
  • 3.9.5 SWOT analysis
• 3.10 Carbon-based TIMs
  • 3.10.1 Carbon nanotube (CNT) TIM Fabrication
  • 3.10.2 Challenges
  • 3.10.3 Market players
  • 3.10.4 Multi-walled nanotubes (MWCNT)
    • 3.10.4.1 Properties
    • 3.10.4.2 Application as thermal interface materials
  • 3.10.5 Single-walled carbon nanotubes (SWCNTs)
    • 3.10.5.1 Properties
    • 3.10.5.2 Application as thermal interface materials
  • 3.10.6 Vertically aligned CNTs (VACNTs)
    • 3.10.6.1 Properties
    • 3.10.6.2 Applications
    • 3.10.6.3 Application as thermal interface materials
  • 3.10.7 BN nanotubes (BNNT) and nanosheets (BNNS)
    • 3.10.7.1 Properties
    • 3.10.7.2 Application as thermal interface materials
  • 3.10.8 Graphene
    • 3.10.8.1 Properties
    • 3.10.8.2 Application as thermal interface materials
      • 3.10.8.2.1 Graphene fillers
      • 3.10.8.2.2 Graphene foam
      • 3.10.8.2.3 Graphene aerogel
      • 3.10.8.2.4 Graphene Heat Spreaders
      • 3.10.8.2.5 Graphene in Thermal Interface Pads
    • 3.10.8.3 Advantages of Graphene
    • 3.10.8.4 Through-Plane Alignment
  • 3.10.9 Nanodiamonds
    • 3.10.9.1 Properties
    • 3.10.9.2 Application as thermal interface materials
  • 3.10.10 Graphite
    • 3.10.10.1 Properties
    • 3.10.10.2 Natural graphite
      • 3.10.10.2.1 Classification
      • 3.10.10.2.2 Processing
      • 3.10.10.2.3 Flake
        • 3.10.10.2.3.1 Grades
        • 3.10.10.2.3.2 Applications
    • 3.10.10.3 Synthetic graphite
      • 3.10.10.3.1 Classification
        • 3.10.10.3.1.1 Primary synthetic graphite
        • 3.10.10.3.1.2 Secondary synthetic graphite
        • 3.10.10.3.1.3 Processing
    • 3.10.10.4 Applications as thermal interface materials
      • 3.10.10.4.1 Graphite Sheets
      • 3.10.10.4.2 Vertical graphite
      • 3.10.10.4.3 Graphite pastes
    • 3.10.10.5 Challenges
      • 3.10.10.5.1 Through-plane thermal conductivity limitations
      • 3.10.10.5.2 Interfacing with Heat Source and Disrupting Alignment
  • 3.10.11 Hexagonal Boron Nitride
    • 3.10.11.1 Properties
    • 3.10.11.2 Application as thermal interface materials
  • 3.10.12 SWOT analysis
• 3.11 Metamaterials
  • 3.11.1 Types and properties
    • 3.11.1.1 Electromagnetic metamaterials
      • 3.11.1.1.1 Double negative (DNG) metamaterials
      • 3.11.1.1.2 Single negative metamaterials
      • 3.11.1.1.3 Electromagnetic bandgap metamaterials (EBG)
      • 3.11.1.1.4 Bi-isotropic and bianisotropic metamaterials
      • 3.11.1.1.5 Chiral metamaterials
      • 3.11.1.1.6 Electromagnetic “Invisibility” cloak
    • 3.11.1.2 Terahertz metamaterials
    • 3.11.1.3 Photonic metamaterials
    • 3.11.1.4 Tunable metamaterials
    • 3.11.1.5 Frequency selective surface (FSS) based metamaterials
    • 3.11.1.6 Nonlinear metamaterials
    • 3.11.1.7 Acoustic metamaterials
  • 3.11.2 Application as thermal interface materials
• 3.12 Self-healing thermal interface materials
  • 3.12.1 Extrinsic self-healing
  • 3.12.2 Capsule-based
  • 3.12.3 Vascular self-healing
  • 3.12.4 Intrinsic self-healing
  • 3.12.5 Healing volume
  • 3.12.6 Types of self-healing materials, polymers and coatings
  • 3.12.7 Applications in thermal interface materials
• 3.13 TIM Dispensing
  • 3.13.1 Low-volume Dispensing Methods
  • 3.13.2 High-volume Dispensing Methods
  • 3.13.3 Meter, Mix, Dispense (MMD) Systems
  • 3.13.4 TIM Dispensing Equipment Suppliers

