The Global Advanced Solid-State Cooling Market 2027-2037

Table of Contents

1 EXECUTIVE SUMMARY

• 1.1 Market opportunity and strategic overview
  • 1.1.1 The global cooling market
  • 1.1.2 Global solid-state cooling market size and growth projections (2027-2037)
  • 1.1.3 Emerging technologies market opportunity assessment and competitive positioning
• 1.2 The nature of solid-state cooling and why it is now a priority
• 1.3 Advantages of solid-state cooling
• 1.4 Technology landscape
  • 1.4.1 Established vs emerging solid-state cooling technologies
  • 1.4.2 LED-based thermophotonic cooling performance benchmarks and advantages
  • 1.4.3 Quantum cryogenic cooling requirements and market applications
• 1.5 Technology readiness levels and commercialisation timelines across all segments
• 1.6 Cooling toolkit and potential winners on current evidence
  • 1.6.1 The cooling toolkit and the trend to multimode cooling
  • 1.6.2 Best passive solid-state cooling technologies for reducing temperature by 5 °C to 40 °C, 2027-2047
  • 1.6.3 Best solid-state cooling technologies for reducing temperature by 5 °C to 50 °C, 2027-2047
  • 1.6.4 Companies commercialising solid-state cooling by technology
  • 1.6.5 Solid-state cooling: overall SWOT appraisal
• 1.7 Market segmentation and application analysis
  • 1.7.1 Primary target markets: semiconductor cooling, quantum technologies, cryogenic applications
  • 1.7.2 Application-specific market sizing with US$-value quantification by segment
• 1.8 Customer needs assessment and adoption barriers analysis
• 1.9 Temperature range segmentation (sub-100 K to 150 K+) and application mapping
• 1.10 Competitive landscape and industry structure
  • 1.10.1 Market share analysis across thermoelectric, magnetocaloric and emerging technologies
  • 1.10.2 Key player positioning: established manufacturers vs innovation-driven start-ups
  • 1.10.3 Technology differentiation strategies and competitive advantages
  • 1.10.4 Partnership ecosystems and value chain positioning opportunities
• 1.11 LED-based cooling
  • 1.11.1 Technology performance advantages over conventional Peltier and cryogenic systems
  • 1.11.2 Addressable market opportunity and penetration scenarios
  • 1.11.3 First application priorities and beachhead market strategies
  • 1.11.4 Unique value propositions for semiconductor sensor cooling and quantum applications
• 1.12 Funding and investment landscape
  • 1.12.1 Private funding trends
  • 1.12.2 Government and EU funding
  • 1.12.3 Funding pathway recommendations for LED-based cooling developers
• 1.13 Key conclusions

2 INTRODUCTION

• 2.1 The need for cooling
  • 2.1.1 General situation
  • 2.1.2 Cooling demand escalation 2027-2047
  • 2.1.3 Radical changes in requirements
  • 2.1.4 Problems with traditional vapour compression
  • 2.1.5 Dangers of heat and localised body cooling
  • 2.1.6 Cooling buildings
  • 2.1.7 AI data centres
  • 2.1.8 Severe new microchip cooling requirements
  • 2.1.9 6G communications from
  • 2.1.10 Other cooling problems and opportunities in electronics and ICT
  • 2.1.11 Grid storage batteries
  • 2.1.12 Hot solar panels
  • 2.1.13 Fusion and high-power lasers
  • 2.1.14 Vehicles and electric vehicles
• 2.2 Regulatory and policy drivers
  • 2.2.1 Kigali Amendment to the Montreal Protocol
  • 2.2.2 EU F-gas Regulation (EU) 2024/573
  • 2.2.3 Global Cooling Pledge
  • 2.2.4 Japan Top Runner
  • 2.2.5 US AIM Act
  • 2.2.6 Public funding programmes
• 2.3 Primary answers to emerging cooling challenges
  • 2.3.1 Trend to smart materials
  • 2.3.2 Ancient passive cooling revived
  • 2.3.3 Reinventing air conditioning
  • 2.3.4 Cooling microchips and batteries, with or without solid-state
  • 2.3.5 Answers to 6G heat
  • 2.3.6 Smart textiles
• 2.4 Solid-state cooling technology fundamentals and classification
  • 2.4.1 Classification of operating principles
  • 2.4.2 Undesirable materials as an opportunity
• 2.5 Caloric cooling effects
  • 2.5.1 Physics of caloric cooling
  • 2.5.2 Magnetocaloric
  • 2.5.3 Electrocaloric
  • 2.5.4 Elastocaloric
  • 2.5.5 Barocaloric
  • 2.5.6 Twistocaloric
  • 2.5.7 Multicaloric effects
• 2.6 Market evolution and technology timeline
  • 2.6.1 Attention versus maturity
• 2.7 Scope of analysis: established vs emerging technologies
• 2.8 Value chain analysis across technologies
  • 2.8.1 Component and material suppliers
  • 2.8.2 Technology developers and IP holders
  • 2.8.3 System integrators and OEMs
  • 2.8.4 End-user customers and market channels
  • 2.8.5 Distribution and service networks
• 2.9 Competing cooling technologies
  • 2.9.1 Why solid-state will gradually displace vapour compression