4 EMERGING MATERIALS AND PROCESSES

• 4.1 Why the interface has become the constraint
• 4.2 Nomenclature
• 4.3 Hybrid and confined liquid metal architectures
  • 4.3.1 Fibre-reinforced liquid metal composites
  • 4.3.2 Liquid metal embedded elastomers
  • 4.3.3 Hybrid dam architectures
  • 4.3.4 Phase change metal alloys
• 4.4 Next-generation phase change materials
• 4.5 Anchored nanocarbon interfaces
• 4.6 Graphene, graphite and very high density carbon
• 4.7 Boron nitride, boron arsenide and engineered fillers
• 4.8 Liquid-infused and nanowire composites
• 4.9 Metal TIM1: solder, sintering and indium
• 4.10 Packaging architecture: heterogeneous integration and backside power
• 4.11 Immersion cooling compatibility
• 4.12 AI-directed formulation discovery
• 4.13 Sustainability and circularity
• 4.14 Metrology, reliability and qualification practice
• 4.15 Thermal demand beyond compute: networking silicon

5 MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

• 5.1 Consumer Electronics
  • 5.1.1 Market overview
    • 5.1.1.1 Market drivers
    • 5.1.1.2 Applications
      • 5.1.1.2.1 Smartphones and tablets
        • 5.1.1.2.1.1 Graphitic Heat Spreaders
        • 5.1.1.2.1.2 Liquid metals
      • 5.1.1.2.2 Wearable electronics
  • 5.1.2 Global market 2022-2037, by TIM type
• 5.2 Electric Vehicles (EV)
  • 5.2.1 Market overview
    • 5.2.1.1 Market drivers
    • 5.2.1.2 Applications
      • 5.2.1.2.1 EV Battery Packs
        • 5.2.1.2.1.1 TIM Pack and Module
        • 5.2.1.2.1.2 TIM Application by Cell Format
        • 5.2.1.2.1.3 Thermal Interface Material Fillers for EV Batteries
        • 5.2.1.2.1.4 Factors Impacting TIM Pricing
        • 5.2.1.2.1.5 TIM Pricing
        • 5.2.1.2.1.6 Companies
      • 5.2.1.2.2 Lithium-ion batteries
        • 5.2.1.2.2.1 Cell-to-pack designs
        • 5.2.1.2.2.2 Cell-to-chassis/body
      • 5.2.1.2.3 Power electronics
        • 5.2.1.2.3.1 Types
        • 5.2.1.2.3.2 Trends
        • 5.2.1.2.3.3 Properties for TIM2 Properties in EV power electronics
        • 5.2.1.2.3.4 TIM1s
        • 5.2.1.2.3.5 TIM2 in SiC MOSFET
      • 5.2.1.2.4 Charging stations
  • 5.2.2 Global market 2022-2037, by TIM type
• 5.3 Data Centers
  • 5.3.1 Market overview
    • 5.3.1.1 Market drivers
    • 5.3.1.2 Applications
      • 5.3.1.2.1 Router, switches and line cards
        • 5.3.1.2.1.1 Transceivers
        • 5.3.1.2.1.2 Server Boards
        • 5.3.1.2.1.3 Switches and Routers
      • 5.3.1.2.2 AI Servers
        • 5.3.1.2.2.1 Overview
        • 5.3.1.2.2.2 Trends
        • 5.3.1.2.2.3 TRL
      • 5.3.1.2.3 Power supply converters
        • 5.3.1.2.3.1 Overview
        • 5.3.1.2.3.2 Laminar metal form TIMs
        • 5.3.1.2.3.3 TIM Consumption in Data Center Power Supplies
        • 5.3.1.2.3.4 Immersion cooling
  • 5.3.2 Global market 2022-2037, by TIM type
• 5.4 Advanced Semiconductor Packaging
  • 5.4.1 Market Overview
  • 5.4.2 TIM1
    • 5.4.2.1 Indium foil TIM1
    • 5.4.2.2 Products
      • 5.4.2.2.1 Thermal Gel
      • 5.4.2.2.2 Thermal grease
      • 5.4.2.2.3 Graphene
      • 5.4.2.2.4 Liquid metal