3 SOLID-STATE COOLING TECHNOLOGIES

• 3.1 Thermoelectric (Peltier) cooling systems
  • 3.1.1 Technology maturity and market penetration
  • 3.1.2 Thermoelectric materials
  • 3.1.3 Performance characteristics and limitations
  • 3.1.4 Thermoelectric cooling and temperature control applications
  • 3.1.5 Wide-area and flexible thermoelectric cooling: a gap in the market
  • 3.1.6 Radiative cooling of buildings combined with thermoelectric harvesting
  • 3.1.7 The heat-removal problem of TEC and TEG and evolving solutions
  • 3.1.8 Recent advances in thermoelectric cooling
  • 3.1.9 Thermoelectric module manufacturers
  • 3.1.10 Market size
  • 3.1.11 SWOT analysis
• 3.2 Magnetocaloric cooling
  • 3.2.1 Technology principles and development status
  • 3.2.2 Commercial applications
  • 3.2.3 Performance advantages and challenges
  • 3.2.4 Magnetic materials supply and cost
  • 3.2.5 Market outlook
  • 3.2.6 SWOT analysis
• 3.3 Electrocaloric cooling
  • 3.3.1 Overview and SWOT appraisal
  • 3.3.2 Operating principles, device construction, materials and form factors
  • 3.3.3 Electric-field-induced temperature changes
  • 3.3.4 Polymer and ceramic-based materials
  • 3.3.5 Material popularity in recent research
  • 3.3.6 Giant electrocaloric effect through
  • 3.3.7 Issues to address
  • 3.3.8 Research advances 2025 and
  • 3.3.9 Current development stage and commercialisation timeline
  • 3.3.10 Scalability, market potential and applications
• 3.4 Barocaloric cooling systems
  • 3.4.1 Pressure-induced caloric effects and materials
  • 3.4.2 Mechanical pressure cycling mechanisms
  • 3.4.3 Development status and research progress
  • 3.4.4 Comparison with other caloric cooling technologies
• 3.5 Elastocaloric cooling systems
  • 3.5.1 Stress-strain induced temperature changes
  • 3.5.2 Shape-memory alloy and polymer-based materials
  • 3.5.3 Mechanical cycling and fatigue considerations
  • 3.5.4 Performance characteristics and applications
• 3.6 Twistocaloric (torsocaloric) cooling systems
  • 3.6.1 Twist-induced caloric effects
  • 3.6.2 Carbon nanotube yarns and fibre-based systems
  • 3.6.3 Rotational mechanical cycling
  • 3.6.4 Research developments and commercialisation potential
• 3.7 Solid-state phase change cooling: caloric and oriented composite phase change materials (OCPCM)
  • 3.7.1 Structural and ferroic phase change modes
  • 3.7.2 Oriented composite phase change materials (OCPCM)
• 3.8 Multicaloric cooling
• 3.9 Solid-state heat pumps and engines
  • 3.9.1 Technology convergence opportunities
  • 3.9.2 Hybrid cooling system architectures
• 3.10 Caloric cooling: comparative summary and market outlook
• 3.11 LED-based solid-state cooling technologies
  • 3.11.1 LED-based thermophotonic cooling principles
  • 3.11.2 Technical specifications and performance parameters
  • 3.11.3 Advantages over conventional methods
  • 3.11.4 Technology readiness level and development status
  • 3.11.5 Manufacturing cost analysis ($/W basis)
  • 3.11.6 Temperature range capabilities (sub-100 K to 150 K)
  • 3.11.7 Addressable market size and opportunity
  • 3.11.8 Competitive landscape within solid-state cooling
  • 3.11.9 Market entry barriers and advantages
  • 3.11.10 First application priorities and beachhead market strategies
  • 3.11.11 Technology differentiation and unique value propositions for semiconductor sensor cooling and quantum applications
  • 3.11.12 Performance advantages over Peltier systems
  • 3.11.13 Cost competitiveness vs magnetocaloric and Stirling
  • 3.11.14 Commercialisation and funding pathways
• 3.12 Optical refrigeration: laser cooling of solids and anti-Stokes fluorescence
• 3.13 Phononic cooling systems
  • 3.13.1 Solid-state phonon manipulation principles
  • 3.13.2 Technology approach and development status
  • 3.13.3 Market positioning and commercial potential
• 3.14 Quantum dot cooling technologies
  • 3.14.1 Quantum confinement effects
  • 3.14.2 Research developments
  • 3.14.3 Integration with quantum computing systems
• 3.15 Photonic crystal and metamaterial cooling
  • 3.15.1 Principles and wavelength selectivity
  • 3.15.2 Market readiness and manufacturing challenges
• 3.16 Advanced thermionic cooling
  • 3.16.1 Introduction
  • 3.16.2 Electron emission cooling mechanisms
  • 3.16.3 Recent breakthroughs and commercialisation timeline
• 3.17 Passive daytime radiative cooling (PDRC)
  • 3.17.1 Definition, origin and purpose
  • 3.17.2 Materials
  • 3.17.3 Janus and two-sided designs
  • 3.17.4 PRC paint and colour without compromise
  • 3.17.5 Applications: buildings, data centres, solar panels and more
  • 3.17.6 Companies commercialising PRC
• 3.18 Solid-state airflow: MEMS, ionic wind and plasma actuators
  • 3.18.1 Piezoelectric MEMS active cooling
  • 3.18.2 Ionic wind / electrohydrodynamic cooling
  • 3.18.3 Dielectric barrier discharge plasma actuators
  • 3.18.4 Comparison with fans, heat pipes and vapour chambers
  • 3.18.5 Applications
  • 3.18.6 Market outlook
• 3.19 Quantum cryogenic cooling technologies
  • 3.19.1 Adiabatic demagnetisation refrigeration (ADR)
  • 3.19.2 Dilution refrigeration alternatives
  • 3.19.3 Superconducting cooling technologies
  • 3.19.4 Quantum sensing and communication cooling
  • 3.19.5 Quantum cooling market context
• 3.20 Comparative technology analysis
  • 3.20.1 Performance benchmarking matrix across all technologies
  • 3.20.2 Cost competitiveness analysis by application segment
  • 3.20.3 Application suitability mapping and temperature ranges
  • 3.20.4 Technology readiness levels and commercialisation timelines
  • 3.20.5 Technology roadmap and convergence trends
  • 3.20.6 Quantum technology integration capabilities
  • 3.20.7 Winning materials and principles for solid-state cooling generally

4 GLOBAL SOLID-STATE COOLING MARKET ANALYSIS

• 4.1 Market definition, methodology and assumptions
• 4.2 Overall market segmentation and sizing
  • 4.2.1 Global solid-state cooling market overview
  • 4.2.2 Technology segment breakdown and market share
  • 4.2.3 Regional market analysis and growth patterns
  • 4.2.4 Market drivers and growth catalysts
  • 4.2.5 Market restraints and risks
• 4.3 Application-based market segmentation
  • 4.3.1 Primary market segments by temperature requirements
  • 4.3.2 Cross-technology application analysis
  • 4.3.3 Growth projections and market dynamics (5-10 year outlook)
• 4.4 Customer needs assessment across market segments
  • 4.4.1 Performance requirements by application
  • 4.4.2 Cost sensitivity and value drivers
  • 4.4.3 Technology adoption criteria and decision factors
  • 4.4.4 Adoption barriers
• 4.5 Funding and investment landscape
  • 4.5.1 Private funding trends
  • 4.5.2 Corporate investment and M&A
  • 4.5.3 Government and EU funding