      • 5.4.2.2.5 Diamond thermal interface materials in TIM0 applications
      • 5.4.2.2.6 Integrated silicon micro-cooler systems
      • 5.4.2.2.7 Copper nanowire (CuNWs)
  • 5.4.3 Global market 2022-2037, by TIM type
• 5.5 ADAS Sensors
  • 5.5.1 Market overview
    • 5.5.1.1 Market drivers
      • 5.5.1.1.1 Sensor Suite for Autonomous Cars
      • 5.5.1.1.2 Thermal Management in ADAS Sensors
    • 5.5.1.2 Applications
      • 5.5.1.2.1 ADAS Cameras
        • 5.5.1.2.1.1 Commercial examples
      • 5.5.1.2.2 ADAS Radar
        • 5.5.1.2.2.1 Radar technology
        • 5.5.1.2.2.2 Radar boards
        • 5.5.1.2.2.3 Commercial examples
      • 5.5.1.2.3 ADAS LiDAR
        • 5.5.1.2.3.1 Role of TIMs
        • 5.5.1.2.3.2 Commercial examples
      • 5.5.1.2.4 Electronic control units (ECUs) and computers
        • 5.5.1.2.4.1 Overview
        • 5.5.1.2.4.2 Commercial examples
      • 5.5.1.2.5 Die attach materials
        • 5.5.1.2.5.1 Overview
        • 5.5.1.2.5.2 Commercial examples
    • 5.5.1.3 Companies
  • 5.5.2 Global market 2022-2037, by TIM type
• 5.6 EMI shielding
  • 5.6.1 Market overview
    • 5.6.1.1 Market drivers
    • 5.6.1.2 Applications
      • 5.6.1.2.1 Dielectric Constant
      • 5.6.1.2.2 ADAS
        • 5.6.1.2.2.1 Radar
        • 5.6.1.2.2.2 5G
      • 5.6.1.2.3 Commercial examples
• 5.7 5G
  • 5.7.1 Market overview
    • 5.7.1.1 Market drivers
    • 5.7.1.2 Applications
      • 5.7.1.2.1 EMI shielding and EMI gaskets
      • 5.7.1.2.2 Antenna
      • 5.7.1.2.3 Base Band Unit (BBU)
      • 5.7.1.2.4 Liquid TIMs
      • 5.7.1.2.5 Power supplies
        • 5.7.1.2.5.1 Increased power consumption in 5G
  • 5.7.2 Market players
  • 5.7.3 Global market 2022-2037, by TIM type
• 5.8 Aerospace & Defense
  • 5.8.1 Market overview
    • 5.8.1.1 Market drivers
    • 5.8.1.2 Applications
      • 5.8.1.2.1 Satellite thermal management
        • 5.8.1.2.1.1 Temperature range
        • 5.8.1.2.1.2 Heat Spreaders
        • 5.8.1.2.1.3 Carbon fiber reinforced TIM
        • 5.8.1.2.1.4 Thermal pads
        • 5.8.1.2.1.5 Thermal straps
        • 5.8.1.2.1.6 Graphene
        • 5.8.1.2.1.7 Challenges
      • 5.8.1.2.2 Avionics cooling
      • 5.8.1.2.3 Military electronics
    • 5.8.1.3 Global market 2022-2037, by TIM type
• 5.9 Industrial Electronics
  • 5.9.1 Market overview
    • 5.9.1.1 Market drivers
    • 5.9.1.2 Applications
      • 5.9.1.2.1 Industrial automation
      • 5.9.1.2.2 Power supplies
      • 5.9.1.2.3 Motor drives
      • 5.9.1.2.4 LED lighting
  • 5.9.2 Global market 2022-2037, by TIM type
• 5.10 Renewable Energy
  • 5.10.1 Market overview
    • 5.10.1.1 Market drivers
    • 5.10.1.2 Applications
      • 5.10.1.2.1 Solar inverters
      • 5.10.1.2.2 Wind power electronics
      • 5.10.1.2.3 Energy storage systems
  • 5.10.2 Global market 2022-2037, by TIM type
• 5.11 Medical Electronics
  • 5.11.1 Market overview
    • 5.11.1.1 Market drivers
    • 5.11.1.2 Applications
      • 5.11.1.2.1 Diagnostic equipment
      • 5.11.1.2.2 Medical imaging systems
      • 5.11.1.2.3 Patient monitoring devices
  • 5.11.2 Global market 2022-2037, by TIM type