5 COMPANY PROFILES (68 company profiles)

6 APPENDIX

• 6.1 Report methodology
  • 6.1.1 Research approach
  • 6.1.2 Market definition
  • 6.1.3 Forecasting method
  • 6.1.4 Limitations

7 REFERENCES

List of Tables

• Table 1. Solid-state cooling in the context of the wider cooling market.
• Table 2. Global advanced solid-state cooling market size, 2023-2037 (US$ millions).
• Table 3. Emerging solid-state cooling technologies: opportunity assessment.
• Table 4. Why solid-state cooling is now a priority: drivers and evidence.
• Table 5. Established vs emerging solid-state cooling technologies.
• Table 6. LED-based thermophotonic cooling: performance benchmarks against incumbents.
• Table 7. Quantum cryogenic cooling requirements and market applications.
• Table 8. Solid-state cooling technology readiness levels and commercialisation milestones.
• Table 9. The cooling toolkit by mode, with leading solid-state tools in bold.
• Table 10. Best passive solid-state cooling technologies for reducing temperature by 5-40 °C, 2027-2047 (Future Markets assessment).
• Table 11. Best active solid-state cooling technologies for reducing temperature by 5-50 °C, 2027-2047 (Future Markets assessment).
• Table 12. Approximate number of companies commercialising solid-state cooling, by technology (2026).
• Table 13. Application-specific market sizing, 2027, 2032 and 2037 (US$ millions).
• Table 14. Customer needs and adoption barriers by segment.
• Table 15. Temperature range segmentation and application mapping.
• Table 16. Market share by technology, 2027, 2032 and 2037.
• Table 17. Key player positioning: established manufacturers vs innovation-driven start-ups.
• Table 18. Technology differentiation strategies and competitive advantages.
• Table 19. LED cooling: technology performance advantages over conventional Peltier and cryogenic systems.
• Table 20. Selected funding rounds in solid-state and novel cooling, 2022-2026.
• Table 21. Public funding pathways relevant to LED and other emerging solid-state cooling technologies.
• Table 22. Key indicators of global cooling demand.
• Table 23. Principal problems with vapour-compression cooling and the solid-state response.
• Table 24. AI accelerator and rack power trajectory.
• Table 25. Emerging cooling problems in electronics and ICT and solid-state responses.
• Table 26. Kigali Amendment HFC phase-down schedule (reduction versus baseline).
• Table 27. Selected EU F-gas Regulation 2024/573 product restrictions.
• Table 28. Selected public funding programmes for solid-state cooling.
• Table 29. Solid-state cooling operating principles compared (part 1: performance).
• Table 30. Solid-state cooling operating principles compared (part 2: practicality).
• Table 31. Undesirable materials widely used in cooling and possible substitutes.
• Table 32. Caloric effects compared by type.
• Table 33. Attention versus maturity by technology, 2027, 2037 and 2047.
• Table 34. Scope of analysis: inclusions and exclusions.
• Table 35. Representative value chain participants by stage.
• Table 36. Competing cooling technologies compared with solid-state cooling.
• Table 37. Technologies covered in Section 3: maturity and Future Markets forecast.
• Table 38. Thermoelectric cooling: market penetration indicators, 2026.
• Table 39. Thermoelectric metrics: what they tell, and where they mislead.
• Table 40. Thermoelectric materials for near-room-temperature cooling: comparison.
• Table 41. Lower-cost and lower-toxicity thermoelectric material routes.
• Table 42. Spin-driven and quasiparticle thermoelectric effects: comparison.
• Table 43. Theoretical maximum COP of single-stage thermoelectric coolers vs temperature lift (hot side 300 K).
• Table 44. Thermoelectric cooler performance characteristics and limitations.
• Table 45. Thermoelectric cooling applications and their requirements.
• Table 46. Approaches to wide-area and flexible thermoelectric cooling.
• Table 47. Flexible and wide-area thermoelectric cooling: state of the art, 2026.
• Table 48. Flexible, wide-area, wearable, printed and fibre thermoelectric research: 33 examples, 2019-2026.
• Table 49. Hot-side heat-removal solutions for thermoelectric coolers and generators.
• Table 50. Selected advances in thermoelectric cooling, 2024-2026.
• Table 51. Thermoelectric (Peltier) module, assembly and product manufacturers: 71 companies.
• Table 52. Thermoelectric (Peltier) modules and assemblies: market forecast, 2026-2037 (US$ millions).
• Table 53. Magnetocaloric materials for near-room-temperature cooling.
• Table 54. Magnetocaloric cooling performance vs conventional systems.
• Table 55. Magnetocaloric cooling: commercial and pre-commercial activity.
• Table 56. Magnetocaloric cooling: advantages and challenges.
• Table 57. Magnetocaloric system supply chain: materials and risk.
• Table 58. Magnetocaloric systems: market forecast, 2026-2037 (US$ millions).
• Table 59. Electrocaloric materials and performance characteristics.
• Table 60. Electrocaloric effect temperature changes by material type.
• Table 61. Comparison of ceramic and polymer electrocaloric routes.
• Table 62. Approximate share of electrocaloric research focus by material family, 2023-2026.
• Table 63. Milestones in giant electrocaloric materials and devices, 2006-2025.
• Table 64. Key electrocaloric technical issues and mitigation routes.
• Table 65. Electrocaloric research and development activity, 2025-2026.
• Table 66. Electrocaloric commercialisation stages and expected timing.
• Table 67. Electrocaloric application areas, fit and expected timing.
• Table 68. Barocaloric material families and characteristics.
• Table 69. Barocaloric developers and funded projects.
• Table 70. Comparison of caloric cooling technologies.
• Table 71. Elastocaloric material families and properties.
• Table 72. Tension versus compression loading in elastocaloric devices.
• Table 73. Elastocaloric performance characteristics and target applications.
• Table 74. Twistocaloric fibre materials.
• Table 75. Phase-change based cooling technologies compared.
• Table 76. Oriented composite PCM approaches for electronics and battery thermal management.
• Table 77. Multicaloric materials and coupled-field approaches.
• Table 78. Hybrid and convergent solid-state cooling architectures.
• Table 79. Caloric cooling market by technology, 2027-2037 (US$ millions).
• Table 80. Companies commercialising caloric cooling.
• Table 81. LED cooling performance parameters and specifications.
• Table 82. GaAs LED performance characteristics for cooling applications.
• Table 83. LED cooling vs thermoelectric cooling performance comparison.
• Table 84. LED and thermophotonic cooling: technology readiness and key research groups.
• Table 85. Indicative cost per watt of cooling by technology at cryogenic and deep-cooling temperatures.
• Table 86. Cooling technologies by operating temperature range and fit with LED cooling targets.
• Table 87. Beachhead applications for LED-based cooling.
• Table 88. LED / optical / thermionic cooling segment: 2037 penetration scenarios.
• Table 89. Competitive positioning of LED cooling within solid-state and adjacent cooling technologies.
• Table 90. Unique value propositions of LED cooling by application domain.
• Table 91. Cost competitiveness of LED cooling vs magnetocaloric and Stirling coolers for small cryogenic loads.
• Table 92. Funding instruments and partnering routes for LED / thermophotonic cooling.
• Table 93. Optical refrigeration of solids: materials and milestones.
• Table 94. Phonon engineering approaches relevant to solid-state cooling.
• Table 95. Quantum dot cooling approaches and research status.
• Table 96. Photonic and metamaterial approaches to cooling and thermal management.
• Table 97. Electron emission cooling mechanisms.
• Table 98. Thermionic cooling commercialisation timeline (Future Markets assessment).
• Table 99. PDRC material families: performance, cost and commercial popularity.