6 COMPANY PROFILES (119 company profiles)

7 RESEARCH METHODOLOGY

8 REFERENCES

List of Tables

• Table 1. Global market for thermal interface materials by application, 2026-2037 (millions USD).
• Table 2. Thermal conductivities (κ) of common metallic, carbon, and ceramic fillers employed in TIMs.
• Table 3. Commercial TIMs and their properties.
• Table 4. Advantages and disadvantages of TIMs, by type.
• Table 5. Key Factors in System Level Performance for TIMs.
• Table 6. TIM Materials by Thermal, Mechanical, and Application Properties
• Table 7. Thermal interface materials prices.
• Table 8. Comparisons of Price and Thermal Conductivity for TIMs.
• Table 9. Price Comparison of TIM Fillers.
• Table 10. Raw Material Analysis and Pricing.
• Table 11. System Level Performance Comparison.
• Table 12. Thermal Conductivity vs Thermal Resistance Comparison.
• Table 13. TIM Chemistry Comparison
• Table 14. Characteristics of some typical TIMs.
• Table 15. Carbon-Based TIM Performance.
• Table 16. Thermal Conductivity By Filler Type
• Table 17. Thermal Conductivity By Matrix.
• Table 18. Trends on TIM Fillers.
• Table 19. Pros and Cons of TIM Fillers.
• Table 20. Thermal Conductivity Comparison ATH and Al2O3.
• Table 21. BNNT Companies and Prices.
• Table 22.BNNT Property Variation.
• Table 23. Diamond fillers with varied sizes for thermal interface materials.
• Table 24. Commercial thermal paste products.
• Table 25.Commercial thermal gap pads (thermal interface materials).
• Table 26. Commercial thermal gap fillers products.
• Table 27. Types of Potting Compounds/Encapsulants.
• Table 28. TIM adhesives tapes.
• Table 29. Commercial phase change materials (PCM) thermal interface materials (TIMs) products.
• Table 30. Properties of PCMs.
• Table 31. PCM Types and properties.
• Table 32. Advantages and disadvantages of organic PCMs.
• Table 33. Advantages and disadvantages of organic PCM Fatty Acids.
• Table 34. Advantages and disadvantages of salt hydrates
• Table 35. Advantages and disadvantages of low melting point metals.
• Table 36. Advantages and disadvantages of eutectics.
• Table 37. Benefits and drawbacks of PCMs in TIMs.
• Table 38. PCM Selection Criteria and Considerations for Space Systems.
• Table 39. PCM selection criteria and considerations for space systems.
• Table 40. Liquid Metal Challenges.
• Table 41. Copper Sintering Technical Challenges.
• Table 42. Technology Readiness Level (TRL) for Carbon Materials in Thermal Management
• Table 43. Challenges with CNT-TIMs.
• Table 44. Market players in CNT-TIMs.
• Table 45. Properties of CNTs and comparable materials.
• Table 46. Typical properties of SWCNT and MWCNT.
• Table 47. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive.
• Table 48. Thermal conductivity of CNT-based polymer composites.
• Table 49. Comparative properties of BNNTs and CNTs.
• Table 50. Properties of graphene, properties of competing materials, applications thereof.
• Table 51. Graphene Heat Spreaders Performance.
• Table 52. Comparison of Conventional and Graphene-Enhanced Thermal Pads.
• Table 53. Advantages of Graphene in Thermal Interface Materials
• Table 54. Properties of nanodiamonds.
• Table 55. Comparison between Natural and Synthetic Graphite.
• Table 56. Thermal Conductivity Comparison of Graphite TIMs.
• Table 57. Classification of natural graphite with its characteristics.
• Table 58. Characteristics of synthetic graphite.
• Table 59. Thermal Conductivity Comparison of Graphite TIMs.