• Table 100. PDRC applications, benefits and adoption status.
• Table 101. Solid-state airflow products: key specifications (company data).
• Table 102. Solid-state airflow vs conventional thermal solutions in compact electronics.
• Table 103. Solid-state airflow applications and adoption timing.
• Table 104. Solid-state airflow market build: indicative units and ASP logic.
• Table 105. Quantum cooling requirements by application.
• Table 106. Comparison of ADR system configurations.
• Table 107. Paramagnetic cooling media for ADR stages.
• Table 108. ADR applications and use cases in quantum technologies.
• Table 109. Helium-3 supply, demand and pricing indicators.
• Table 110. Magnetic and electronic refrigeration methods below 1 K.
• Table 111. Quantum device operating temperature requirements.
• Table 112. Josephson junction cooling applications.
• Table 113. Indicative dilution refrigerator stage temperatures and cooling budgets.
• Table 114. Cryogenic wiring, signal-chain and cryo-CMOS suppliers reducing qubit heat load.
• Table 115. Dilution refrigerator and millikelvin platform suppliers.
• Table 116. Quantum sensor cooling and thermal management requirements.
• Table 117. Optical quantum device cooling challenges.
• Table 118. Future Markets forecast: quantum-relevant solid-state cooling segments (US$ millions).
• Table 119. Cryogenic platform suppliers relevant to quantum technologies.
• Table 120. Performance benchmarking matrix across all technologies.
• Table 121. Cost competitiveness analysis by application segment.
• Table 122. Application suitability mapping by temperature range.
• Table 123. Technology readiness levels and commercialisation status by technology.
• Table 124. Quantum technology integration capabilities by solid-state cooling segment.
• Table 125. Winning materials and principles for solid-state cooling.
• Table 126. Key modelling assumptions by technology.
• Table 127. Global advanced solid-state cooling market size, 2023-2037 (US$ millions).
• Table 128. Global advanced solid-state cooling market by technology, 2023-2026 (US$ millions).
• Table 129. Global advanced solid-state cooling market by technology, 2027-2037 (US$ millions).
• Table 130. Market share by technology, 2027, 2032 and 2037.
• Table 131. Price-performance evolution by technology type.
• Table 132. Global advanced solid-state cooling market by region, 2027-2037 (US$ millions).
• Table 133. Regional growth drivers and leading activity.
• Table 134. Market drivers and growth catalysts.
• Table 135. Market restraints and risks.
• Table 136. Global advanced solid-state cooling market by operating temperature segment, 2027-2037 (US$ millions).
• Table 137. Cryogenic applications (sub-100 K) and solid-state cooling options.
• Table 138. Ultra-low temperature applications (100-150 K).
• Table 139. Moderate cooling applications (>150 K) by technology fit.
• Table 140. Global advanced solid-state cooling market by end-use market, 2023-2026 (US$ millions).
• Table 141. Global advanced solid-state cooling market by end-use market, 2027-2037 (US$ millions).
• Table 142. Market share by end-use market, 2027, 2032 and 2037.
• Table 143. Semiconductor sensor solid-state cooling.
• Table 144. Consumer electronics solid-state thermal management.
• Table 145. Solid-state cooling roles in data centres.
• Table 146. Automotive solid-state cooling applications.
• Table 147. Market scenarios, 2032 and 2037 (US$ millions, constant 2026 US$).
• Table 148. Performance requirements by application.
• Table 149. Cost sensitivity and value drivers by end-use market.
• Table 150. Technology adoption criteria and decision factors.
• Table 151. Selected private funding rounds in solid-state and advanced cooling, 2021-2026.
• Table 152. Selected corporate investments and M&A in cooling technology.
• Table 153. Selected government and EU funding for solid-state cooling.
• Table 154. Companies profiled by technology category.
• Table 155. Forecasting approach by technology segment.

List of Figures

• Figure 1. Global advanced solid-state cooling market size, 2023-2037 (US$ millions).
• Figure 2. Solid-state cooling commercialisation timelines by technology, 2024-2040.
• Figure 3. Solid-state cooling overall: SWOT analysis.
• Figure 4. Solid-state cooling value chain.
• Figure 5. Principal drivers of new cooling demand: AI chip power, air-conditioner growth, 6G, batteries and solar heat.
• Figure 6. Solid-state cooling technology milestones, 1834-2032.
• Figure 7. Global advanced solid-state cooling market, 2023-2037 (US$ millions).
• Figure 8. Technology share of the advanced solid-state cooling market, 2027-2037.
• Figure 9. Advanced solid-state cooling value chain.
• Figure 10. Operation of a thermoelectric (Peltier) module: n- and p-type legs between ceramic plates pump heat from the cold side to the hot side when current flows.
• Figure 11. Thermoelectric energy harvesting (TEG) as a power source for solid-state cooling: SWOT analysis.
• Figure 12. Thermoelectric (Peltier) cooling: SWOT analysis.
• Figure 13. Magnetocaloric refrigeration cycle: adiabatic magnetisation, heat rejection, adiabatic demagnetisation and heat absorption in an active magnetic regenerator.
• Figure 14. Magnetocaloric cooling: SWOT analysis.
• Figure 15. Electrocaloric cooling: SWOT analysis.
• Figure 16. Electrocaloric cooling cycle: polarisation, heat rejection, depolarisation and heat absorption.
• Figure 17. Electrocaloric cooling commercialisation timeline.
• Figure 18. Low-pressure barocaloric system: solid refrigerant beds cycled by a gas compressor with secondary-fluid heat transfer.
• Figure 19. Barocaloric cooling: SWOT analysis.
• Figure 20. Elastocaloric cooling cycle: loading, heat rejection, unloading and heat absorption.
• Figure 21. Elastocaloric cooling: SWOT analysis.
• Figure 22. Twistocaloric cooling: SWOT analysis.
• Figure 23. Multicaloric and solid-state heat pumps: SWOT analysis.
• Figure 24. Caloric cooling market by technology, 2026-2037 (US$ millions).
• Figure 25. Principle of electroluminescent (LED) and thermophotonic cooling: photons emitted with energy above qV carry heat from the cold LED to a remote absorber or photovoltaic cell.
• Figure 26. LED thermophotonic cooling: SWOT analysis.
• Figure 27. Anti-Stokes fluorescence cooling: SWOT analysis.
• Figure 28. Phononic cooling: SWOT analysis.
• Figure 29. Quantum dot cooling: SWOT analysis.
• Figure 30. Thermal metamaterials: SWOT analysis.
• Figure 31. Advanced thermionic cooling: research milestones and commercialisation timeline.
• Figure 32. Advanced thermionic cooling: SWOT analysis.
• Figure 33. Passive daytime radiative cooling: high solar reflectance combined with thermal emission through the 8-13 µm atmospheric window.
• Figure 34. Janus thermal management: SWOT analysis.
• Figure 35. Passive radiative cooling: SWOT analysis.
• Figure 36. Solid-state airflow principles: piezoelectric MEMS jets, ionic wind (EHD) and dielectric barrier discharge plasma actuators.
• Figure 37. Solid-state airflow: SWOT analysis.
• Figure 38. Adiabatic demagnetisation refrigeration: magnetisation, isolation, demagnetisation and hold steps.
• Figure 39. Continuous ADR (cADR) architecture: staggered stages with heat switches provide uninterrupted cooling at the cold stage.
• Figure 40. Solid-state cryogenic cooling (ADR / cADR): SWOT analysis.
• Figure 41. Application suitability of cooling technologies by operating temperature range.
• Figure 42. Commercialisation timelines by solid-state cooling technology, 2024-2040.
• Figure 43. Solid-state cooling technology roadmap 2027-2037 by end market.
• Figure 44. Global advanced solid-state cooling market, 2023-2037 (US$ millions, constant 2026 US$).
• Figure 45. Global advanced solid-state cooling market by technology, 2027-2037 (US$ millions).
• Figure 46. Market share by technology, 2027, 2032 and 2037.
• Figure 47. Solid-state cooling revenues by technology on a logarithmic scale, 2023-2037 (US$ millions).
• Figure 48. Global advanced solid-state cooling market by region, 2027-2037 (US$ millions).
• Figure 49. Cooling demand drivers: AI chip power, air-conditioning growth, 6G and climate.
• Figure 50. Global advanced solid-state cooling market by end-use market, 2027-2037 (US$ millions).
• Figure 51. Solid-state cooling application sizing, 2027 versus 2037 (US$ millions).