• Table 60. Properties of hexagonal boron nitride (h-BN).
• Table 61. Comparison of self-healing systems.
• Table 62. Types of self-healing coatings and materials.
• Table 63. Comparative properties of self-healing materials.
• Table 64. Challenges for Dispensing TIM.
• Table 65. Thermal Management Application Areas in Consumer Electronics.
• Table 66. Thermal Management Differences: 4G vs 5G Smartphones.
• Table 67. Trends in Smartphone Thermal Materials.
• Table 68. Thermal Management approaches in commercial Smartphones.
• Table 69. Global market in consumer electronics 2022-2037, by TIM type (millions USD).
• Table 70. Material Options and Market Comparison.
• Table 71. TIM Filler Comparison and Adoption.
• Table 72. Thermal Conductivity Comparison of Suppliers for EV Batteries.
• Table 73. TIM Pricing by Supplier.
• Table 74. Thermal Conductivity Comparison of TIM1s.
• Table 75. Global market in electric vehicles 2022-2037, by TIM type (millions USD).
• Table 76. Types of TIMs in Data Centers.
• Table 77. Area of TIM per Switch.
• Table 78. Leaf and Spine Switch TIM Areas.
• Table 79. Novel TIM Technologies in Data Centers.
• Table 80. Emerging Trends in TIM Materials for AI Servers.
• Table 81. Applications of TIM Materials in AI Servers with Technology Readiness Levels (TRL).
• Table 82. Companies Utilizing and Providing TIM Materials for AI Servers
• Table 83. TIM Trends in Data Centers.
• Table 84. TIM Area Forecast in Server Boards: 2022-2037 (m2).
• Table 85. Global market in data centers 2022-2037, by TIM type (millions USD).
• Table 86. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD).
• Table 87. Autonomous Vehicle Sensor Suite TIM Requirements.
• Table 88. TIM Players in ADAS.
• Table 89. TIM Players in ADAS.
• Table 90. Die Attach for ADAS Sensors.
• Table 91. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2037 (m2).
• Table 92. TIM Players in ADAS
• Table 93. Global market in ADAS sensors 2022-2037, by TIM type (millions USD).
• Table 94. Applications of TIMs in EMI Shielding for ADAS Radars.
• Table 95. TIM Area Forecast for 5G Antennas by Station Size: 2022-2037 (m2).
• Table 96. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2037 (m2).
• Table 97. TIMS in BBU.
• Table 98. 5G BBY models.
• Table 99. TIM Area Forecast for 5G BBU: 2022-2037 (m2).
• Table 100. Power Consumption Forecast for 5G: 2022-2037 (GW).
• Table 101. TIM Area Forecast for Power Supplies: 2022-2037 (m2).
• Table 102. TIM market players in 5G.
• Table 103. Global market in 5G 2022-2037, by TIM type (millions USD).
• Table 104. Market Drivers for TIMS in aerospace and defense.
• Table 105. Applications for TIMS in aerospace and defense.
• Table 106. Temperature range of space subsystems and passive cooling approaches.
• Table 107. TIMs for space satellites - challenges and considerations.
• Table 108. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD).
• Table 109. Market Drivers for TIMs in industrial electronics.
• Table 110. Applications for TIMs in industrial electronics.
• Table 111. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD).
• Table 112. Market Drivers for TIMs in renewable energy.
• Table 113. Applications for TIMs in renewable energy.
• Table 114. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD).
• Table 115. Market Drivers for TIMs in medical electronics.
• Table 116. Applications for TIMs in medical electronics.
• Table 117. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD).

List of Figures

• Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material.
• Figure 2. Schematic of thermal interface materials used in a flip chip package.
• Figure 3. Thermal grease.
• Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.
• Figure 5. Supply Chain for TIMs.
• Figure 6. Commercial thermal paste products.
• Figure 7. Application of thermal silicone grease.
• Figure 8. A range of thermal grease products.
• Figure 9. SWOT analysis for thermal greases and pastes.
• Figure 10. Thermal Pad.
• Figure 11. SWOT analysis for thermal gap pads.
• Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module.
• Figure 13. SWOT analysis for thermal gap fillers.
• Figure 14. SWOT analysis for Potting compounds/encapsulants.
• Figure 15. Thermal adhesive products.
• Figure 16. SWOT analysis for TIM adhesives tapes.
• Figure 17. Phase-change TIM products.
• Figure 18. PCM mode of operation.
• Figure 19. Classification of PCMs.
• Figure 20. Phase-change materials in their original states.
• Figure 21. Thermal energy storage materials.
• Figure 22. Phase Change Material transient behaviour.
• Figure 23. PCM TIMs.
• Figure 24. Phase Change Material - die cut pads ready for assembly.
• Figure 25. SWOT analysis for phase change materials.
• Figure 26. Typical IC package construction identifying TIM1 and TIM2
• Figure 27. Liquid metal TIM product.
• Figure 28. Pre-mixed SLH.
• Figure 29. HLM paste and Liquid Metal Before and After Thermal Cycling.
• Figure 30. SLH with Solid Solder Preform.
• Figure 31. Automated process for SLH with solid solder preforms and liquid metal.
• Figure 32. SWOT analysis for metal-based TIMs.
• Figure 33. Schematic of single-walled carbon nanotube.
• Figure 34. Types of single-walled carbon nanotubes.
• Figure 35. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment.
• Figure 36. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red.
• Figure 37. Graphene layer structure schematic.
• Figure 38. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG.
• Figure 39. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene.
• Figure 40. Graphene Thermal Management Applications Roadmap.
• Figure 41. Flake graphite.
• Figure 42. Applications of flake graphite.
• Figure 43. Graphite-based TIM products.
• Figure 44. Structure of hexagonal boron nitride.
• Figure 45. SWOT analysis for carbon-based TIMs.
• Figure 46. Classification of metamaterials based on functionalities.
• Figure 47. Electromagnetic metamaterial.
• Figure 48. Schematic of Electromagnetic Band Gap (EBG) structure.
• Figure 49. Schematic of chiral metamaterials.
• Figure 50. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer.
• Figure 51. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage.
• Figure 52. Stages of self-healing mechanism.
• Figure 53. Self-healing mechanism in vascular self-healing systems.
• Figure 54. Schematic of TIM operation in electronic devices.
• Figure 55. Schematic of Thermal Management Materials in smartphone.
• Figure 56. Wearable technology inventions.
• Figure 57. Global market in consumer electronics 2022-2037, by TIM type (millions USD).
• Figure 58. Application of thermal interface materials in automobiles.
• Figure 59. EV battery components including TIMs.
• Figure 60. Battery pack with a cell-to-pack design and prismatic cells.
• Figure 61. Cell-to-chassis battery pack.
• Figure 62. TIMS in EV charging station.
• Figure 63. Global market in electric vehicles 2022-2037, by TIM type (millions USD).
• Figure 64. Image of data center layout.
• Figure 65. Application of TIMs in line card.
• Figure 66. Global market in data centers 2022-2037, by TIM type (millions USD).
• Figure 67. Global market in advanced semiconductor packaging 2022-2037, by TIM type (millions USD).
• Figure 68. ADAS radar unit incorporating TIMs.
• Figure 69. Global market in ADAS sensors 2022-2037, by TIM type (millions USD).
• Figure 70. Coolzorb 5G.
• Figure 71. TIMs in Base Band Unit (BBU).
• Figure 72. Global market in 5G 2022-2037, by TIM type (millions USD).
• Figure 73. Global Market for TIMs in aerospace and defense 2022-2037, by TIM Type (Millions USD).
• Figure 74. Global Market 2022-2037, by TIM Type in Industrial Electronics (Millions USD).
• Figure 75. Global Market for TIMs in Renewable Energy 2022-2037 (Millions USD).
• Figure 76. Global Market 2022-2037 for TIMs in Medical Electronics (Millions USD).
• Figure 77. Boron Nitride Nanotubes products.
• Figure 78. Transtherm® PCMs.
• Figure 79. Carbice carbon nanotubes.
• Figure 80. Internal structure of carbon nanotube adhesive sheet.
• Figure 81. Carbon nanotube adhesive sheet.
• Figure 82. HI-FLOW Phase Change Materials.
• Figure 83. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface.
• Figure 84. Parker Chomerics THERM-A-GAP GEL.
• Figure 85. Metamaterial structure used to control thermal emission.
• Figure 86. Shinko Carbon Nanotube TIM product.
• Figure 87. The Sixth Element graphene products.
• Figure 88. Thermal conductive graphene film.
• Figure 89. VB Series of TIMS from Zeon.